The 8th Int'l Conference on Microwave and Terahertz Technology (ICMTT 2025)

Website https://www.academicx.org/ICMTT/2025/ | Edit Freely

Category Microwave;Terahertz

Deadline: December 04, 2024 | Date: January 04, 2025-January 06, 2025

Venue/Country: Sanya, China

Updated: 2024-04-25 16:37:52 (GMT+9)

Call For Papers - CFP

Website：https://www.academicx.org/ICMTT/2025/

Date：January 4-6, 2025

Venue： Sanya, China

The 8th Int'l Conference on Microwave and Terahertz Technology (ICMTT 2025) will be held in Sanya, China on January 4-6, 2025. This conference will cover issues on microwave and terahertz technology. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods.

Sanya is superior in geography climate and natural resources. It is known as “the oriental Hawaii" and “Sunshine City” because of its special tropical scenes as well as its attractive nature. Sanya's tourist resources, richly endowed by nature, are not only special in China, but also rare in the world. It is a most fashionable place where tropical marine tourist resources are closely concentrated and lovers of swimming can enjoy their holidays in winter. Within the city, well-known tourist spots are dotted everywhere--the national Yalong Tourist Area, the Tianyahaijiao, the Great Eastern Sea, the Luhuitou Peninsula, Sanya Bay and the Luobi Grotto. Besides these, there remain the ancient Yazhou City and relics and a sculpture of the Monk Jianzhen of the Tang Dynasty, who landed ashore to avoid the storm when he was sailing eastwards to Japan.

Attendance Methods

1. Full Paper submission

Submit full paper ( Regular Attendance + Paper Publication + Presentation )

You are invited to submit papers and participate in our academic exchange. One author will be invited to make an oral presentation and the paper will be published by peer-reviewed open access journal and submitted to CNKI and Google Scholar for indexing.

2.Abstract submission

Submit abstract ( Regular Attendance + Abstract + Presentation )

You are welcome to submit abstract for oral presentation or poster presentation.

3.Regular Attendance ( No Submission Required )

You're also welcome to attend our conference (without submitting full paper or abstract).

Publication and Presentation

Publication: All the accepted papers will be published by a peer-reviewed open access journal that can ensure the widest dissemination of your published work. For more information, please contact us (editor1academicx.org).

Note:1. If you want to present your research results but do NOT wish to publish a paper, you may simply submit an Abstract to our Registration System.

2. Please click Template for Manuscripts (below the Registration button at the top left corner) to download the Full Paper template and prepare your article according to it. The full length of one paper is suggested to be about 15 pages (within the template format with all tables, figures and references). If your paper is over 20 pages, you will be kindly requested to pay for extra pages fees.

3. The simple Abstract submission should include the title, contents, keywords, authors names, affiliations and emails. The length is suggested to be controlled within 1 page and no more than 2 pages.

4. You will receive the review results within 3-5 working days after submission. If you do not get any notification within the time limit, please contact us as soon as possible.

5. You are welcome to submit papers in Chinese and please contact us for more details.

Contact Us

Email: editor1academicx.org

Whatsapp: 0086 13264702250

Tel: +86 132 6470 2250

QQ: 1349406763

WeChat: 3025797047

Official Account: Academic Communications

Topics: The conference is soliciting state-of-the-art research papers in the following areas of interest:

Microwave Field and Techniques

Field Analysis and Guided Waves

Frequency-Domain EM Analysis Techniques

Time-Domain EM Analysis Techniques

CAD Algorithms and Techniques

Linear Device Modeling

Nonlinear Device Modeling

Nonlinear Circuit and System Simulation

Microwave Passive Components

Transmission Line Elements

Passive Circuit Elements

Planar Passive Filters and Multiplexers

Non-planar Passive Filters and Multiplexers

Active, Tunable and Integrated Filters

Ferroelectric, Ferrite and Acoustic Wave Components

MEMS Components and Technologies

Microwave Active Components

Semiconductor Devices and Monolithic ICs

Signal Generation

Frequency Conversion and Control

HF, VHF and UHF Technologies and Applications

Power Amplifier Devices and Circuits

High-Power Amplifiers

Low Noise Components and Receivers

Mm-Wave and THz Components and Technologies

Microwave Systems and Applications

Microwave Photonics

Mixed Mode and Digital Signal Processing Circuits and Systems

Packaging, Interconnects, MCMs and Integration

Instrumentation and Measurement Techniques

Biological Effects and Medical Applications

Arrays as Antennas and Power Combiners

Radar and Broadband Communication Systems

Wireless and Cellular Communication Systems

Sensors and Sensor Systems

RFID Technologies

High Power Microwave Industrial Applications

Emerging Technical Areas of Microwave

RF Nanotechnology

Wireless Power Transmission

New Technologies and Applications

Innovative Systems

Microwave/RF Devices for Wireless Health Care Applications

Terahertz Theory and Technology

Terahertz Devices: Electronics/Photonics/Plasmonics

Terahertz Generation, Propagation, and Interaction

Passive Components and Materials Issues in Terahertz

Terahertz Imaging

Terahertz Sources, Detectors and Receivers

Terahertz System Architectures and Distributed Networks

Terahertz Diagnostics

Terahertz Nanoelectronics

Terahertz Spectroscopy

Terahertz Systems

Advanced Materials and Concepts (E.G., Metamaterials, Memristor)

Novel Concepts (E.G., Plasmonic THz, Quantum Cascade Lasers)

Terahertz to Optical Metamaterials, Assemblies, and Systems

New Frontiers and Recent Breakthroughs in Terahertz Research

Novel Applications of Terahertz

VLSI Trustworthiness and Inspection – Counterfeit IC Detection

Industrial Inspection

Security and Military

Biomedical

Information Processing and Computing

Electronics/Information/Communication Systems

Integration of Advanced Materials with Conventional Devices and Systems