EPEPS 2013 - 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Website www.epeps.org |
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Category EPEPS 2013
Deadline: July 16, 2013 | Date: October 27, 2013-October 30, 2013
Venue/Country: Austin, U.S.A
Updated: 2012-01-09 21:04:59 (GMT+9)
Call For Papers - CFP
The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. The goal is to be the leading conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal IntegrityKeywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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