ICTEM 2014 - 2014 4th International Conference on Textile Engineering and Materials (ICTEM 2014)
Website WWW.ICTEM.ORG |
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Category Textile;Materials;materials;mechanical;manufacturing;computer;information;measurement;instrumentation;automation;
Deadline: August 23, 2014 | Date: August 24, 2014-August 25, 2014
Venue/Country: Shenzhen, China, China
Updated: 2014-05-30 12:51:59 (GMT+9)
Call For Papers - CFP
ICTEM series provides a forum for accessing to the most up-to-date and authoritative knowledge from both industrial and academic worlds, sharing best practice in the field of Textile Engineering, Materials Science and Engineering. A key aspect of this conference is the strong mixture of academia and industry. This allows for the free exchange of ideas and challenges faced by these two key stakeholders and encourage future collaboration between members of these groups. After the very successful previous issues ICTEM'2011 (Tianjin, China) , ICTEM'2012 (Changsha, China) and ICTEM'2013 (Dalian, China), the 2014 4th International Conference on Textile Engineering and Materials (ICTEM 2014) will take place in Shenzhen, China, on August 23-24, 2014. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.In the previous three issues, All accepted papers were published on "Advanced Materials Research" journal and had been indexed into EI Compendex, Thomson ISTP and Elsevier SCOPUS databases . (For Examples: ICTEM2013, ICTEM2012, ICTEM2011)All accepted papers from ICTEM '2014 will also be published on international journal Advanced Materials Research (See TTP's Conference List) and will be indexed in EI Compendex, Thomson ISTP and Elsevier SCOPUS databases. Trans Tech Publications will provide online camera-ready paper submission system to save time and decrease the publishing cycle. Selected excellent papers will be published on international reputation journals.Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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