CMMSE- 2015 - International Conference on Chemical, Metallurgy and Material Science Engineering
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Website http://cmmse.eacbee.org/ |
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Category Chemical;Metallurgy;Material Science Engineering
Deadline: March 09, 2015 | Date: August 10, 2015-August 11, 2015
Venue/Country: Pattaya, Thailand
Updated: 2015-02-10 16:57:23 (GMT+9)
Call For Papers - CFP
Pattaya, Thailand August 10-11, 2015Deadline of New Full Paper/Poster/Abstract Submissions: March 9, 2015The aim objective of International Conference on Chemical, Metallurgy and Material Science Engineering (CMMSE-2015) is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Chemical, Metallurgy and Material Science Engineering. The conference will be held in Pattaya, Thailand during August 10-11, 2015. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. The conference is sponsored by Emirates Research Publishing (ERPUB) and Emirates Association of Chemical, Biological & Environment Engineers. All the submitted conference papers will be peer reviewed by the program/technical committees of the Conference. The Proceedings of the Conference will be published by Emirates Research Publishing (ERPUB) and will be will be archived in ERPUB's Digital Library. Each Paper will be assigned Digital Object Identifier (DOI) from CROSSREF. The papers will be published in the hardcopy of Proceedings as well as conference CD with ISBN number and the same will be provided at the time of the conference. Later, the Proceedings of the conferences will be submitted to ISI Thomson/SCOPUS for review and possible indexing. In addition the proceedings will be indexed at Google and Google Scholar google.com and all major search engines.One Excellent Paper will be selected from each oral session. The Certificate for Excellent Papers will be awarded after each session of the conferenceSUBMISSION METHODS1. Electronic Submission System; ( .doc/.docx/.pdf formats) 2. Email: edeacbee.orgThe template can be downloaded using the link: Conference Paper Template DOWNLOAD (.doc)Prospective authors are kindly invited to submit full text papers including results, tables, figures and references. Full text papers (.docx, .doc, .pdf) will be accepted by Electronic Submission System. Any question, please contact: edeacbee.org. All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the Conference should meet these criteria and must not be under consideration for publication elsewhere. Manuscripts should follow the style of the Conference and are subject to both review and editing.CONTACT USMs. Alissa Matthew Email: edeacbee.orgUAE Mobile: +971528299493 (Can use LINE, Whatsapp, Viber)IND Mobile: +918699350603Skype ID: erpub.orgCONFERENCE VENUEMercure Pattaya Ocean ResortSai 2, Pattaya, Chon Buri 20260, ThailandPhone:+66 2 659 2828http://www.mercure.com/gb/hotel-8889-mercure-pattaya-ocean-resort/index.shtmlPublication Ethics - Penalty against PlagiarismWe firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally unacceptable academic misconduct and cannot be tolerated.Call for PapersIn this International Conference on Chemical, Metallurgy and Material Science Engineering (CMMSE) the topics of interest for submission include, but are not limited to:Chemical EngineeringChemistryMetallurgical EngineeringPolymersMaterials ScienceMicrostructural Evolution in MaterialsElectronic, Optical, and Magnetic Properties of MaterialsMechanical Properties of MaterialsMaterials ProcessingCeramicsMetalsBiological MaterialsElectronic and Photonic MaterialsMagnetic MaterialsSemiconductors
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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