IMECS 2016 - International MultiConference of Engineers and Computer Scientists (IMECS 2016)

Website http://www.iaeng.org/IMECS2016 | Edit Freely

Category IMECS 2016

Deadline: December 08, 2015 | Date: March 16, 2016-March 18, 2016

Venue/Country: Hong Kong, Hong Kong

Updated: 2015-08-04 22:52:00 (GMT+9)

Call For Papers - CFP

Draft Manuscript submission deadline: 8 December, 2015

Camera-Ready papers & registration deadline: 10 January, 2016

IMECS 2016: Hong Kong, 16-18 March, 2016

http://www.iaeng.org/IMECS2016

The IMECS 2016 is organized by the International Association of Engineers (IAENG), a non-profit international association for the engineers and the computer scientists. The conference has the focus on the frontier topics in the theoretical and applied engineering and computer science subjects. The IMECS conferences serve as good platforms for our members and the entire engineering community to meet with each other and to exchange ideas. Our IMECS committees have been formed with over three hundred committees members who are mainly research center heads, faculty deans, department heads, professors, and research scientists from over 30 countries. The last IAENG conference has attracted more than eight hundred participants from over 50 countries.

All submitted papers will be under peer review and accepted papers will be published in the conference proceeding (ISBN: 978-988-19253-8-1). Revised and expanded version of the selected papers may be included as book chapters in the standalone edited books under the framework of cooperation between IAENG and publishers like Springer. The abstracts will be indexed and available at major academic databases. The accepted papers will also be considered for publication in the special issues of the journal Engineering Letters, in IAENG journals and in edited books. For reference, the recent IAENG post conference edited books include titles like for example: Trends in Intelligent Systems and Computer Engineering, Advances in Communication Systems and Electrical Engineering, Advances in Industrial Engineering and Operations Research, and IAENG Transactions on Engineering Technologies by Springer etc.

The IMECS 2016 is composed of the following 14 conferences (all will be held at the same location and date):

ICAIA 16

The 2016 IAENG International Conference on Artificial Intelligence and Applications

ICB 16

The 2016 IAENG International Conference on Bioinformatics

ICCA 16

The 2016 IAENG International Conference on Control and Automation

ICCS 16

The 2016 IAENG International Conference on Computer Science

ICCSA 16

The 2016 IAENG International Conference on Communication Systems and Applications

ICDMA 16

The 2016 IAENG International Conference on Data Mining and Applications

ICEE 16

The 2016 IAENG International Conference on Electrical Engineering

ICEP 16

The 2016 IAENG International Conference on Engineering Physics

ICIE 16

The 2016 IAENG International Conference on Imaging Engineering

ICINDE 16

The 2016 IAENG International Conference on Industrial Engineering

ICICWS 16

The 2016 IAENG International Conference on Internet Computing and Web Services

ICOR 16

The 2016 IAENG International Conference on Operations Research

ICSC 16

The 2016 IAENG International Conference on Scientific Computing

ICSE 16

The 2016 IAENG International Conference on Software Engineering

Submission:

IMECS 2016 is now accepting manuscript submissions. Prospective authors are invited to submit their draft paper in full paper (any appropriate style) to imecs{at}iaeng.org. The submitted file can be in MS Word format, PS format, or PDF formats.

The first page of the draft paper should include:

(1) Title of the paper;

(2) Name, affiliation and e-mail address for each author;

(3) A maximum of 5 keywords of the paper.

Also, the name of the conference that the paper is being submitted to should be stated in the email.

It is our target that the reviewing process and the result notification for each submitted manuscript can be completed within one month from its submission. The reviewing process is to ensure the quality of the accepted papers in the conference.

IMECS MultiConference Co-chairs

Prof. Craig Douglas (honorary co-chair)

School of Energy Resources Distinguished Professor, Departments of Mathematics &

Director, Institute for Scientific Computation, University of Wyoming, USA

Visiting Professor and Associate Director, Center for Numerical Porous Media Methods

King Abdullah University of Science & Technology, Saudi Arabia &

Former Senior Research Scientist (corresponding to nonteaching full professor),

Computer Science Department, Yale University, USA

Prof. David Dagan Feng (honorary co-chair)

Professor and Head, School of Information Technologies,

University of Sydney, Australia

Prof. Alexander M. Korsunsky (honorary co-chair)

Professor of Engineering Science

Fellow and Former Dean, Trinity College

Department of Engineering Science, University of Oxford, UK

Prof. Ping-kong Alexander Wai (honorary co-chair)

Vice President and Chair Professor of Optical Communications

Hong Kong Polytechnic University, Hong Kong

Prof. Oscar Castillo

Professor and Research Director of Computer Science

Tijuana Institute of Technology, Mexico

Former Adjunct Professor of San Diego State University, USA

President of HAFSA (Hispanic American Fuzzy Systems Association)

Vice-Chair of the Mexican Chapter of the Computational Intelligence Society (IEEE)

Prof. Jeong-A Lee

Professor of Department of Computer Engineering

Chosun University, South Korea

More details about the IMECS 2016 can be found at:

http://www.iaeng.org/IMECS2016/index.html

More details about the International Association of Engineers, and the IAENG International Journal of Computer Science, and the IAENG International Journal of Applied Mathematics can be found at:

http://www.iaeng.org/about_IAENG.html

http://www.iaeng.org/IJCS/index.html

http://www.iaeng.org/IJAM/index.html

The official journal web site of Engineering Letters at:

http://www.engineeringletters.com

http://www.engineeringletters.net

http://www.engineeringletter.com