TFTA 2018 - The 4th Int'l Conference on Thin Film Technology and Applications (TFTA 2018)
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Website http://www.engii.org/conference/TFTA2018/ |
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Category material, thin film
Deadline: September 05, 2017 | Date: January 13, 2018-January 15, 2018
Venue/Country: Sanya, China
Updated: 2017-04-24 18:14:19 (GMT+9)
Call For Papers - CFP
无标题文档The 4th Int’l Conference on Thin Film Technology and Applications (TFTA 2018) will be held in Sanya, China during January 13-15, 2018. TFTA is an annual regular conference since 2015 and has been successfully held in Shanghai, China and Bangkok, Thailand. TFTA 2018 will be a valuable and important platform for inspiring Int’l and interdisciplinary exchange at the forefront of Thin Film Technology and Applications. You can submit your papers or abstracts through paper submission. Publication and PresentationAll the accepted papers will be published by "Journal of Materials Science and Chemical Engineering" (ISSN: 2327-6045), a peer-reviewed open access journal that can ensure the widest dissemination of your published work.You're welcome to submit abstracts for presentation. The abstracts are only used for an oral presentation and will not be published in the conference journal.Call for Papers Topics: The conference is soliciting state-of-the-art research papers in the following areas of interest: Thin film materials Ferroelectric film Magnetic film Organic and polymer film Bioengineering film Semiconductor and Superconductor film Materials of Optical Coating Graphene Technology of thin film Deposition, epitaxy and coating Sol-gel and LB technology Device and integration Micro/Nano-fabrication Surface treatment and Interface control Characterization Applications of thin film Micro/Nano-electronics and MEMS Optoelectronics and Photonics Information Storage Display and Sensor Solar cell/LED EUV-Soft-X-ray multilayers Laser Resistant coatingsContact UsConference Seceraty: Ms. Vivian Email: engii_service163.comTel: +86 132 6470 2250QQ: 3025797047WeChat: Engii_hw
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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