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    ISCME 2017 - 2017 2nd International Seminar on Computer Technology, Mechanical and Electrical Engineering (ISCME 2017)

    View: 1887

    Website http://iscme.org/ | Want to Edit it Edit Freely

    Category Electrical engineering;Mechanical Engineering;Computer technology;Other related fields

    Deadline: August 22, 2017 | Date: September 22, 2017-September 24, 2017

    Venue/Country: Zhuhai,Guangdong, China

    Updated: 2017-06-16 10:13:07 (GMT+9)

    Call For Papers - CFP

    Welcome to 2017 2nd International Seminar on Computer Technology, Mechanical and Electrical Engineering (ISCME 2017). ISCME 2017 will be held on September 22-24, 2017 in Zhuhai,China

    The aim of ISCME 2017 is to provide a platform for researchers, engineers, academicians, as well as industrial professionals, to present their research results and development activities in computer technology, mechanical and electrical engineering. It provides opportunities for the delegates to exchange new ideas and application experiences, to establish business or research relations and to find global partners for future collaboration.

    All submissions to the ISCME 2017 will be sent to at least two reviewers and evaluated based on originality, technical and research content, relevance to conference, contributions, and readability. The full paper submissions will be chosen based on technical merit, interest, applicability, and how well they fit a coherent and balanced technical program.

    本会议是AEIC学术交流资讯中心系列会议,均已经在科学网和中国知网发布。更多AEIC学术交流资讯中心系列会议,请打开AEIC官网。

    【Publication】

    All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of ISCME 2017 will be published by Aussino Academic Publishing House, which will be indexed by EI Compendex and CPCI.

    所有的投稿都必须经过出版社的直接审稿,经过严格的审稿之后,最终所有录用的论文将由澳大利亚Aussino Academic Publishing House出版,见刊后被EI和ISTP检索,目前该出版社的EI和ISTP检索非常稳定,请各位放心投稿!

    【Call For Papers】

    T1: Electrical Engineering

    Software Specification

    Software Assurance

    Analysis of Power Quality and System Stability

    Assembly and Packaging

    Analog Circuits and Digital Circuits

    Antenna and Propagation

    Battery Management System

    Circuits and Electronics

    Computer Relaying

    Electric Energy Processing

    Electromagnetic and Photonics

    Electro-optical Phenomena of Semiconductors

    Integrated Optics and Electro-optics Devices

    Microwave Theory and Techniques

    Microwave and millimeter circuit and Antenna

    Modulation, Coding, and Channel Analysis

    Power Electronics

    Power IC

    Remote Control and Techniques of GPS

    Robotics and Atomization Engineering

    Signal Integrity Design for High-Speed Digital Systems

    Signal Processing

    Simulation of Propagation

    Smart Grid

    Solar Power Generation

    Techniques of Laser and Applications Of Electro-optics

    Wind Power Generation

    T2: Mechanical Engineering

    Mechanical Dynamics and Vibration

    Mechanical Strength

    Mechanical Friction, Wear and Lubrication

    Mechanical Design

    Rolling

    Casting Technology and Equipment

    Welding Technology and Equipment

    Plastic Processing Technology and Equipment

    Heat treatment technology and Equipment

    Cutting Technology and Equipment

    Special Processing Technology and Equipment

    The Machine Assembly Process

    Non-metallic Processing

    CNC Technology and Numerical Control Machines

    Fluid Power Transmission and Control

    Instrumentation

    Power Mechanical Engineering

    Vehicle Engineering

    Chemical Machinery and Equipment

    Textile Machinery and Equipment

    Food Machinery

    Agricultural Machinery Manufacturing

    Mining Machinery Engineering

    Metallurgical Machinery and Automation

    Construction Machinery and Equipment

    Aircraft Structure and Design

    Spacecraft Structure and Design

    Aircraft Manufacturing Technology

    T3: Computer Technology

    Algorithms

    Artificial Intelligence

    Automated Software Engineering

    Bioinformatics and Scientific Computing

    Computer-aided Design

    Computer Animation

    Computer Architecture

    Computing Ethics

    Computer Modeling

    Computer Networks

    Computer Security

    Computer Simulation

    Database and Data Mining

    Data Compression

    Data Encryption

    Data Mining

    Digital Signal and Image Processing

    Digital System and Logic Design

    Expert Systems

    Image Processing

    Information Systems

    Internet and Web Applications

    Mobile Computing

    Network Security and Cryptography

    Multimedia Applications

    Multimedia Networking

    Mobile Wireless Networks

    Programming Languages

    Wireless Communication

    Wireless Sensor Network

    【Contact:】

    Conference Secretary: Dr.Liu

    iscme2016atvip.163.com

    +86-15217204403/+86-020-29869162

    15217204403

    2573870267

    AEIC学术交流群: 526039541 (QQ)

    AEIC Website:www.keoaeic.org


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.