Sign for Notice Everyday    Sign Up| Sign In| Link| English|

Our Sponsors

    Receive Latest News

    Feedburner
    Share Us


    “Intelligence, Technology and Sustainability” International Forum on Exhibition Design 2017

    View: 1159

    Website | Want to Edit it Edit Freely

    Category

    Deadline: October 19, 2017 | Date: October 19, 2017-October 20, 2017

    Venue/Country: Shanghai, China

    Updated: 2017-07-26 11:11:10 (GMT+9)

    Call For Papers - CFP

    With the rapid development of the exhibition’s economy, every big city has various events, exhibitions and expos. Museums and galleries hold regular exhibitions that become ideal spaces for public entertainment. Since the 21st century, exhibition design has emphasised the importance of public visitors. Therefore, these trends change our understanding of the ways of displaying information and ideas of exhibition design. The development of technologies such as Augmented Reality, Interactive Multimedia Experience, Special Screen Project and Multi-Touch provides many possibilities for the mode of representation. Architects and artists are bringing an artistic spirit into the exhibition design. For the development of the nation and Shanghai’ economy as well as advancing the world’s top design discipline, Tongji University is leading the development of the Shanghai Design IV Summit Discipline along with Shanghai University of Engineering Science. Tongji University Shanghai International Design Creativity Institute and Shanghai University of Engineering Science will co-host an International Forum on Exhibition Design from October 19, 2017 to October 20, 2017. The forum aims to promote academic exchanges between exhibition design researchers and scholars both from China and overseas. It seeks to enhance interactivity and cooperation of design discipline, and foster further development of exhibition design. It will also promote a creative training approach and explore the potential of trans-system, multi-field academic cooperation.

    The following are the details of the conference:

    1. The theme:

    “Intelligence, Technology and Sustainability - The Future of Exhibition Design”

    Topics including, but not limited to:

    • Exhibition and Information Design

    • Green Exhibition Design and Sustainable Development

    • The Transformation of Social Aesthetic and Exhibition Art

    • Exhibition Design and Public Education

    • Sustainable Ideas of Exhibition Planning, Design and

    Management

    • Other related topics

    2. Call for paper:

    Preparation of Papers:

    Please note the following requirements:

    • Please provide a cover sheet with paper title, author, affiliation, phone, email and brief biographical sketch (100 words).

    • Papers should be related to the theme and topics of this forum and have certain academic values and directions, be highlighting theme, viewpoints and appropriate references.

    • Papers should not be published on other academic conferences. No plagiarism.

    • A4 size, Font Times New Roman, paper should be around 3000 to 5000 words including an abstract (200 words), references, footnote.

    • References refer to APA 6.

    • Please submit your cover sheet and the abstract to sueszcsjat126.com before August 31th, 2017. The committee will advise authors of the acceptance or otherwise.

    • Authors need to submit a full paper before September 28th, 2017.

    • All papers are reviewed by the convenor and will be recommended for publication if meeting the requirements of scholarship in the design field.

    3. Date and Location:

    • Date: October 19, 2017 to October 20, 2017 (Registration on October 19, 2017, Conference on October 20, 2017)

    • Location: 333, Longten Road, Songjiang District, Shanghai University of Engineering Science, Shanghai, China

    • Language: Chinese and English

    4. Registration

    • Early bird US$400 (until Friday 22 September 2017)

    • Full registration US$500

    • Student US$250

    5. Contact Details:

    Email: sueszcsjat126.com

    Sponsored by

    SHANGHAI DESIGN IV SUMMIT DISCIPLINE ACADEMIC COMMITTEE

    TONGJI UNIVERSITY SHANGHAI INTERNATIONAL DESIGN CREATIVITY INSTITUTE

    Organised by

    SHANGHAI UNIVERSITY OF ENGINEERING SCIENCE


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.