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IMAGE PROCESSING TSP 2018 - Monitoring and Control Based on Image Processing Special Session on 2018 41th International Conference on Telecommunications and Signal Processing (TSP) | IEEE R8 | IEEE Xplore® | SCOPUS

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Website http://tsp.vutbr.cz/?page_id=3754#SS2-18 | Edit Freely

Category Feature selection; Image processing; Real time control; Neural networks; Traffic control; Medical diagnostic systems; Assistive technologies; Quality control; Fractal analysis; Texture analysis; Parallel processing; Internet of Things; IoT; cloud computing

Deadline: March 19, 2018 | Date: July 04, 2018-July 06, 2018

Venue/Country: Athens, Greece

Updated: 2018-03-12 19:28:06 (GMT+9)

Call For Papers - CFP

*** SS2: Special Session on Monitoring and Control Based on Image Processing ***

*** http://tsp.vutbr.cz/documents/TSP2018_CfP_SS2_v4.pdf ***

2018 41st International Conference on Telecommunications and Signal Processing (TSP)

July 4-6, 2018, Athens, Greece

Web: http://tsp.vutbr.cz/

FINAL DEADLINE Extension for Full Paper Submission: March 19, 2018 @ 6PM CET

Technically co-sponsored by IEEE Region 8 (Europe, Middle East and Africa), IEEE Greece Section, IEEE Czechoslovakia Section, and IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter.

The TSP 2018 Proceedings, containing presented papers at the Conference, will be submitted for indexing to the IEEE Xplore® Digital Library registered under IEEE Conference Record #43564, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

Authors of the best rated and presented papers will be invited for publishing in special issues of international journals.

GENERAL INFORMATION:

Due to the ITC development, the intelligent image processing in domains like: industry, medicine, agriculture, environment, transportation and so on is now possible. As a consequence, the applications of complex image interpretation (e.g. texture and fractals) in mentioned domains needs interdisciplinary knowledge and effectively solve many problems encountered. Within the framework of the 2018 41st International Conference on Telecommunications and Signal Processing (TSP) held during July 4-6, 2018 in Athens, Greece, we invite the researchers and practitioners to present and discuss advances in the research and development of intelligent systems for complex image processing and interpretation, based on efficient feature selection in the field of diagnosis, monitoring and control. So, the goal of this special session is to bring together researchers, engineers and users in different domains which are engaged in resolving their problems by the aid of intelligent image processing algorithms. The interest for TSP Conference consists of the novelty of methods, techniques and algorithms for intelligent image processing proposed to solve difficult problems in the mentioned field. All session papers need to have a high scientific level and will be selected based on their relevance to the session topics. Topics of interest include, but not limited to, the following:

- Criteria for feature selection

- Image processing for real time control

- Neural networks for image processing

- Traffic control based on images

- Medical diagnostic systems based on complex image processing

- Assistive technologies based on image processing

- Quality control based on image processing

- Fractal analysis

- Texture analysis

- Parallel processing of images

- Image processing and Internet of Things

- Image processing and cloud computing

For more details please visit the Conference website at http://tsp.vutbr.cz/?page_id=3754#SS2-18 .

EDITORIAL BOARD:

- Prof.dr.ing. Dan Popescu - University POLITEHNICA of Bucharest, Romania (E-mail: dan.popescu@upb.ro)

- Dr. Loretta Ichim — University POLITEHNICA of Bucharest, Romania (E-mail: iloretta@yahoo.com)

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 3 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Certificate of Appreciation Plaque and an IEEE Student or IEEE Graduate Student membership for 2019.

ORGANIZERS:

The TSP 2018 is IEEE technically co-sponsored Conference organized in cooperation with seventeen universities:

- Brno University of Technology, Department of Telecommunications, Brno, Czech Republic

- Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary

- Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic

- Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey

- Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey

- Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey

- National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan

- Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan

- Slovak University of Technology, Institute of Telecommunications, Bratislava, Slovak Republic

- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain

- Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria

- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de Saint-Denis (LIASD), France

- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia

- University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia

- University of Patras, Physics Department, Patras, Greece

- VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic

- West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland

IMPORTANT DATES:

FINAL DEADLINE Extension for Full Paper Submission: March 19, 2018 @ 6PM CET

Notification of Paper Acceptance: April 15, 2018

Final Paper Submission: April 30, 2018

Authors' Early Registration and Payment: May 10, 2018

Authors' Late Registration and Payment: May 20, 2018

Listeners' Registration: July 4, 2018

Conference: July 4-6, 2018

CONTACTS:

Web: http://tsp.vutbr.cz/

E-mail: tsp@feec.vutbr.cz

Follow us on:

- Facebook https://www.facebook.com/tspconf/

- Twitter https://twitter.com/tspconf/

TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the Conference. However, this paper will be distributed as part of the Conference proceedings issued on an USB drive.


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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