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    AMME 2019 - 3rd International Conference on Advances in Materials, Machinery, Electronics (AMME 2019)

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    Website http://www.icamme.org/ | Want to Edit it Edit Freely

    Category 3rd International Conference on Advances in Materials, Machinery, Electronics (AMME 2019) ; AMME 2019;AIP Congerence Proceedings (ISSN: 0094-243X, E-ISSN: 1551-7616) ; CPCI (ISTP), Scopus (Elsevier), Inspec (IET) for indexing.

    Deadline: January 19, 2019 | Date: January 20, 2019-January 21, 2019

    Venue/Country: wuhan, China

    Updated: 2018-08-30 14:50:43 (GMT+9)

    Call For Papers - CFP

    3rd International Conference on Advances in Materials, Machinery, Electronics (AMME 2019)

    第三届材料,机械,电子进展国际会议 (AMME 2019)

    会议官网: http://www.icamme.org/

    国际会议期刊系列征文(Ei Compendex/ISI Proceedings科学技术会议录索引)

    http://www.ietr.vip/faq/viewtopic.php?f=2&t=7

    3rd International Conference on Advances in Materials, Machinery, Electronics (AMME 2019). AMME 2019 will be held on January 19-20, 2019 in Wuhan, China.

    The aims of the conference is to provide an interactive platform for the academicians, R & D organizations, industries, innovators, entrepreneurs, government agencies and policy-makers etc., from both China and abroad to exchange ideas on recent researches and advances in the domain of materials, machinery, electronics with its prospective application in the various interdisciplinary domains of engineering. This two day conference is being organized in technical association with Huazhong University of Science and Technology and will include invited keynote talks and oral paper presentations from both academia and industry to ignite our young minds, to initiate them in the field of meaningful research and thereby enrich their existing knowledge.

    All full paper submissions to the AMME 2019 must be written in English, and will be sent to at least two reviewers and evaluated based on originality, technical or research content, correctness, relevance to conference, contributions, and readability. The full paper submissions will be chosen based on technical merit, interest, applicability, and how well they fit a coherent and balanced technical program.

    Accepted papers which meet the conference requirements would be published in AIP Congerence Proceedings (ISSN: 0094-243X, E-ISSN: 1551-7616) (Not finalized) and submitted to the CPCI (ISTP), Scopus (Elsevier), Inspec (IET) for indexing.

    Materials

    Machinery

    Electronics

    Material properties

    Material processing

    Material molding

    Micro / Nano Materials

    Materials Physics and Chemistry

    Building Materials

    New Energy Materials

    Laser Processing Technology

    Surface Engineering/Coatings

    Composites

    Metal alloy Materials

    Optical/Electronic/Magnetic Materials

    Environmental Friendly Materials

    Smart and Intelligent Materials

    Other Relevant Topics

    Mechanical-electro-liquid System

    Powder Metallurgy/Casting/Sintering/Thermal Engineering/Welding

    High-speed/precision machining

    Advanced Manufacturing Technology

    CAD/CAM Integration Technology

    Computational Mechanics

    Precision Manufacturing & Measurement

    System Dynamics and Simulation

    Systems Science and Systems Engineering

    Mechanical Dynamics and Its Applications

    Mechanical Transmission Theory and Applications

    Mechanical Reliability Theory and Engineering

    Theory and Application of Friction and Wear

    Vibration, Noise Analysis and Control

    Dynamic Mechanical Analysis, Optimization and Control

    Structural Strength and Robustness

    Construction Machinery and Equipment

    Other Relevant Topics

    Semiconductor Devices

    Optical Networks & communication

    Digital signal processing

    Computer Applications

    Materials for Electrical and Electronic Devices

    Photovoltaic System & Applications

    Power Electronics Application

    Radio Frequency Applications

    Renewable Energy Applications

    Automation, Robotics & Humanoid

    Sensor technology & Virtual Instrumentation

    Signal & Image Processing Applications

    Soft computing / Nano computing/ Grid computing

    Embedded Systems and Robotics

    Remote sensing and satellite communication

    Other Relevant Topics

    国际会议期刊系列征文(Ei Compendex/ISI Proceedings科学技术会议录索引)

    http://www.ietr.vip/faq/viewtopic.php?f=2&t=7

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    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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