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2019 3rd International Conference on Design Engineering and Product Innovation (ICDEPI 2019)

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Website http://www.icdepi.org/ | Edit Freely

Category Design Engineering; Design Processes Design; Theory and Research Methodology

Deadline: January 10, 2019 | Date: July 05, 2019-July 07, 2019

Venue/Country: Shanghai, China

Updated: 2018-08-31 16:13:34 (GMT+9)

Call For Papers - CFP

Call for Papers

2019 3rd International Conference on Design Engineering and Product Innovation (ICDEPI 2018) is co-organized by Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Dalian, China from July 5-7, 2019!

The conference is an international forum for the presentation of technological advances and research results in the fields of Design Engineering and Product Innovation.

●Publication Information

1. All accepted and registered papers will be included in IOP Conference Series: Materials Science and Engineering,which will be indexed by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec, and other databases.

2.Selected papers with great extension will be recommended to publish in international journals.

●Topics(for more topics: http://www.icdepi.org/cfp.html )

Design Engineering

Design Processes

Design Theory and Research Methodology

Design Organization and Management

Product, Service and Systems Design

Design Information and Knowledge

Production Innovation

Product Development and Design

Product Process Design and Management

Product Quality Management

Intelligent Product

●Paper Submission

Submission Email:icdepi@smehk.org

Submission System: https://cmt3.research.microsoft.com/ICDEPI2019

●Call for participants

1,Presenter:If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you need to submit the abstract and title of your presentation to us:icdepi@smehk.org

2,Listener: If you are interested in attending the conference to participant this gathering on the field of Design Engineering and Product Innovation, you are welcome to join us and share your ideas!

3,Reviewer:Experts in the area of Design Engineering and Product Innovation are welcome to join the conference as reviewer. Send your CV to: icdepi@smehk.org

●Contact Us

Ms. Linda Lee

Email: icdepi@smehk.org

Tel:+852-30697937( Hong Kong)

Web: http://www.icdepi.org/


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.