CMA 2019 - 2019 International Conference on Metals and Alloys
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Website http://www.cmaconf.org/ |
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Category Materials, Metals, Alloys
Deadline: August 12, 2019 | Date: August 19, 2019-August 22, 2019
Venue/Country: Beijing, China
Updated: 2019-01-16 17:34:35 (GMT+9)
Call For Papers - CFP
2019 International Conference on Metals and Alloys will be held from August 19 to 22 in Beijing, China, which is sponsored by Ghent University, Nanjing Tech University, Ton Duc Thang University and Duy Tan University. The overall objective of the conference is to bring together international scientists and engineers in academia and industry in fields related to research in metals and alloys.★ Publication and IndexingAll accepted and registered papers will be included in IOP Conference Series: Materials Science and Engineering,which will be indexed by EI Compendex, Scopus, etc.★ Topics of interest for submission include, but are not limited to:Mechanical Behaviour:WearCreepDislocationHardnessMaterial PropertiesFatigue and FractureMechanical StrengthDamage InitiationCrack PropagationMechanical TestingMetallurgy and Microstructures:Thin FilmsMicrostructureNanostructuresProduction MetallurgyMetal WorkingPowder MetallurgyMetal CompositesWelding and JoiningModeling and ValidationMore topics can be found at http://www.cmaconf.org/Topics.html★ Paper Submission1. Submit original technical papers via Submission System2. Submit original technical papers via email cmacmaconf.org★ Call for participants1. Presenter:If you are interested in presenting your research on the conference, without publishing your paper in the proceeding, you only need to submit the abstract to us!2. Listener:If you are interested in attending the conference to understand ongoing research achievements and share with them your ideas, you are welcome to send your name and affiliation to us.★ Conference Highlights1. Invited Speakers will have a longer presentation time and we will post your information on the website so that other participants can learn more from you first. If you are interested, please do not hesitate to let us know;2. Conference proceeding will be indexed by Scopus, Engineering Compendex (EI), Inspec and etc;3. Best Oral Presenters will be awarded a free registration for the next conference;5. Lunches and Dinners during August 19-22 are covered;6. One day tourism will be provided.★ Contact usMs. Bernice Wu-Conference SecretaryE-mail: cmacmaconf.orgTel.&Wechat: +86-13545231968LinkedIn: www.linkedin.com/in/cmanme-conference★ Co-located conference:2nd International Conference on Numerical Modelling in Engineering(http://www.nmeconf.org/index.html)
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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