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    IFID 2020 - 2020 8th International Forum on Industrial Design (IFID2020)

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    Website http://www.ifid2020.org/ | Want to Edit it Edit Freely

    Category 2020 8th International Forum on Industrial Design;IFID2020;

    Deadline: May 15, 2020 | Date: May 22, 2020-May 24, 2020

    Venue/Country: Luoyang, China

    Updated: 2019-12-16 15:20:18 (GMT+9)

    Call For Papers - CFP

    CONFERENCE INFORMATION:

    Website:http://www.ifid2020.org/

    Conference Date:May 22-24, 2020

    Venue:Luoyang, China

    Submission Deadline: March 1, 2020

    Indexing:EI/Scopus/SCI

    The International Forum on Industrial Design has been successfully held eight sessions.Now the 2020 8th International Forum on Industrial Design will be held in Luoyang,China during May 22-24, 2020. IFID2020 is hosted by Luoyang Government, organized by Luoyang Science and Technology Bureau, Luoyang Productivity Promoting Center, Luoyang Creative Industry Design Center and Guangdong Academy of International Academic Exchange, co-organized by Northwestern Polytechnical University, Lanzhou University of Technology, Henan University of Science and Technology,GOTH DESIGN Co.LTD, Low Carbon Design Society of Hong Kong, Xihua University, North Minzu University, Zhengzhou University of Aeronautics, Zhengzhou University of Light Industry, Nanchang University, Xi'an University of Science and Technology, Xi'an Jiaotong University, Hebei Agricultural University, Tropical Agricultural Machinery Research Institute of Chinese Academy of Tropical Agricultural Sciences,School of Design and Art of Shenyang Jianzhu University, School of Design Art of Dalian University of Science and Technology, College of Mechanical Engineering of Jilin Engineering Normal University, Bengbu University and School of Information Science and Engineering of Dalian Polytechnic University. The idea of the conference is for the scientists, scholars, engineers and students from the Universities all around the world and the industry to present ongoing research activities, and hence to foster research relations between the Universities and the industry.

    The conference will be held every year to make it an ideal platform for people to share views and experiences in Industrial Design and related areas. It will bring you an unexpected harvest. We welcome you to be a member of IFID 2020.

    IFID2018:EI indexing records

    IFID2019: EI indexing records

    1. Organizer

    Luoyang Government

    2.Conference Chair

    Prof. Changde Lu

    Northwestern Polytechnical University,China

    3.CALL FOR PAPER

    The topics of interest for submission include, but are not limited to:

    *Research on industrial design history

    *Discussion on the theory of design innovation

    *Discussion on Design Education in the New Era

    *Design strategy, planning and management research

    *Research on innovative design methods

    *Intelligent design research

    *Basic research in design aesthetics

    *User Experience Testing and Evaluation Research

    *Personalized, stylized, and characteristic re-creation of industrial design

    *Digital design

    *Practical research on design visualization technology

    *Research on Cloud Platform Service for Design Industry Chain

    *Research on Cultural and Creative Product Design from the Perspective of Internationalization

    *Human-machine system research

    *Ergonomics application research

    *Ergonomic innovation experimental method

    *Experimental Research on Human-Computer Interaction of Intelligent Products

    ***Other related topics

    4.Publication

    *All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of IFID 2020 will be published by IOP Conference Series: Materials Science and Engineering(MSE)(ISSN:1757-8981) and indexed by EI compendex.

    *High quality papers will be recommended for publication in SCI journal.(1)Computer-Aided Design(ISSN: 0010-4485, IF=3.049)

    (2)Journal of Mechanical Design(ISSN: 1050-0472, IF=2.828)

    (3)Journal of Engineering Design (ISSN: 1466-1837, IF=1.394)All submissions must not be less than 10 pages in length, and papers should be submitted to serviceatkeoaeic.org and noted "SCI-IFID2020".

    5.Submission Methods

    1.The submitted papers must not be under consideration elsewhere.

    2.Please send the full paper(word+pdf) to SUBMISSION SYSTEM

    3.Please submit the full paper, if presentation and publication are both needed.

    4.Please submit the abstract only, if you just want to make presentations.

    5.Should you have any questions, or you need any materials in English, please contact us at ifidatgdaiae.org

    6.Registration

    For the publication on IFID 2020 conference proceedings:

    Items Registration fee (By RMB)

    Regular Registration(4 pages)3000RMB/per paper

    Additional Paper(4 pages)2800RMB/per paper

    Extra Pages (Begin at Page 5)300RMB/per extra page

    Attendees without Papers1500RMB/per person

    Attendees without Papers (Groups)---1200RMB/per person(≥ 3

    persons)

    ---150 USD / per person(≥ 3

    persons)

    Purchase Extra Journal500RMB/book

    7.Program

    Schedule

    May 22,202013:00-17:00Registration

    May 23,202009:00-12:00Speeches of Keynote Speakers

    12:00-14:00Lunch

    14:00-17:30Oral Presentations

    18:00-19:30Banquet

    May 24,202009:00-18:00Academic Investigation

    CONTACT US

    Conference Secretary: Demi Chuang

    E-mail: IFIDatgdaiae.org

    Tel: +86-15989114690

    (Wechat)QQ: 207899420


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.