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    ICBAIE 2020 - 2020 International Conference on Big Data, Artificial Intelligence and Internet of Things Engineering (ICBAIE2020)

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    Website http://www.icbaie2020.com/ | Want to Edit it Edit Freely

    Category 2020 International Conference on Big Data, Artificial Intelligence;Internet of Things Engineering;ICBAIE2020

    Deadline: April 01, 2020 | Date: April 01, 2020-April 03, 2020

    Venue/Country: Fuzhou, China

    Updated: 2020-01-15 14:44:16 (GMT+9)

    Call For Papers - CFP

    Website:http://www.icbaie2020.com/

    Conference Date:April 10-12, 2020

    Venue:Fuzhou, China

    Submission Deadline:Visit the website for more details

    Notification of Acceptance:About 1-2 weeks after the submission

    Indexed: IEEE Xplore, EI, Scopus

    Organizer:

    Yango University

    The College of artificial intelligence (AI College), Yango University

    Spatial Data Mining and Application Engineering Research Center of Fujian Province University (SDMAERC)

    AEIC Academic Exchange Information Centre

    Co-organizer:

    WuHan DongHu University

    ​1. About the conference:

    2020 International Conference on Big Data, Artificial Intelligence and Internet of Things Engineering (ICBAIE 2020) will be held in Fuzhou, China during April 10-12, 2020. The meeting mainly focused on the research fields of big data, artificial intelligence and internet of things engineering.

    The purpose of the meeting is to provide a platform for scholars, engineers and technical R&D personnel engaged in applied big data, artificial intelligence and internet of things engineering to share scientific research achievements and advanced technologies, understand the academic development trend, expand research ideas, strengthen academic research and discussion, and promote cooperation in the industrialization of academic achievements.

    2. Keynote Speakers:

    Prof. Yunghsiang S. Han, IEEE Fellow

    chool of Electrical Engineering & Intelligentization, Dongguan University of Technology

    Title:

    Codes over Rings for Distributed Storage Systems

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    Prof. Faisal N. Abu-Khzam, IEEE Senior Member

    Computer Science and Mathematics Department, Lebanese American University

    Title:

    Efficient Parallel Algorithms for Parameterized Problems

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    Prof. Rongrong Ji, “Minjiang”Chair Professor, IEEE Senior Member

    School of Informatis, Xiamen University

    Title:

    Semi-Supervised Adversarial Monocular Depth Estimation

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    Prof. Peter Shaw, IEEE Member

    School of Computer and Mathematics of Massey University, Massey University

    Title:

    Combinatorial Text Classification: the effect of multi-parameterized correlation clustering

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    Prof. Mamoun Alazab, IEEE Senior Member

    Charles Darwin University, Australia

    Title:

    Malware Analysis using Artificial Intelligence and Deep Learning

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    Prof. Anu Gokhale

    Illinois State University, USA

    Title:

    Detecting Happiness Using Hyperspectral Imaging Technology

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    Prof. Fenghua Huang, IEEE Member

    College of Artificial Intelligence, Yango University, China

    Title:

    Automatic Extraction of Impervious Surfaces from High Resolution Remote Sensing Images Based on Deep Learning

    3. Publication

    1. All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of ICBAIE 2020 will be published in conference proceedings and will be submitted to IEEE Xplore, EI, Scopus for indexing.

    >>>Template_IEEE.doc


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.