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    SHANGHAI--ICDES 2022 - The 7th International Conference on Design Engineering and Science(ICDES 2022)

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    Website https://www.icdes.org/ | Want to Edit it Edit Freely

    Category design; modeling; artificial intelligence; design automation

    Deadline: April 15, 2022 | Date: May 13, 2022-May 15, 2022

    Venue/Country: Shanghai, China

    Updated: 2022-03-22 18:09:35 (GMT+9)

    Call For Papers - CFP

    Call for Paper

    The 7th International Conference on Design Engineering and Science(ICDES 2022)

    May. 13-15, 2022 | Shanghai, China

    Web: https://www.icdes.org/

    The 7th International Conference on Design Engineering and Science(ICDES 2022) will be hosted in Shanghai during May. 13-15, 2022, in conjunction with IC4M 2022. ICDES 2022 is organized by Hong Kong Society of Mechanical Engineers.

    With the continuous success of ICDES, we believe that ICDES 2022 will be more exciting and obviously the main annual Design Engineering and Science conference aimed at presenting current research. The idea of the conference is for the scientists, scholars, engineers and students from the universities all around the world and the industry to present ongoing research activities, and hence to foster research relations between the universities and the industry.

    The whole conference committee cordially invite you to this outstanding conference. We look forward to receiving your paper in either research or development of acquired knowledge in order to disseminate to the wider audience.

    ●Publication

    *All the registered and presented papers will be published in Journal of Physics: Conference Series (ISSN: 1742-6596), which will be submitted to Engineering Village, Scopus, Thomson Reuters (WoS) and other databases for review and indexing.

    ICDES 2021/2019/2018/2017/2016 conference proceedings has been indexed by EI!

    ●Speakers

    Prof. Cees De Bont

    Loughborough University, UK

    10 years in Philips Royal Electronics and deanships of the Faculty of Industrial Design Engineering in Delft and the School of Design of the Hong Kong Polytechnic University.Recently research fields: Design education, Innovation adoption, Consumer Behaviour, Design Leadership.

    Prof. Wei Bai

    China University of Geosciences (Wuhan), China

    Wei Bai is a Professor of Mechanical Engineering at China University of Geosciences.His main research interest is in the following areas: innovative manufacturing processes, field-assisted precision manufacturing, ultrasound-assisted technology and equipment, digital twin and intelligent manufacturing, advanced robots, high-performance medical equipment. Professor Bai is a senior member of the Chinese Society of Mechanical Engineering, a member of the ASME, the IEEE, the Intelligent Manufacturing Professional Committee of the Chinese Society for Artificial Intelligence.

    ●Topics of interest include,but are not limited to the followings:

    (1) Design Methodology

    Design process, Evaluation of design, Design assurance, Conceptual design,Ethics in design, Design strategy, Reliability, Mechatronics design, Product Design

    (2) Design and Development

    Design of mechanical elements, Mechanical synthesis, Robotics, Linkage, Cammechanism, Die cast, Biomedical device, Control system design, Welfaredevice, Vehicle dynamics design, Thermal design, Strength of materials,Human engineering, Lightweight materials and composites, Vehicle safety design, Design of mobility systems

    (3) Design and Production

    Design management, Inverse manufacturing, Reverse engineering, Recycling technology, Machine tool, Automation design, KANSEI, Additive manufacturing, Prototyping and Testing

    (4) CAD/CAM/CAE

    Computer graphics, 2D/3D-CAD, CAM, Database, Tool path design, Expertsystem,Rapid prototyping, Finite element method, Optimization method,Dynamical simulation, Modeling, Artificial Intelligence

    (5) Accuracy and Measurement

    Surface characteristics, Tribology, Tolerance, Truncation, On-machinemeasurement,Industrial standard

    ●Paper Submission

    Submission Email: icdesatsmehk.org

    You can submit your full paper through electronic submission system: https://cmt3.research.microsoft.com/ICDES2022

    ●Call for participants

    1,Presenter: If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you need to submit the abstract and title of your presentation to us: icdesatsmehk.org

    2,Listener: You are welcome to attend this great event. You need to complete the registration as Listener before the registration dealdine. Send email to icdesatsmehk.org for further information.

    3,Reviewer: We sincerely welcome experts in the areas of Design Engineering and Science join the conference as reviewer.

    ●Contact Us

    Amber Cao

    Email: icdesatsmehk.org

    Tel:+852-30506862( Hong Kong)

    Web: https://www.icdes.org/


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.