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    ISAMSE 2021 - 2021 6th International Seminar on Advances in Materials Science and Engineering (ISAMSE 2021)

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    Website http://isamse.org/ | Want to Edit it Edit Freely

    Category Advances in Materials Science and Engineering

    Deadline: August 06, 2021 | Date: August 13, 2021-August 15, 2021

    Venue/Country: Hangzhou, China

    Updated: 2021-07-26 11:40:34 (GMT+9)

    Call For Papers - CFP

    2021 6th International Seminar on Advances in Materials Science and Engineering (ISAMSE 2021)

    URL:http://isamse.org/

    Start Date / End Date: August 13-15, 2021

    Location: Hangzhou, China.

    Submission Deadline: Visit the website for more details

    1. About the conference:

    2021 6th International Seminar on Advances in Materials Science and Engineering (ISAMSE 2021) will be held on August 13-15, 2021 in Hangzhou,China. ISAMSE 2021 provides an enabling platform for innovative academics, engineers and industrial experts in the field of Materials Science and Engineering to exchange new ideas and present research results.This conference also promotes the establishing of business or research relations among global partners for future collaboration. We hope that this conference could make significant contribution to the update of knowledge about these latest scientific field. We sincerely invite you to participate in ISAMSE 2021 and look forward to seeing you in Hangzhou!

    2. Conference Chairman

    Prof.David BASSIR

    University of Bourgogne Franche-Comté (UTBM) & Researcher at ENS-CMLA

    Prof.Quan Zhang

    Zhejiang Sci-Tech University

    3.keynote Speaker

    A.Prof.Xiao Ming Zhang

    Hebei University of Technology

    Prof. Xinyong Li

    Dalian University of Technology

    Prof. Qunhong Wen

    School of materials science and engineering

    Hunan University

    Prof.Shanfeng Wang

    Sun Yat-sen University

    4. Publication

    Submit to Conference Proceedings (EI)

    Papers submitted to ISAMSE 2021 will be reviewed by technical committees of the conference.

    All accepted full papers will be published in Conference Proceedings and will be submitted to EI Compendex for indexing.

    5. Submission Guides

    A. Full Paper (for Presentation and Publication)

    Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceedings.

    B. Abstract (Presentation only)

    Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.

    C. English Template (download)

    https://www.ais.cn/attendees/material/IEB6FN

    *All submissions must not be less than 4 pages in length.

    (authors will be charged extra 40 USD/page if the manuscript length is more than 6 pages)

    D. Submission Methods

    1.Please send the full paper & abstract to AIS SUBMISSION SYSTEM.

    https://www.ais.cn/attendees/paperSubmit/IEB6FN

    6. Call for papers

    Materials Science and Engineering

    1.Nanomaterials and Nanotechnology

    2. Biomaterials and Biomedical Engineering

    3. Ceramic and Glass Materials

    4. Computational Material Science

    5. Coupling of Multiple Ferroic Order Parameters

    6. Crystal Defect Engineering

    7. Crystallographic Domain Engineering

    8. Domain Microstructure Evolution

    9. Domain Size Effect, Grain Size Effect, Small Particles, Thin Films

    10. Electronic and Magnetic Materials

    11. Experimental Characterizations

    12. Ferroic and Inter-ferroic Phase Transformations

    13. Fundamentals and Characterization

    14. Giant Magnetostrictive Materials and Magnetic Shape Memory Alloys

    15. Kinetic Pathways of Phase Transformation and Domain Switching

    16. Magnetic Materials

    17. Materials Chemistry

    18. Multiferroic Materials and Composites

    19. Nanotechnology and Materials

    20. Shape Memory Alloys and Martensites

    材料科学与工程

    1.纳米材料和纳米技术

    2.生物材料和生物医学工程

    3.陶瓷和玻璃材料

    4.计算材料科学

    5.多个铁序参数的耦合

    6.晶体缺陷工程

    7.晶体学领域工程

    8.畴微结构演化

    9.畴尺寸效应,晶粒尺寸效应,小颗粒,薄膜

    10.电子和磁性材料

    11.实验特征

    12.铁和铁间相变

    13.基础和特性

    14.超磁致伸缩材料和磁性形状记忆合金

    15.相变和畴变的动力学途径

    16.磁性材料

    17.材料化学

    18.多铁性材料和复合材料

    19.纳米技术和材料

    20.形状记忆合金和马氏体

    7. Registration

    Items ……Registration fee (By US Dollar)

    Regular Registration (4 pages)……500 USD / 3200 RMB per paper

    Extra Pages (Begin at Page 7)……50 USD / 300 RMB per extra page

    Attendees without Papers……180 USD / 1200 RMB per person

    Attendees without Papers (Groups)……150 USD / 1000 RMB per person (≥5 persons)

    Purchase Extra Journal……75 USD / 500 RMB per book

    8.Contact Us

    Conference Secretary: Chelsea Ye

    Tel: +86-18122478740

    WeChat: 86-18122478740


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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