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2010 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

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Conference Record #:15082
Conference Title:2010 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)
Conference Acronym:APEMC
Conference Dates:4/12/2010 to 4/16/2010

Location:Beijing International conference Center
City:Beijing
Country:China
State/Province:

Exhibits:Y No. of Exhibits:40 Tutorials:Y Attendance:700 Producing Publication:Y Concentration Banking Info:NA

Conference Scope:APEMC is the premier EMC coneferenec in Asia-Pacific Region founded in 2006 in Singapore, and has been held twice in 2006 and 2008. The conference will present the latest development and research in the areas of electromagnetic compatibility including IC and PCB EMC,Signal integrity, computational electromagnetics, nanotechnology, lightning, power system EMC, automotive EMC, RF technology and microwave devices

Conference Keywords:asia-pacific, emc, apemc, electromagnetic compatibility, ic, electronic packaging, radio frequency, microwave, electromagnetics

Conference Focus:Application,Scientific/Academic

WWW URL:http://www.apemc2010.org/
CFP URL:http://www.apemc2010.org/

Abstract Submission Date:10/5/2009
Notification of Acceptance:12/20/2009
Final Paper Submission Date:1/20/2010

Expenses:0.00
Revenue:0.00

IEEE Sponsors
Electromagnetic Compatibility Society - EMC (Technical Sponsor) -0%
Microwave Theory and Techniques Society - MTT (Technical Sponsor) -0%

Non IEEE Sponsors
Asia-Pacific EMC (Co Sponsor) -50%
Tsinghua University (Co Sponsor) -50%

Information Contact:
Erping Li
1 Fusionopolis Way
Connexis 16-16
Singapore Singapore 138632
SINGAPORE
Ph : +65 98214058
erpingli@ieee.org

Technical Program Chair:
He Jinliang
Dept of Electrical Eng
Tsinghua University
Beijing Beijing 100084
CHINA
Ph : ++86 10 6277558
hejl@tsinghua.edu.cn

Conference Chair:
Erping Li
1 Fusionopolis Way
Connexis 16-16
Singapore 138632
SINGAPORE
Ph : +65 98214058
erpingli@ieee.org

Publication Chair:
Erping Li

Ph : +65-98214058
erpingli@ieee.org

Treasurer:

Info Schedule Submitted by
ERPING LI
65 64191543
erpingli@ieee.org

Entered in database: 10/13/2008


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Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.