IEEE TTM 2011 - IEEE Technology Time Machine
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Website www.techbeyond2020.ust.hk |
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Category IEEE TTM 2011
Deadline: April 30, 2011 | Date: June 01, 2011-June 03, 2011
Venue/Country: HongKong, Hong Kong
Updated: 2011-03-14 18:06:50 (GMT+9)
Call For Papers - CFP
IEEE TTM is a unique event for industry leaders, academics and decision making government officials who direct R&D activities, plan research programs or manage portfolios of research activities.This is the first ever organized Symposium of future technologies and will cover in a tutorial way a selected set of potentially high impact emerging technologies, their current state of maturity and scenarios for the future.The Symposium brings world renowned experts to discuss the evolutionary and revolutionary advances in technology landscapes as we look forward to 2020. All the presentations in this Symposium are given by invited World leading experts. The Symposium is structured to facilitate informal discussions among the participants and speakers. As the number of participants will be kept relatively small, this Symposium provides an excellent opportunity for informal interaction between the attendees and senior business leaders and world-renowned innovators. At the conclusion of the formal Symposium there will be an in depth session on the state of Cloud Computing. The Symposium will also provide the opportunity to visit some leading Hong Kong and Chinese research institutes and industries.The IEEE TTM Symposium will be held in Asia's world city, Hong Kong. Hong Kong is a very unique city with a true mixture of eastern and western values and combining the exotic with the convenience of a modern thriving city. Attending the IEEE TTM2011 is therefore a perfect way to experience the regions’ unique technology and business activities along with the fast growing vibrant economies and the excitement of China and Asia.Please visit the TTM Symposium web site for more information:http://www.techbeyond2020.ust.hk/about.html The TTM Flyer can be downloaded at http://www.techbeyond2020.ust.hk/IEEE_TTM_flyer_release.pdfPlenary topics:* Impact of Technology on Environment* China’s Path to Technology Leadership* Smart GridSessions:* Future Directions in Wireless* Future of Silicon-based Microelectronics* Carbon Nanostructures and Conducting Polymers in Electronics* Cloud Computing* E-Health* Internet of Things* Digital Content at Home (Displays, Connectivity, Usability, etc.)* Advances in Biomedical Engineering* Future Mobile Services* Energy Harvesting and Storage (batteries, super capacitors)Keynote and Invited Speakers:* Nobuhiro Endo, CEO, NEC Corporation, Japan* George Arnold, National Coordinator for Smart Grid Interoperability,NIST, USA* Philipp Zhang, Chief Scientist, Huawei Technologies co., Ltd., China* Ghavam Shahidi, IBM Fellow, Director of Silicon Tech., IBM WatsonResearch Ctr., USA* Joe Weinman, Worldwide Lead, Comm., Media, and Entertainment Ind. Sol.,HP, USA* Peter Hartwell, Senior Scientist, Hewlett-Packard Laboratories, USA* Hugh Bradlow, Chief Technology Officer, Telstra, Australia* Micheal Austin, Vice President, BYD America, USA* Raj Jammy, Director of Silicon Front End processing, Sematech, USA* Jian Ma, Chief Scientist, Wuxi SensiNet Institute, China* Roberto Saracco, Director, Telecom Italia Future Center, Italy* Tero Ojanperä, Executive VP, Head of Services and Dev. Experience,Nokia, Finland* Minoru Etoh, Managing Director of Multimedia Laboratories at NTTDoCoMo* Pierre Mars,Vice President, Applications Engineering, CAP-XX,Australia* David Brown, CEO of Canatu Oy, Finland* Masahiro Fujita, President of System Technologies Laboratories, SonyCorporation, Japan* Jan Färjh, Head of Ericsson research, SwedenFurther information:Amine Bermak, Electronic and Computer Engineering Department, HKUST Clear WaterBay, Kowloon, Hong Kong, Tel. +852-2358 8992, Fax. +852-2358 1485,Email: eebermakece.ust.hk
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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