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    IEEE TTM 2011 - IEEE Technology Time Machine

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    Website www.techbeyond2020.ust.hk | Want to Edit it Edit Freely

    Category IEEE TTM 2011

    Deadline: April 30, 2011 | Date: June 01, 2011-June 03, 2011

    Venue/Country: HongKong, Hong Kong

    Updated: 2011-03-14 18:06:50 (GMT+9)

    Call For Papers - CFP

    IEEE TTM is a unique event for industry leaders, academics

    and decision making government officials who direct R&D

    activities, plan research programs or manage portfolios of

    research activities.This is the first ever organized

    Symposium of future technologies and will cover in a

    tutorial way a selected set of potentially high impact

    emerging technologies, their current state of maturity and

    scenarios for the future.

    The Symposium brings world renowned experts to discuss the

    evolutionary and revolutionary advances in technology

    landscapes as we look forward to 2020. All the

    presentations in this Symposium are given by invited World

    leading experts. The Symposium is structured to facilitate

    informal discussions among the participants and speakers.

    As the number of participants will be kept relatively

    small, this Symposium provides an excellent opportunity

    for informal interaction between the attendees and senior

    business leaders and world-renowned innovators. At the

    conclusion of the formal Symposium there will be an in

    depth session on the state of Cloud Computing. The

    Symposium will also provide the opportunity to visit some

    leading Hong Kong and Chinese research institutes and

    industries.

    The IEEE TTM Symposium will be held in Asia's world city,

    Hong Kong. Hong Kong is a very unique city with a true

    mixture of eastern and western values and combining the

    exotic with the convenience of a modern thriving city.

    Attending the IEEE TTM2011 is therefore a perfect way to

    experience the regions’ unique technology and business

    activities along with the fast growing vibrant economies

    and the excitement of China and Asia.

    Please visit the TTM Symposium web site for more information:

    http://www.techbeyond2020.ust.hk/about.html The TTM Flyer

    can be downloaded at

    http://www.techbeyond2020.ust.hk/IEEE_TTM_flyer_release.pdf

    Plenary topics:

    * Impact of Technology on Environment

    * China’s Path to Technology Leadership

    * Smart Grid

    Sessions:

    * Future Directions in Wireless

    * Future of Silicon-based Microelectronics

    * Carbon Nanostructures and Conducting Polymers in Electronics

    * Cloud Computing

    * E-Health

    * Internet of Things

    * Digital Content at Home (Displays, Connectivity, Usability, etc.)

    * Advances in Biomedical Engineering

    * Future Mobile Services

    * Energy Harvesting and Storage (batteries, super capacitors)

    Keynote and Invited Speakers:

    * Nobuhiro Endo, CEO, NEC Corporation, Japan

    * George Arnold, National Coordinator for Smart Grid Interoperability,

    NIST, USA

    * Philipp Zhang, Chief Scientist, Huawei Technologies co., Ltd., China

    * Ghavam Shahidi, IBM Fellow, Director of Silicon Tech., IBM Watson

    Research Ctr., USA

    * Joe Weinman, Worldwide Lead, Comm., Media, and Entertainment Ind. Sol.,

    HP, USA

    * Peter Hartwell, Senior Scientist, Hewlett-Packard Laboratories, USA

    * Hugh Bradlow, Chief Technology Officer, Telstra, Australia

    * Micheal Austin, Vice President, BYD America, USA

    * Raj Jammy, Director of Silicon Front End processing, Sematech, USA

    * Jian Ma, Chief Scientist, Wuxi SensiNet Institute, China

    * Roberto Saracco, Director, Telecom Italia Future Center, Italy

    * Tero Ojanperä, Executive VP, Head of Services and Dev. Experience,

    Nokia, Finland

    * Minoru Etoh, Managing Director of Multimedia Laboratories at NTT

    DoCoMo

    * Pierre Mars,Vice President, Applications Engineering, CAP-XX,

    Australia

    * David Brown, CEO of Canatu Oy, Finland

    * Masahiro Fujita, President of System Technologies Laboratories, Sony

    Corporation, Japan

    * Jan Färjh, Head of Ericsson research, Sweden

    Further information:

    Amine Bermak, Electronic and Computer Engineering Department, HKUST Clear Water

    Bay, Kowloon, Hong Kong, Tel. +852-2358 8992, Fax. +852-2358 1485,

    Email: eebermakatece.ust.hk


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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