ICICDT 2012 - 2012 IEEE International Conference on IC Design & Technology (ICICDT)
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Website www.icicdt.org |
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Category ICICDT 2012
Deadline: February 16, 2012 | Date: May 30, 2012-June 01, 2012
Venue/Country: Austin, U.S.A
Updated: 2011-06-05 11:51:51 (GMT+9)
Call For Papers - CFP
Papers are solicited on:? Design approaches including system, circuit and EDA to manage power, leakage, process variation, signal integrity, reliability, yield, and manufacturability.? Advanced VLSI design, including embedded and host processors, ASICs, memories sub-system, analog and mixed-signal circuits.? Multicore System-on-Chip (SoC), System-in-Package (SiP), and IP reuse for fast design closure.? Advanced materials, advanced metallization, and 3D interconnection as both, novel interconnect, scheme for future MPUs and approach for realization of SoCs.? Process and circuit for advanced memories: ReRAM, PRAM, MRAM, FeRAM, eDRAMNanocrystal Memory, Flash, etc., with emphasis on reliability.? Advanced transistor structures for bulk, multiple Gate, FDSOI, PDSOI, SSOI, SiGe, etc technologies? RF & analog properties of advanced devices (MOS, Bip, MEMS …), RF, mmW & analog circuits on advanced technologies (planar, heterogeneous, 3D…)? New gate materials for adjusting Vt, enhanced mobility & scalability, low leakage, and low power.? SER, thermal, leakage, Plasma-Induced Damage (PID), reliability, yield, etc effects on advanced transistor structures and circuits.? Simulation & modeling on advanced process, device & circuit.? Nanotechnology materials, devices and circuits.? ESD protection circuitry, mixed-voltage-tolerant I/O design, high speed and low power I/O buffer? Emerging IC technologies and circuits crossover such as organic IC's, integrated sensors and actuators.? High Power, High Voltage devices and technologyProspective authors are invited to submit a camera-ready paper of maximum four pages in length, including figures and references. The authors should obtain paper submission guidelines from http://www.ICICDT.org. Accepted/Invited papers will be included in the proceedings of the conference (available on CD-ROM). Presented paper will be published in IEEE Xplore and accepted paper must be accompanied by a non-refundable registration fee.
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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