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    SIRF 2013 - 2013 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in Rf Systems (SiRF)

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    Website www.silicon-rf.org | Want to Edit it Edit Freely

    Category SIRF 2013

    Deadline: July 12, 2012 | Date: January 20, 2013-January 22, 2013

    Venue/Country: Austin, U.S.A

    Updated: 2012-01-09 19:11:59 (GMT+9)

    Call For Papers - CFP

    Technical papers are solicited in the following area, but all papers related to Si-based RF systems are welcome:

    Materials -

    Devices -

    IC Technologies -

    Circuits -

    Passives -

    MEMS/NEMS -

    Reliability Issues -

    Measurement and Modeling -

    Applications -

    Nanoscale microwave -

    Si photonics -

    Epitaxy, strain engineering, characterization, stability issues, smart materials.

    Physics, optimization, and scaling limits of SiGe HBTs, RF-CMOS, SOI CMOS, strained-Si CMOS, SiGe MOSFETs, Si-based MODFETs, mm-wave diodes.

    Novel device structures, HBT and CMOS integration issues, heterogeneous integration, fabrication on high-resistivity Si and SOI, packaging issues, IC on polymer/paper.

    Microwave and mm-wave building blocks, integrated transceivers, high-speed DAC and ADC, analog/mixed-signal circuit blocks, RFICs, RF sensors, RF power meters, RF biosensors.

    Inductors, capacitors, thin film resistors, transmission lines, integrated antennas, transformers.

    RF MEMS, micro-machining for improved passives, integration with Si-based circuits.

    Yield and reliability concerns in high-frequency Si-based circuits, signal isolation issues, interference, substrate noise, RF impedance mismatch robustness, cooling architecture.

    Multi-physics modeling, electromagnetic simulation of complex RF systems, robust measurement and de-embedding techniques, methods of built-in-self-test and built-in-self-calibration, correlation of high-frequency parameters with easy-to-measure DC/AC parameters.

    System-on-a-Chip (SoC) and System-in-a-Package (SiP) solutions for mm-wave sub-systems and systems, integration of Si-based photonic elements with electronic circuits, UWB architecture, RFI, wireless sensor architectures, health monitoring, medical diagnostics.

    Nano (CNT, nanowire, dots, graphene), quantum, multi-gigabit optical, and THz materials, devices, and circuits.

    Si-based photonic modulator, detector, integrated photonic components with electronic circuits, radio over fiber.


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.