DATICS-IMECS'10 2010 - DATICS-IMECS'10 Workshop
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Website http://digilander.libero.it/systemcfl/datics10-imecs |
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Category DATICS-IMECS'10 2010
Deadline: November 01, 2009 | Date: March 17, 2010
Venue/Country: Hong Kong, Hong Kong
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
DATICS-IMECS'10 WorkshopHong Kong, 17-19 March, 2010URL: http://digilander.libero.it/systemcfl/datics10-imecsWorkshop in the IAENG IMECS Conference:The International MultiConference of Engineers and Computer Scientists2010 (IMECS 2010) is organised by the International Association ofEngineers (IAENG), a non-profit international association for theengineers and the computer scientists. IAENG IMECS 2010 will takeplace in Hong Kong, 17-19 March, 2010.URL: http://www.iaeng.org/IMECS2010Aims and Scope of DATICS-IMECSâ?™10 Workshop:DATICS Workshops were initially created by a network of researchersand engineers both from academia and industry in the areas of Design,Analysis and Tools for Integrated Circuits and Systems. Recently,DATICS has been extended to the fields of Communication, ComputerScience, Software Engineering and Information Technology.The main target of DATICS-IMECSâ?™10 is to bring togethersoftware/hardware engineering researchers, computer scientists,practitioners and people from industry to exchange theories, ideas,techniques and experiences related to all aspects of DATICS.Topics:Topics of interest include, but are not limited to, the following:Circuits, Systems and Communications:* digital, analog, mixed-signal, VLSI, asynchronous and RF design* processor and memory* DSP and FPGA/ASIC-based design* synthesis and physical design* embedded system hardware/software co-design* CAD/EDA methodologies and tools* statistical timing analysis and low power design methodologies* network/system on-a-chip and applications* hardware description languages, SystemC and SystemVerilog* simulation, verification and test technology* semiconductor devices and solid-state circuits* fuzzy and neural networks* communication signal processing* mobile and wireless communications* multimedia communicationsComputer Science, Software Engineering and Information Technology:* equivalence checking, model checking, SAT-based methods,compositional methods and probabilistic methods* graph theory, process algebras, petri-nets, automaton theory, BDDs and UML* formal methods* distributed, real-time and hybrid systems* reversible computing and biocomputing* software architecture and design* software testing and analysis* software dependability, safety and reliability* programming languages, tools and environments* face detection and recognition* database and data mining* image and video processing* watermarking* artificial intelligence* average-case analysis and worst-case analysis* design and programming methodologies for network protocols and applications* coding, cryptography algorithms and security protocols* evolutionary computation* numerical algorithmsChairmanDr. Ka Lok Man, Xiâ?™an Jiaotong-Liverpool University (China - UK) andCEOL, University College Cork (Ireland)International Program CommitteeProf. Vladimir Hahanov, Kharkov National University of RadioElectronics, UkraineProf. Paolo Prinetto, Politecnico di Torino, ItalyProf. Massimo Poncino, Politecnico di Torino, ItalyProf. Alberto Macii, Politecnico di Torino, ItalyProf. Joongho Choi, University of Seoul, South KoreaProf. Wei Li, Fudan University, ChinaProf. Michel Schellekens, University College Cork, IrelandDr. Emanuel Popovici, University College Cork, IrelandDr. Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center,South KoreaDr. Umberto Rossi, STMicroelectronics, ItalyProf. Franco Fummi, University of Verona, ItalyDr. Graziano Pravadelli, University of Verona, ItalyYui Fai Lam, Hong Kong University of Science and Technology, Hong KongDr. Vladimir PavLov, International Software and ProductivityEngineering Institute, USAAjay Patel, Intelligent Support Ltd, United KingdomDr. Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, TheNetherlandsDr. Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USADr. Menouer Boubekeur, University College Cork, IrelandDr. Ana Sokolova, University of Salzburg, AustriaDr. Sergio Almerares, STMicroelectronics, ItalyMonica Donno, Minteos, ItalyProf. Jun-Dong Cho, Sung Kyun Kwan University, South KoreaProf. AHM Zahirul Alam, International Islamic University Malaysia, MalaysiaProf. Gregory Provan, University College Cork, IrelandDr. Miroslav N. Velev, Aries Design Automation, USAProf. M. Nasir Uddin, Lakehead University, CanadaDr. Alexei Botchkarev, IEEE Canada Board of DirectorsDr. Dragan Bosnacki, Eindhoven University of Technology, The NetherlandsDr. Dave Hickey, University College Cork, IrelandDr. Maria Oâ?™Keeffe, University College Cork, IrelandDr. Tomas KrilaviÄ?ius, Vytautas Magnus University, LithuaniaDr. Milan Pastrnak, Siemens IT Solutions and Services, SlovakiaDr. John Herbert, University College Cork, IrelandProf. Zhe-Ming Lu, Sun Yat-Sen University, ChinaProf. Jeng-Shyang Pan, National Kaohsiung University of AppliedSciences, TaiwanProf. Chin-Chen Chang, Feng Chia University, TaiwanProf. Mong-Fong Horng, Shu-Te University, TaiwanProf. Liang Chen, University of Northern British Columbia, CanadaProf. Chee-Peng Lim, University of Science Malaysia, MalaysiaProf. Ngo Quoc Tao, Vietnamese Academy of Science and Technology, VietnamProf. Suash Deb, C. V. Raman College of Engineering, IndiaDr. Salah Merniz, Mentouri University, Constantine, AlgeriaDr. Oscar Valero, University of Balearic Islands, SpainProf. Yang Yi, Sun Yat-Sen University, ChinaDr. Damien Woods, University of Seville, SpainDr. Franck Vedrine, CEA LIST, FranceProf. Bruno Monsuez, ENSTA, FranceProf. Kang Yen, Florida International University, USAProf. Takenobu Matsuura, Tokai University, JapanDr. R. Timothy Edwards, MultiGiG, Inc., USADr. Olga Tveretina, Karlsruhe University, GermanyDr. Maria Helena Fino, Universidade Nova De Lisboa, PortugalDr. Adrian Patrick Oâ?™Riordan, University College Cork, IrelandDr. Grzegorz Labiak, University of Zielona Gora, PolandProf. M.S. Gaur, Malaviya National Institute of Technology, Jaipur, IndiaDr. Jian Chang, Texas Instruments, Inc, USAProf. Yeh-Ching Chung, National Tsing-Hua University, TaiwanDr. Anna Derezinska, Warsaw University of Technology, PolandProf. Kyoung-Rok Cho, Chungbuk National University, South KoreaDr. Yong Zhang, Shenzhen University, ChinaDr. R. LiutkeviÄ?ius, Vytautas Magnus University, Kaunas, LithuaniaDr. Yuanyuan Zeng, University College Cork, IrelandDr. D.P. Vasudevan, University College Cork, IrelandDr. Arkadiusz Bukowiec, University of Zielona Gora, PolandDr. Paris Kitsos, Hellenic Open University, Patras, GreeceDr. Maziar Goudarzi, University College Cork, IrelandProf. Jin Song Dong, National University of Singapore, SingaporeDr. Ateet Bhalla, Technocrats Institute of Technology, Bhopal, IndiaProf. Dhamin Al-Khalili, Royal Military College of Canada, CanadaProf. Zainalabedin Navabi, University of Tehran, IranProf. Lyudmila Zinchenko, Bauman Moscow State Technical University, RussiaInternational ReviewersPeter Westermann, Technical University of Dortmund, GermanyTom English, University College Cork, IrelandMiquel Moreto Planas, Technical University of Catalonia, SpainChelho Chung, System Semiconductor/Central R&D Center, LS IndustrialSystems, South KoreaAmlan Chakrabarti, University of Calcutta, IndiaChi-Un Lei, University of Hong Kong, Hong KongMohamed Bamakhrama, ST-NXP Wireless, The NetherlandsB. Rajendra Naik, Osmania University, IndiaFelipe Klein, State University of Campinas (UNICAMP), BrazilSean Harte, Tyndall, University College Cork, IrelandJun Wang, University College Cork, IrelandAlexander Yin, University of Turku, FinlandLuigi Giancardi, UniversitÃ? degli Studi di Genova, ItalyAlie El-Din Mady, University College Cork, IrelandArun Joseph, IBM Systems and Technology Laboratory, IndiaOrganising ChairsDr. Moinca Oâ?™Mullane, University College Cork, IrelandMichele Mercaldi, Minteos, ItalyPaper Submissions, Proceedings, Indexing, Journal Publications andBook Chapters:* All submitted papers should be in the form of .pdf and are to belimited to a maximum length of 6 pages (A4 size, single space, TimesRoman of font size 10, two columns format), including figures, tablesand references.* There is no template for the initial paper.*Please submit full papers using the EasyChair DATICS-IMECSâ?™10Web-page at http://www.easychair.org/conferences/?conf=daticsimecs10.* If the paper(s) is/are accepted for publication, at least one of theauthors of the accepted paper(s) must register to the DATICS-IMECSâ?™10Workshop through the hosting conference IMECSâ?™10. Details of theregistration can be found athttp://www.iaeng.org/IMECS2010/registration.html.* Please note that the accepted papers in DATICS-IMECSâ?™10 will beindexed in major database indexes so that it can be assess easily.After the publication of the proceeding, print copies will be sent todatabases like IET INSPEC, EBSCO, ISI Thomson Scientific, EngineeringIndex (EI), The Technology Research Databases (TRD) of CSA (CambridgeScientific Abstracts), DBLP and Computer Science Bibliographies forindexing.* Expanded and enhanced versions of accepted papers in DATICS-IMECSâ?™10can also be considered for inclusion in one of the IAENG journals orthe IJDATICS journal.* Furthermore, revised and expanded version of the selected papers inDATICS-IMECSâ?™10 may also be included as book chapters in thestandalone edited books under the cooperation between IAENG andpublishers like America Institute of Physics, the CPS of IEEE ComputerSociety, and Springer.DATICS-IMECSâ?™10 Review ProcessDATICS-IMECSâ?™10 consists of about 80 experts in the related fields ofDATICS both from academia and industry. Each submission will be sentto at least 2 members of the DATICS IPC and additional reviewers forreview.Important Deadlines* Deadline for full paper submission: 1 November 2009* Notification of acceptance: 1 December 2009* Deadline for authorsâ?™ registration: 15 December 2009* Deadline for final manuscript submission: 10 January 2010Becoming a Sponsor of DATICS-IMECSâ?™10For information, please contact ss.daticsgmail.com.Technical CommitteeIf you are interested in joining the DATICS International ProgramCommittee and Reviewers, please submit a brief CV by email toss.daticsgmail.com.EnquiriesPlease direct all enquiries to ss.daticsgmail.com.
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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