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    ICDV 2012 - The 3rd IEICE International Conference on Integrated Circuits and Devices

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    Category ICDV 2012

    Deadline: May 01, 2012 | Date: August 13, 2012-August 15, 2012

    Venue/Country: Danang, Vietnam

    Updated: 2012-03-31 08:41:16 (GMT+9)

    Call For Papers - CFP

    The 3rd International Conference on Integrated Circuits and Devices in Vietnam (ICDV 2012)

    August 13 - 15, 2012 ? Danang, Vietnam

    http://www.uet.vnu.edu.vn/icdv2012

    Co-organized by VNU University of Engineering and Technology, Danang University of Technology

    Sponsored by IEICE Electronics Society Technical Committee on Integrated Circuits and Devices

    Co-sponsored by IEEE SSCS Japan Chapter, IEEE SSCS Kansai Chapter, and The Radio-Electronics Association of Vietnam (REV)

    The ICDV (Integrated Circuits and Devices in Vietnam) is an annual international forum for presenting chips and circuit designs in solid-state and semiconductor fields. Continuous scaling of the CMOS devices increases the number of transistors on a VLSI chip. It will soon reach the level of 10 giga transistors on a single chip, which is equivalent to the total neuron numbers in the human brain. This would certainly provide us a great opportunity for new applications and information processing. On the other hands, the small feature size causes new problems such as leakage current and process variation. To discuss utilizing the scaling advantages and coping with the new problems, we call for contributions about new proposal of application systems, VLSI architectures, and design methodologies as well as the technologies in the integrated circuit and device field. We expect to this conference explores and stimulates the contributed researches to those subjects. The papers are solicited from prospective authors interested in the related fields. The ICDV 2012 conference is supported by the IEICE ICD technical group, co-organized by VNU University of Engineering and Technology (VNU-UET) and Danang University of Technology (DUT), and will be held in Danang city, Vietnam. In this part of Central of Vietnam, you will also enjoy a coastal mix of the dynamic and booming city of Danang, the charm of the world heritage ancient town of Hoi An, and the calm of world heritage monuments of the imperial capital of Hue. Further details on the workshop, paper submission guidelines, and templates will be updated on the ICDV website.

    Paper Submission

    Prospective authors are invited to submit full-length, six-page manuscripts, including figures, tables and references, to the official ICDV 2012 website. All papers will be handled electronically. Accepted and presented papers will be included in the conference proceedings published by the IEICE and will be invited to submit to REV Journal on Electronics and Communications (JEC). Papers are solicited in the following categories, but are not limited to:

    1. Digital integrated circuits and signal processing

    2. Processors/ multiprocessors

    3. Memory

    4. Analog and mixed-signal circuits

    5. RF integrated circuits and microwave engineering

    6. Circuit technologies

    7. Design experience with advanced design technology

    8. Circuits/devices modeling, verification and testing

    9. Reconfigurable architectures

    10. FPGA-based designs

    11. Embedded systems design

    12. Applications related to integrated circuits and devices

    Important dates

    - Manuscript submission: May 1, 2012

    - Notification of acceptance: June 15, 2012

    - Camera-ready submission: June 30, 2012

    E-mail: icdv2012atvnu.edu.vn

    General co-Chairs

    Ngoc-Binh Nguyen, VNU-UET

    Masahiko Yoshimoto, Kobe Uni.

    Kim-Hung Le, DUT

    Takeshi Yamamura, Fujitsu Labs.

    Technical program co-Chairs

    Toshimasa Matsuoka, Osaka Uni.

    Xuan-Tu Tran, VNU-UET

    Van-Tuan Nguyen, DUT

    Tuong-Hai Pham, RVC

    Program Committee

    Organized by ICD committee members, and faculties with UET, DUT, HCMUS, and HCMUT

    Secretary

    Toshimasa Matsuoka, Osaka Uni.

    Duy-Hieu Bui, VNU-UET

    Treasurer

    Osamu Watanabe, Toshiba

    Hong-Nhung Do-Thi, VNU-UET

    Publicity

    Akira Tsuchiya, Kyoto Uni.

    Publication

    Ken Takeuchi, Tokyo Uni.

    Van-Huan Tran, VNU-UET

    Industrial liaison

    Tamio Hoshino, Applistar

    Mitsuo Saito, Toshiba

    Koji Kai, Panasonic

    Kazutami Arimoto, Renesas

    Local arrange

    Van-Tuan Pham, DUT

    Bang-Giang Truong-Vu, VNU-UET

    Van-Mien Nguyen, VNU-UET

    LIST OF TECHNICAL PROGRAM COMMITTEE

    Co-chairs: Toshimasa Matsuoka, Osaka University

    Xuan-Tu Tran, VNU University of Engineering and Technology

    Van-Tuan Nguyen, Danang University of Technology

    Pham Tuong Hai, Renesas Vietnam Corp.

    Members: Akihiko Miyazaki, NTT

    Akira Yasuda, Hosei University

    Hao San, Tokyo City University

    Haruichi Kanaya, Kyushu University

    Hiroaki Hoshino, Toshiba

    Hiroe Iwasaki, NTT Electronics

    Hiroshi Kawaguchi, Kobe University

    Hiroshi Koizumi, NTT

    Hiroshi Toshiyoshi, The University of Tokyo

    Hiroyuki Ito, Tokyo Institute of Technology

    Hiroyuki Yamauchi, Fukuoka Institute of Technology

    Hitoki Ishikuro, Keio University

    Hong-Tuan Do, Ho Chi Minh City University of Technology

    Huu-Phuc Nguyen, Ho Chi Minh City University of Technology

    Kazuhiko Kajigaya, Elpida Memory

    Kenich Ohata, Kagoshima University

    Kenichi Kawasaki, Fujitsu Laboratories

    Kenichi Okada, Tokyo Institute of Technology

    Kenji Kise, Tokyo Institute of Technology

    Kenjiro Nishikawa, Kagoshima University

    Kohji Yoshii, Ricoh

    Koichiro Ishibashi, The University of Electro-Communications

    Koji Kai, Panasonic

    Kousuke Miyaji, The University of Tokyo

    Makiko Ito, Fujitsu Laboratories

    Makoto Nagata, Kobe University

    Makoto Takamiya, The University of Tokyo

    Masakazu Hioki, AIST

    Masayuki Ikebe, Hokkaido University

    Minoru Fujishima, Hirosshima University

    Naoharu Shinozaki, Fujitsu Semiconductor

    Noboru Sakimura, NEC

    Nobuaki Hashimoto, Osaka University

    Nobukazu Takai, Gunma University

    Nobuyuki Itoh, Okayama Prefectural University

    Ramesh Pokharel, Kyushu University

    Riichiro Takemura, Hitachi

    Ryuichi Fujimoto, Toshiba

    Ryuji Yoshimura, TI

    Ryusuke Egawa, Tohoku University

    Satoshi Konishi, Ritsumeikan University

    Shigetoshi Nakatake, The University of Kitakyushu

    Shinichi Ouchi, AIST

    Shinji Miyano, Toshiba

    Sunao Torii, Renesas

    Tadaaki Yamauchi, Renesas

    Takafumi Morie, Panasonic

    Takashi Miyamori, Toshiba

    Takashi Ohira, Toyohashi University of Technology

    Takayuki Shibata, Denso

    Takenori Kato, ROHM

    Tatsuya Hirose, Fujitsu Laboratories

    Thanh-Loan Pham-Nguyen, Hanoi University of Science and Technology

    Tomochika Harada, Yamagata University

    Tomohiro Fujita, Ritsumeikan University

    Tomoki Saito, Intel

    Toshihiko Hamasaki, Hiroshima Institute of Technology

    Tsuneo Tsukahara, Aizu University

    Van-Tuan Nguyen, Danang University of Technology

    Van-Tuan Pham, Danang University of Technology

    Yasuhiro Sugimoto, Chuo University

    Yoshiharu Aimoto, Renesas

    Yoshiro Mita, The University of Tokyo

    Yukio Tamai, Sharp

    Yusuke Kanno, Hitachi


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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