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    WECE 2013 - World E-Conference on Engineering

    View: 543

    Website http://conferences.standard.org | Want to Edit it Edit Freely

    Category Engineering, Electrical Engineering, Mechanical Engineering, Information Technology Engineering

    Deadline: April 15, 2013 | Date: June 12, 2013

    Venue/Country: Amsterdam, Netherlands, Netherlands

    Updated: 2013-03-08 19:53:05 (GMT+9)

    Call For Papers - CFP

    World Standard Organization (WSO) Announced: 2013 World E-Conference on Engineering

    All Authors are welcomed to submit their manuscripts to the World E-Conference on Engineering at: http://conferences.standard.org/engineering/ps.html

    The Registration Fee is 180 Euro which must paid after acceptance notifications.

    The Conference will be held Completely online.

    All accepted Manuscripts will be Send for Indexing at ISI Proceedings, SCOPUS, IEEE, IET Inspec, Ulrich & Worldcat Databases.

    The World e-Conference on Engineering is the premier forum for the presentation of new advances and research results in the fields of Engineering and Technology. The conference will bring together leading academic scientists, researchers and scholars in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:

    Track 1: Information Engineering and Technology

    Green ICT Networks

    Cloud-Grid and Internet Computing

    Resource Management in Cloud Computing

    Energy Efficient Routing and Medium Access with Wireless Sensor Networks

    Indoor Localization and Tracking Algorithms

    Automatic Process Control using Wireless Sensor Networks

    Smart Home Automation Systems

    3G/LTE Mobile Networks Applications

    Artificial Intelligence

    Track 2: Electrical Engineering and Technology

    Communication Systems and Applications

    Ultra-Wideband Communications

    Signal Processing and Applications

    Cognitive Radio Communications

    Communication Networks and Applications

    Network Operations and Management

    Fourth Generation Wireless

    Wireless Optical Communications

    Renewable/Sustainable Energy and Smart Grids

    System on Chip, Embedded Systems and VLSI Design

    Track 3: Mechanical Engineering and Technology

    Robotics and Automation

    Mechatronics Systems

    Sensor Technologies

    Hydraulic and pneumatic systems

    Fluids & Thermal Systems

    Dynamic Systems and Control

    Dynamics and Mechanical Vibrations

    Mechanical Design and Manufacturing

    Microsystems Integration

    Cooperative Intelligent Systems

    Advances for Process Industries

    Track 4: Materials Science and Engineering

    Materials characterization, modeling and performance

    Destructive and non-destructive testing, Microstructural characterization, Failure analysis

    Materials processing and product manufacturing

    Materials Applications/ energy/ biomedical / high temperature

    Materials-Environment interactions and protection

    New materials for structural and functional applications, innovative composites, functionally graded materials

    Materials recycling and other related topics


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.