SPJW 2010 - 13th IEEE Systems Packaging Japan Workshop (2010 SPJW)

Website https://act.jtbgmt.com/gmt/ssl/2010SPJW.ASP | Edit Freely

Category SPJW 2010

Deadline: December 04, 2009 | Date: January 25, 2010

Venue/Country: Kyoto, Japan

Updated: 2010-06-04 19:32:22 (GMT+9)

Call For Papers - CFP

Systems Packaging Japan Workshop (2010 SPJW)

January 25 - 27, 2010

Mielparque-Kyoto, Kyoto, Japan

[ Program | Social Events | Technical Tour | Registration | Venue & Hotel Reservation | Committee ]

Dear Colleagues and Friends

We would like to invite you to submit a presentation and participate to the upcoming 2010 SPJW "Systems Packaging Japan Workshop" that will be held in Kyoto, Japan on January 25 - 27, 2010.

As is well known, Kyoto is one of the most historical cities in Japan with many Japanese traditional buildings, such as Buddhist temples, shrines and palaces. Some of them are designated World Heritage Sites; Kiyomizu-dera Temple, Byodo-in Temple, Kinkaku-ji Temple, Ginkaku-ji Temple and Nijo-jo Castle, for example. Historical and splendid Japanese cultures can be found everywhere in Kyoto.

General Chair, Seiichi Saito

SCOPE

In recent years, technological progress in packaging design and materials has become critical to allow the operation of systems at higher frequencies and obtain better performance. SPJW is held every other year and 2010 SPJW will be the thirteenth workshop since the first meeting, called "IEEE Japan Computer Packaging Workshop", was held in 1986. State-of-the-art technologies in all areas of systems packaging, ranging from LSI packages to super high performance system, will be covered in the workshop ( Workshop History [pdf,676kB] ).

In presentations during the workshop, the discussion time will be arranged to allow interactive and frank discussion among participants, with room for Q&A.

The special features of the workshop are as follows:

The official language of the workshop is English.

No proceedings will be published.

No picture taking/voice recording of presentations will be permitted

TOPICS

MEMS

Environmental Aspects

High Speed Signal Integrity

Digital Consumer Products & Mobile Information Systems, IT Network Systems

Advanced Packaging and Components

High Performance Servers

Advanced Materials

Kyoto gosho

Copyright(C) Akira Okada/ (C)JNTO

Welcome Reception

The welcome reception will be held at Daimonji, the Japanese restaurant located at the top floor of the venue.

Healthy and fantastic Japanese dishes will be served and beautiful night view of Kyoto city will be comfort participants.

Technical Tour

Technical tour is scheduled on the last day of the workshop, planning to visit ATR (Advanced Telecommunications Research Institute International).

Advanced technologies of robots, humanoids, ring laser devices, brain activity analyses and vehicle communications will be demonstrated there.

Registration

Participants are requested to complete the Registration Form ( https://act.jtbgmt.com/gmt/ssl/2010SPJW.ASP ) .

Early Registration fee is JPY 48,000, to be paid on or before the deadline (Dec.11,2009) and JPY 55,000 after the deadline.

Registration fee is due in full at the time of registration. It includes workshop participation, welcome reception, buffet dinner, all luncheons, and technical tour.

The cancel charge is JPY 5,000 before the cancel deadline (Jan.8,2010) and NO RETURN after the cancel deadline.

Registration fee does not include payment for hotel accommodations.

IMPORTANT DATES

[1] Abstract submission: Nov. 20 Dec. 4, 2009

[2] Registration deadline: Dec. 4 Dec.11, 2009 (Fee: JPY 48,000 )

[3] Cancel deadline: Jan. 8, 2010

VENUE & ACCOMMODATION

The workshop will be held at Mielparque Kyoto [pdf,324kB], which is close to the central exit of the JR Kyoto station ( Access to Kyoto [pdf,56kB] ).

Hotels near Mielparque Kyoto can be reserved at the WEB: https://act.jtbgmt.com/gmt/ssl/2010SPJW.ASP.

ORGANISERS

General Chair: Seiichi Saito, Mitsubishi Electric Corporation

[ E-mail: spjwtcpDeleteThisrf.MitsubishiElectric.co.jp (Remove "DeleteThis") ]

Co-General Chair: Michitaka Kimura, Renesas Technology Corp.

Vice General Chair: Shigeyuki Ogata, Oki Printed Circuit Co., Ltd.,

Program Chair: Yoichi Taira, IBM Japan Co.,Ltd.,

Treasurer: Hideki Ohashi, Mitsubishi Electric Corporation

Japanese Committee:

Yoshitaka Fukuoka, WEISTI

Yuzo Shimada, NEC Patent Service, Ltd

Tohru Kishimoto, NTT Advanced Technology

Yutaka Tsukada, i -Packs

Kenji Terada, Kyocera SLC Technologies Corp.

Ryoji Ninomiya, Toshiba Corporation

Hiroshi Go, Hitachi Ltd

Haruhiko Yamamoto, Fujitsu ICT, Ltd

(Kishio Yokouchi, Fujitsu ICT, Ltd )

Secretariat (Mitsubishi Electric Corporation)

[ E-mail: spjwsecretaryDeleteThisrk.MitsubishiElectric.co.jp (Remove "DeleteThis") ]

Hideki Ohashi

Keitaro Yamagishi

US/European/Asian Committee:

George A. Katopis, IBM Corporation

Robert C. Pfahl, National Electronics Manufacturing Initiative

Thomas-Michael Winkel, IBM Germany

Rolf Aschenbrenner, Fraunhofer IZM.

Eric Beyne, IMEC

Ricky Lee, The Hong Kong University of Science and Technology

Kim, Seo Young, Korea Institute of Science and Technology

Shlomo Novotny, Vette Corp.

Stefano Oggioni, IBM Italy