ICMEP 2015 - 2015 The 4th International Conference on Manufacturing Engineering and Process
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Website www.icmep.org |
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Category Manufacturing;Engineering;
Deadline: February 25, 2015 | Date: April 13, 2015-April 14, 2015
Venue/Country: Paris, France
Updated: 2014-11-04 19:00:27 (GMT+9)
Call For Papers - CFP
2015 The 4th International Conference on Manufacturing Engineering and Process (ICMEP 2015) Paris, France, April 13-14, 2015http://www.icmep.org/2015 The 4th International Conference on Manufacturing Engineering and Process (ICMEP 2015) will be held in Paris, France during April 13-14, 2015. Science and Engineering Insititute host this conference annually. This conference is a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Manufacturing Engineering and Process. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.1. Call For PaperTopics: The conference is soliciting state-of-the-art research papers in the following areas of interest:Advanced Materials Engineering and TechnologyApplied thermodynamics, heat transfer, energy conversionElectronics and Integrated Circuits, Embedded Technology and ApplicationsElectrical Engineering and Electric MachinesEngineering design and graphicsInstrumentation and measurement TechnologiesManufacturing and Industrial Engineering, Management ApplicationsMechatronics and control theoryModern Control, Automation and reverse engineeringMathematics - in particular, calculus, differential equations, statistics, and linear algebraNew Technology, Method and Technique in Civil EngineeringPower System and Energy Engineering, Its ApplicationsRobotics and Its ApplicationsSystem Design, Modelling, Simulations and OptimizationData and Intelligent Information Processing, Its ApplicationsSignal and Acoustics Acquisition and ProcessingInformation Technologies and Networks: Its Applications2. Submission Method1. Full paper (presentation & publication) please submit the paper via Electronic Submission System or email: icmepsciei.org.2. Abstract (presentation only), please send the abstract to conference email: icmepsciei.org.3. Important DateSubmission Deadline Before December 05, 2014Notification Date On December 25, 2014Registration Deadline January 15, 20154. VenueHotel Novotel Paris Creteil le Lachttp://www.novotel.com/gb/hotel-0382-novotel-paris-creteil-le-lac/index.shtml5. CommitteeInternational Advisory CommitteeAssoc. Prof.You-Jin Park, Chung-Ang University, KoreaProf Luigi Benedicenti, Software Systems Engineering, Regina, CanadaProf. Philippe CASTAGLIOLA, Inst. Univ. de Technologie de Nantes, FranceProf. Alain Bernard, Ecole Centrale de Nantes, FranceProf. Joost Duflou, Katholieke Universiteit Leuven, BelgiumConference ChairProf. Bale V. Reddy, University of Ontario Institute of Technology (UOIT), CanadaProf. Michel Cotsaftis, LACSC/ECE, Paris, FranceProgram ChairProf.MOGNOL Pascal, IRCCyN, Ecole normale supérieure de Rennes, FranceDr.Alexey Vereschaka, Moscow State Technological University STANKIN, RussiaAssociate Professor Francisco Ortin, Computer Science Department of the University of Oviedo Spain, SpainAssociate Professor.Dr.Balan D. George, German-Romanian University of Sibiu, RomaniaPro.Bor-Jang Tsai, Chung Hua University TaiwanAsst. Prof.Mário S. Ming Kong, University Lisbon, PortugalTechnical CommitteeProf.Ting-Chuen Pong, Hong Kong University of Science and Technology, Hong KongDr. Santoso Wibowo, Central Queensland University, AustraliaProf. S. E. Oraby, PAAET, KuwaitAssoc. Prof Kittisak Kerdprasop, Suranaree University of Technology, ThailandProf.Mehmet Savsar, Kuwait University, KuwaitProf. Yasuhide Mochida, Graduate school of Science & Engineering, Ritsumeikan University, JapanAsst. Prof.Sureerat Polsilapa , Kasetsart University, ThailandDr. Manish A. Kewalramani, Abu Dhabi University, UAE.Dr. YIP Mum Wai, Department of Mechanical Engineering, Tunku Abdul Rahman University College, MalaysiaAssoc. Prof Dr.Yusri Yusof, Faculty of Mechanical and Manufacturing Engineering , Universiti Tun Hussein Onn MalaysiaDr. Burra.Venkata Durga Kumar, Binary University, MalaysiaProf Nittaya Kerdprasop, Suranaree University of Technology ThailandDr Nazri Kama , Advanced Informatics School, Universiti Teknologi MalaysiaProf.Saad M. Darwish, computer science, Alexandria university, EgyptAsst. Prof. Mahdi Alajmi, College of Technological Studies, PAAET, KuwaitAssoc. Prof. Supakorn Pukird, Ubon Ratchathani University, ThailandDr. Nico Hanenkamp, Freudenberg NOK Sealing Technologies Plymouth/MI/USAProf. Renjun PEI, Columbia University, USADr.Shadi Banitaan, North Dakota State University Fargo, ND, USA6. PublishingSelected and registered papers will be published by Applied Mechanics and Materials Journal.(ISSN: 1660-9336).Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc. (Quoted from TTP offical website:http://www.ttp.net/1660-9336.html)http://www.icmep.org/
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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