MCSOC- 2010 - The International Symposium on Embedded Multicore Systems-on-chip (MCSoC-10)
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Website www.cse.ohio-state.edu/~lai/icpp2010 |
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Category MCSOC- 2010
Deadline: March 12, 2010 | Date: September 13, 2010
Venue/Country: San Diego, U.S.A
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
The International Symposium on Embedded Multicore Systems-on-chip (MCSoC-10) aims at providing the world's premier forum of leading researchers in the embedded multicore SoCs software, tools and applications design areas for Academia and industries. Prospective authors are invited to submit paper of their works. Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon acceptance of the paper.Areas of Interests
Software for Embedded Multicore: Compilers, cross assemblers, programming, memory management, object-oriented aspects, virtual machines, concurrent software for SoCs,...
Hardware for Embedded Multicore: SoCs, DSPs, hardware specification, modeling, synthesis, low power simulation and analysis, reliable, performance modeling, security issues, ...
Embedded Multicore System Architecture: Multicore, Many-core, reconfigurable platforms, memory management support, communication, protocols, real-time systems,...
Network-on-chip: NoC architecture, Power and energy issues in NoC , Application specific NoC design, Timing, synchronous /asynchronous communication, RTOS support for NoC, Modeling, simulation, NoC support for MCSoC, NoCs for FPGAs and structured ASICs, NoC design tools,...
Multicore Real-time Systems: Software, distributed real-time systems, real-time kernels, task scheduling, multitasking design, ...
Multicore Testing: Design-for-test, test synthesis, built-in self-test, embedded test for MCSoC,...
Multicore Practices & Benchmarks: Software, tools, trends, emerging technologies, experience maintaining benchmark suites, representation, tools, copyrights, maintenance, ...
Packaging Technologies for MCSoCs
RTOS for Embedded Muticore
Applications for Embedded Multicore
Important Dates
- Full papers submission
: March 12, 2010
- Acceptance notification
: May 7, 2010
- Camera-ready papers
: June 11, 2010
- MCSoC-10 & ICPP2010
: September 13-16,2010
Submission
Paper submissions should be formatted according to the IEEE standard double-column format with a font size 10 pt or larger. Each paper is strictly limited to 8 pages in length. Submissions should represent original, substantive research results. We will not accept any paper which, at the time of submission, is under review or accepted for publication or has already been published in another conference or journal venue.
All submitted papers to the MCSoC-10 should be submitted ELECTRONICALLY. Click here to submit.
Publications
MCSoC-10 symposium papers will be included in ICPP proceedings and will be published in CD format available at the ICPP 2010 conference.
Contact
For further information,please contact: benab
u-aizu.ac.jpOrganizing Committee
General Chair
Toshiaki Miyazaki, The University of Aizu, Japan
Program Chairs
- Abdel Ejnioui, University of South Florida Polytechnic, USA
- Zili Shao, The Hong Kong Polytechnic University, Hong Kong
- Arquimedes Canedo, IBM Tokyo Research Laboratory, Japan
- Jong Hyuk Park, Seoul National University of Technology, Korea
Publicity Chairs
- Nicolas Navet, LORIA, France
Publication Chair
- Song Guo, The Univ. of Aizu
Steering Committee Chairs (TBC)
- Michihiro Koibuchi, National Institute of Informatics, Japan
- Luca Benini, University of Bologna, Italy
- Marcello Coppola, ST Microelectronics, France
- Abderazek Ben Abdallah, The University of Aizu, Japan
Program Committee
- Sunao Torii, NEC, Japan
- Jose Flich, UPV, Spain
- Hiroshi Saito, The Univ. of Aizu, Japan
- Ishfaq Ahmad, The University of Texas at Arlington, USA
- Hiroaki Nishi, Keio University, Japan.
- Antonio Gentile, University of Palermo, Italy
- Zili Shao, Hong Kong Polytechnic University, Hong Kong
- Koji Inoue , Kyushu University, Japan
- Houcine Hassan, Universidad Politécnica de Valencia, Spain
- Kim Taewhan, Seoul National University, South Korea
- Hironori Nakajo, Tokyo University of Agriculture and Technology, Japan
- Fadi Sibai, UAE University, UAE
- Gul N. Khan, Ryerson University, Canada
- Mudar Sarem, HUST Univ. China
- Masaaki Kondo, UEC, Japan
- Leonard Barolli, Fukuoka Institute of Technology, Japan
- Hiroki Matsutani, Keio University, Japan
- Hwansoo Han, Sungkyunkwan University, Korea.
- Pao-Ann Hsiung, National Chung Cheng University, Taiwan
- Frank Singhoff, Universite de Bretagne Occidentale, France
- Kenji Kise, TIT, Japan
- Andy D. Pimentel, University of Amsterdam, The Netherlands
- Sung Woo Chung , Korea University, South Korea
- Tsutomu Yoshinaga, UEC University, Japan
- Tor Skeie, Simula Research Laboratory, Norway
- Shuichi Ichikawa,Toyohashi University of Technology, Japan
- Tony Givargis ,University of California at Irvine, USA
- Seon Wook Kim, Korea University, South Korea
- Gang Qu, University of Maryland, College Park, USA
- Goh Wang Ling, Nanyang Technological University, Singapore
- Trong-Yen Lee, National Taipei University of Technology, Taiwan
- Salvatore Vitabile, Universite di Palermo, Italy
- Yongxin Zhu, Shanghai Jiao Tong University, China
- Ben Juurlink, Delft University of Technology, The Netherlands
- Cong Liu, Florida Atlantic University, USA
- Shinichi Yamagiwa, Kochi University of Technology, Japan
- Takefumi Miyoshi,Tokyo Institute of Technology
- Said Hamdioui, Delft University of Technology, The Netherlands
International Advisory Board
- Stanislav Sedukhin, The Univ. of Aizu, Japan
- Luca Benini, University of Bologna, Italy
- Mounir Hamdi, Hong kong Univ. of Science and Technology, Hong Kong
- Marcello Coppola, ST Microelectronics, France
- Kazutoshi Wakabayashi, NEC Corporation, Japan
- Paolo Lenne, Swiss Federal Institute of Technology (EPFL), Switzerland
- Liang-Gee Chen, National Taiwan University, Taiwan
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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