ISLPED 2017 - IEEE/ACM INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN (ISLPED)
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Website http://www.islped.org |
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Category ISLPED 2017
Deadline: March 06, 2017 | Date: July 24, 2017-July 26, 2017
Venue/Country: Taipe, Taiwan
Updated: 2016-12-18 12:13:36 (GMT+9)
Call For Papers - CFP
p/>CALL FOR PAPERS - ISLPED 2017 (http://www.islped.org)IEEE/ACM INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGNLocation: Taipei, TaiwanDate: July 24-26, 2017Abstract registration by Feb 27, 2017, at 11:59pm Pacific Standard Time Full paper due by Mar 6, 2017, at 11:59pm Pacific Standard TimeNotification of paper acceptance: May 3, 2017Camera-ready version due: June 1, 2017The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design, ranging from process technologies and analog/digital circuits, simulation and synthesis tools, system-level design and optimization, to system software and applications. Specific topics include, but are not limited to, the following three main tracks and sub-areas:1. Technology, Circuits, and Architecture1.1. Technologies1.2. Circuits1.3. Logic and Architecture2. CAD, system, and software2.1. CAD Tools and Methodologies2.2. Systems and Platforms2.3. Software and Applications3. Industrial Design TrackSubmissions should be full-length papers of up to 6 pages (PDF format, double-column, US letter size, using the ACM Conference format, available at http://www.acm.org/publications/article-templates/proceedings-template.html including all illustrations, tables, references, and an abstract of no more than 250 words. Submissions must be anonymous. Submissions exceeding 6 pages or identifying the authors, either directly or through explicit references to their prior work, will be automatically rejected. More information about paper submission can be found at http://www.islped.org.ORGANIZING COMMITTEE:General Co-ChairsChia-Lin Yang, NTUyangccsie.ntu.edu.twDavid Garrett, Broadcomgarrettdbroadcom.comProgram Co-ChairsThomas Wenisch, Univ. Michigantwenischumich.eduJaydeep Kulkarni, Inteljaydeep.p.kulkarniintel.comPublicity Co-ChairsJae-Joon Kim, POSTECHjaejoonpostech.ac.krUmit Ogras, ASUumitasu.eduTreasurerYi-Jung Chen, NCNUyjchenncnu.edu.twWeb ChairHsiang-Yun Cheng, Sinicahychengciti.sinica.edu.twIndustry LiaisonsJohn Redmond, Broadcomjcredmonbroadcom.comTai-Cheng Lee, NTUtleentu.edu.twTsung-Yi Ho, NTHUtyhocs.nthu.edu.twPublication ChairIris Hui-Ru Jiang, NCTUhuiru.jianggmail.comLocal Arrangement Co-ChairsPi-Cheng Hsiu, Sinicapchsiuiis.sinica.edu.twYuan-Hao Chang, Sinicajohnsoniis.sinica.edu.twRegistration ChairTsung-Te Liu, NTUttliuntu.edu.twDesign Contest Co-ChairsSaibal Mukhopadhyay, Georgia Techsaibalece.gatech.eduYongpan Liu, NTHUypliutsinghua.edu.cn
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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