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    DATICS-IMECS 2009 - DATICS-IMECS 2009 Design, Analysis and Tools for Integrated Circuits and Systems

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    Website http://digilander.libero.it/systemcfl/datics09-imecs/ | Want to Edit it Edit Freely

    Category DATICS-IMECS 2009

    Deadline: December 01, 2008 | Date: March 10, 2009

    Venue/Country: hongkong, Hong Kong

    Updated: 2010-06-04 19:32:22 (GMT+9)

    Call For Papers - CFP

    DATICS-IMECS'09

    Design, Analysis and Tools for Integrated Circuits and Systems (DATICS'09)

    SPECIAL SESSION IN THE IAENG IMECS CONFERENCE

    The International MultiConference of Engineers and Computer Scientists 2009 (IMECS 2009) is organised by the International Association of Engineers (IAENG), a non-profit international association for the engineers and the computer scientists. IAENG IMECS 2009 will take place in Hong Kong, 18-20 March, 2009.

    URL: http://www.iaeng.org/IMECS2009

    AIMS AND SCOPE

    Main target of the Special Session: DATICS'09 is to bring together software/hardware engineering researchers, computer scientists, practitioners and people from industry to exchange theories, ideas, techniques and experiences related to all areas of design, analysis and tools for integrated circuits (e.g. digital, analog and mixed-signal circuits) and systems (e.g. real-time, hybrid and embedded systems). DATICS'09 also focuses on the fields of formal methods, low power design methodologies for integrated circuits and wireless sensor networks (WSNs).

    TOPICS

    Topics of interest include, but are not limited to, the following:

    digital, analog, mixed-signal and asynchronous design

    processor, memory and RF design

    DSP and FPGA/ASIC-based design

    synthesis and physical design

    ATPG, design-for-testability and built-in self test methodologies

    embedded system hardware/software co-design and co-verification

    CAD/EDA methodologies and tools

    statistical timing analysis and low power design methodologies

    network and system on-a-chip and applications

    communication and wireless sensor networks (WSNs)

    specification languages: SystemC, SystemVerilog and UML

    theory and foundations: model checking, SAT-based methods, use of PSL, compositional methods and probabilistic methods

    applications of formal methods: equivalence checking, CSP applications and transaction-level verification

    verification methods based on hardware description/system-level languages (e.g. VHDL, SystemVerilog and SystemC)

    industrial experience reports and case studies

    real-time, hybrid and embedded systems

    all areas of modelling, simulation and verification of systems

    formalisms: process algebras, petri-nets, automaton theory and BDDs

    software engineering (including real-time Java, real-time UML and performance metrics)

    INDUSTRIAL COLLABORATORS AND SPONSORS

    The special session is partnered with:

    CEOL: Centre for Efficiency-Oriented Languages "Towards improved software timing", University College Cork, Ireland (http://www.ceol.ucc.ie)

    International Software and Productivity Engineering Institute, USA (http://www.intspei.com)

    Intelligent Support Ltd., United Kingdom (http://www.isupport-ltd.co.uk)

    Minteos, Italy (http://www.minteos.com)

    M.O.S.T., Italy (http://www.most.it)

    Electronic Center, Italy (http://www.el-center.com)

    Legalefiscale - Tax & Commercial Law Firm, Italy (http://www.legalefiscale.it)

    This special session is sponsored by:

    LS Industrial Systems, South Korea (formerly LG Industrial Systems) - http://eng.lsis.biz

    Solari, Hong Kong (official sales agent of Sanyo LCD camera modules) - http://www.solari-hk.com

    ORGANISER - CHAIRMAN

    Dr. Ka Lok Man, University College Cork, Ireland

    INTERNATIONAL PROGRAM COMMITTEE

    Prof. Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine

    Prof. Paolo Prinetto, Politecnico di Torino, Italy

    Prof. Massimo Poncino, Politecnico di Torino, Italy

    Prof. Alberto Macii, Politecnico di Torino, Italy

    Prof. Joongho Choi, University of Seoul, South Korea

    Prof. Wei Li, Fudan University, China

    Prof. Michel Schellekens, University College Cork, Ireland

    Dr. Emanuel Popovici, University College Cork, Ireland

    Dr. Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South Korea

    Dr. Umberto Rossi, STMicroelectronics, Italy

    Prof. Franco Fummi, University of Verona, Italy

    Dr. Graziano Pravadelli, University of Verona, Italy

    Yui Fai Lam, Manager, Mircosystems Packaging Institute, University of Science and Technology, Hong Kong

    Dr. Vladimir PavLov, International Software and Productivity Engineering Institute, USA

    Ajay Patel, Director, Intelligent Support Ltd, United Kingdom

    Dr. Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, Advanced Research Center, The Netherlands

    Dr. Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USA

    Dr. Menouer Boubekeur, University College Cork, Ireland

    Dr. Ana Sokolova, University of Salzburg, Austria

    Dr. Sergio Almerares, STMicroelectronics, Italy

    Monica Donno, Director, Minteos, Italy

    Prof. Jun-Dong Cho, Sung Kyun Kwan University, South Korea

    Prof. AHM Zahirul Alam, International Islamic University Malaysia, Malaysia

    Prof. Gregory Provan, University College Cork, Ireland

    Dr. Miroslav N. Velev, Aries Design Automation, USA

    Prof. M. Nasir Uddin, Lakehead University, Canada

    Dr. Alexei Botchkarev, IEEE Canada Board of Directors

    Dr. Dragan Bosnacki, Eindhoven University of Technology, The Netherlands

    Dr. Dave Hickey, University College Cork, Ireland

    Dr. Tomas Krilavičius, Vytautas Magnus University, Lithuania

    Dr. Milan Pastrnak, Siemens IT Solutions and Services, Slovakia

    Dr. John Herbert, University college Cork, Ireland

    Prof. Zhe-Ming Lu, Sun Yat-Sen University, China

    Prof. Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan

    Prof. Chin-Chen Chang, Feng Chia University, Taiwan

    Prof. Mong-Fong Horng, Shu-Te University, Taiwan

    Prof. Liang Chen, University of Northern British Columbia, Canada

    Prof. Chee-Peng Lim, University of South Australia, Australia

    Prof. Ngo Quoc Tao, Vietnamese Academy of Science and Technology, Vietnam

    Prof. Suash Deb, C. V. Raman College of Engineering, India

    Dr. Salah Merniz, Mentouri University, Constantine, Algeria

    Dr. Oscar Valero, University of Balearic Islands, Spain

    Prof. Yang Yi, Sun Yat-Sen University, China

    Dr. Damien Woods, University of Seville, Spain

    Dr. Franck Vedrine, CEA, France

    Prof. Bruno Monsuez, ENSTA, France

    Prof. Kang Yen, Florida International University, USA

    Prof. Takenobu Matsuura, Tokai University, Japan

    Dr. R. Timothy Edwards, MultiGiG, Inc., USA

    Dr. Olga Tveretina, Karlsruhe University, Germany

    Dr. Maria Helena Fino, Universidade Nova De Lisboa, Portugal

    Dr. Adrian Patrick O'Riordan, University College Cork, Ireland

    Dr. Grzegorz Labiak, University of Zielona Gora, Poland

    Prof. M.S. Gaur, Malaviya National Institute of Technology, Jaipur, India

    Dr. Jian Chang, Texas Instruments, Inc, USA

    Prof. Yeh-Ching Chung, National Tsing-Hua University, Taiwan

    Dr. Anna Derezinska, Warsaw University of Technology, Poland

    INTERNATIONAL REVIEWERS

    Peter Westermann, Technical University of Dortmund, Germany

    Tom English, University College Cork, Ireland

    Miquel Moreto Planas, Technical University of Catalonia, Spain

    Chelho Chung, System Semiconductor/Central R&D Center, LS Industrial Systems, South Korea

    Amlan Chakrabarti, University of Calcutta, India

    Chi-Un Lei, The University of Hong Kong, Hong Kong

    Arkadiusz Bukowiec, University of Zielona Gora, Poland

    Mohamed Bamakhrama, Eindhoven University of Technology, The Netherlands

    B. Rajendra Naik, Osmania University, India

    ORGANISING CHAIRS

    Dr. Maria O'Keeffe, University College Cork, Ireland

    Michele Mercaldi, M.O.S.T., Italy

    PAPER SUBMISSIONS, PROCEEDINGS, INDEXING AND JOURNAL PUBLICATIONS

    Prospective authors are invited to submit their draft paper to be limited to a maximum length of 6 page in full paper to ss.daticsatgmail.com by 1 December 2008.

    The submitted file can be in MS Word format, PS format, or PDF formats. The first page of the draft paper should include:

    Title of the paper;

    Name, affiliation and e-mail address for each author;

    A maximum of 5 keywords of the paper.

    Please use the following MS Word Template or Tex Template.

    The accepted papers in DATICS'09 be published by IAENG (ISBN: 978-988-17012-2-0) in hardcopy and will be indexed in major database indexes so that it can be assess easily. After the publication of the proceeding, print copies will be sent to databases like IET INSPEC, EBSCO, ISI Thomson Scientific, Engineering Index (EI), The Technology Research Databases (TRD) of CSA (Cambridge Scientific Abstracts), DBLP and Computer Science Bibliographies for indexing.

    Expanded and enhanced versions of accepted papers in DATICS'09 can also be considered for inclusion in one of the IAENG journals, the IIUM Engineering Journal, the IBSU Scientific Journal or the IJDATICS Journal.

    IMPORTANT DEADLINES

    Deadline for full paper submission: 1 December 2008

    Notification of acceptance: 1 January 2009

    Deadline for authors' registration: 15 January 2009

    Deadline for final manuscript submission: 10 February 2009

    BECOMING A SPONSOR OF DATICS'09

    For information, please contact ss.daticsatgmail.com.

    TECHNICAL COMMITTEE

    If you are interested in joining the DATICS International Program Committee and Reviewers, please submit a brief CV by email to ss.daticsatgmail.com.

    ENQUIRIES

    Please direct all enquiries to ss.daticsatgmail.com.


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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