DATICS-IMECS 2009 - DATICS-IMECS 2009 Design, Analysis and Tools for Integrated Circuits and Systems
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Category DATICS-IMECS 2009
Deadline: December 01, 2008 | Date: March 10, 2009
Venue/Country: hongkong, Hong Kong
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
DATICS-IMECS'09Design, Analysis and Tools for Integrated Circuits and Systems (DATICS'09)SPECIAL SESSION IN THE IAENG IMECS CONFERENCEThe International MultiConference of Engineers and Computer Scientists 2009 (IMECS 2009) is organised by the International Association of Engineers (IAENG), a non-profit international association for the engineers and the computer scientists. IAENG IMECS 2009 will take place in Hong Kong, 18-20 March, 2009. URL: http://www.iaeng.org/IMECS2009AIMS AND SCOPEMain target of the Special Session: DATICS'09 is to bring together software/hardware engineering researchers, computer scientists, practitioners and people from industry to exchange theories, ideas, techniques and experiences related to all areas of design, analysis and tools for integrated circuits (e.g. digital, analog and mixed-signal circuits) and systems (e.g. real-time, hybrid and embedded systems). DATICS'09 also focuses on the fields of formal methods, low power design methodologies for integrated circuits and wireless sensor networks (WSNs).TOPICSTopics of interest include, but are not limited to, the following:digital, analog, mixed-signal and asynchronous designprocessor, memory and RF designDSP and FPGA/ASIC-based designsynthesis and physical designATPG, design-for-testability and built-in self test methodologiesembedded system hardware/software co-design and co-verificationCAD/EDA methodologies and toolsstatistical timing analysis and low power design methodologiesnetwork and system on-a-chip and applicationscommunication and wireless sensor networks (WSNs)specification languages: SystemC, SystemVerilog and UMLtheory and foundations: model checking, SAT-based methods, use of PSL, compositional methods and probabilistic methodsapplications of formal methods: equivalence checking, CSP applications and transaction-level verificationverification methods based on hardware description/system-level languages (e.g. VHDL, SystemVerilog and SystemC)industrial experience reports and case studiesreal-time, hybrid and embedded systemsall areas of modelling, simulation and verification of systemsformalisms: process algebras, petri-nets, automaton theory and BDDssoftware engineering (including real-time Java, real-time UML and performance metrics)INDUSTRIAL COLLABORATORS AND SPONSORSThe special session is partnered with:CEOL: Centre for Efficiency-Oriented Languages "Towards improved software timing", University College Cork, Ireland (http://www.ceol.ucc.ie)International Software and Productivity Engineering Institute, USA (http://www.intspei.com)Intelligent Support Ltd., United Kingdom (http://www.isupport-ltd.co.uk)Minteos, Italy (http://www.minteos.com)M.O.S.T., Italy (http://www.most.it)Electronic Center, Italy (http://www.el-center.com)Legalefiscale - Tax & Commercial Law Firm, Italy (http://www.legalefiscale.it)This special session is sponsored by:LS Industrial Systems, South Korea (formerly LG Industrial Systems) - http://eng.lsis.bizSolari, Hong Kong (official sales agent of Sanyo LCD camera modules) - http://www.solari-hk.comORGANISER - CHAIRMANDr. Ka Lok Man, University College Cork, IrelandINTERNATIONAL PROGRAM COMMITTEEProf. Vladimir Hahanov, Kharkov National University of Radio Electronics, UkraineProf. Paolo Prinetto, Politecnico di Torino, ItalyProf. Massimo Poncino, Politecnico di Torino, ItalyProf. Alberto Macii, Politecnico di Torino, ItalyProf. Joongho Choi, University of Seoul, South KoreaProf. Wei Li, Fudan University, ChinaProf. Michel Schellekens, University College Cork, IrelandDr. Emanuel Popovici, University College Cork, IrelandDr. Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South KoreaDr. Umberto Rossi, STMicroelectronics, ItalyProf. Franco Fummi, University of Verona, ItalyDr. Graziano Pravadelli, University of Verona, ItalyYui Fai Lam, Manager, Mircosystems Packaging Institute, University of Science and Technology, Hong KongDr. Vladimir PavLov, International Software and Productivity Engineering Institute, USAAjay Patel, Director, Intelligent Support Ltd, United KingdomDr. Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, Advanced Research Center, The NetherlandsDr. Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USADr. Menouer Boubekeur, University College Cork, IrelandDr. Ana Sokolova, University of Salzburg, AustriaDr. Sergio Almerares, STMicroelectronics, ItalyMonica Donno, Director, Minteos, ItalyProf. Jun-Dong Cho, Sung Kyun Kwan University, South KoreaProf. AHM Zahirul Alam, International Islamic University Malaysia, MalaysiaProf. Gregory Provan, University College Cork, IrelandDr. Miroslav N. Velev, Aries Design Automation, USAProf. M. Nasir Uddin, Lakehead University, CanadaDr. Alexei Botchkarev, IEEE Canada Board of DirectorsDr. Dragan Bosnacki, Eindhoven University of Technology, The NetherlandsDr. Dave Hickey, University College Cork, IrelandDr. Tomas Krilavičius, Vytautas Magnus University, LithuaniaDr. Milan Pastrnak, Siemens IT Solutions and Services, SlovakiaDr. John Herbert, University college Cork, IrelandProf. Zhe-Ming Lu, Sun Yat-Sen University, ChinaProf. Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, TaiwanProf. Chin-Chen Chang, Feng Chia University, TaiwanProf. Mong-Fong Horng, Shu-Te University, TaiwanProf. Liang Chen, University of Northern British Columbia, CanadaProf. Chee-Peng Lim, University of South Australia, AustraliaProf. Ngo Quoc Tao, Vietnamese Academy of Science and Technology, VietnamProf. Suash Deb, C. V. Raman College of Engineering, IndiaDr. Salah Merniz, Mentouri University, Constantine, AlgeriaDr. Oscar Valero, University of Balearic Islands, SpainProf. Yang Yi, Sun Yat-Sen University, ChinaDr. Damien Woods, University of Seville, SpainDr. Franck Vedrine, CEA, FranceProf. Bruno Monsuez, ENSTA, FranceProf. Kang Yen, Florida International University, USAProf. Takenobu Matsuura, Tokai University, JapanDr. R. Timothy Edwards, MultiGiG, Inc., USADr. Olga Tveretina, Karlsruhe University, GermanyDr. Maria Helena Fino, Universidade Nova De Lisboa, PortugalDr. Adrian Patrick O'Riordan, University College Cork, IrelandDr. Grzegorz Labiak, University of Zielona Gora, PolandProf. M.S. Gaur, Malaviya National Institute of Technology, Jaipur, IndiaDr. Jian Chang, Texas Instruments, Inc, USAProf. Yeh-Ching Chung, National Tsing-Hua University, TaiwanDr. Anna Derezinska, Warsaw University of Technology, PolandINTERNATIONAL REVIEWERSPeter Westermann, Technical University of Dortmund, GermanyTom English, University College Cork, IrelandMiquel Moreto Planas, Technical University of Catalonia, SpainChelho Chung, System Semiconductor/Central R&D Center, LS Industrial Systems, South KoreaAmlan Chakrabarti, University of Calcutta, IndiaChi-Un Lei, The University of Hong Kong, Hong KongArkadiusz Bukowiec, University of Zielona Gora, PolandMohamed Bamakhrama, Eindhoven University of Technology, The NetherlandsB. Rajendra Naik, Osmania University, IndiaORGANISING CHAIRSDr. Maria O'Keeffe, University College Cork, IrelandMichele Mercaldi, M.O.S.T., ItalyPAPER SUBMISSIONS, PROCEEDINGS, INDEXING AND JOURNAL PUBLICATIONSProspective authors are invited to submit their draft paper to be limited to a maximum length of 6 page in full paper to ss.daticsgmail.com by 1 December 2008.The submitted file can be in MS Word format, PS format, or PDF formats. The first page of the draft paper should include:Title of the paper;Name, affiliation and e-mail address for each author;A maximum of 5 keywords of the paper.Please use the following MS Word Template or Tex Template.The accepted papers in DATICS'09 be published by IAENG (ISBN: 978-988-17012-2-0) in hardcopy and will be indexed in major database indexes so that it can be assess easily. After the publication of the proceeding, print copies will be sent to databases like IET INSPEC, EBSCO, ISI Thomson Scientific, Engineering Index (EI), The Technology Research Databases (TRD) of CSA (Cambridge Scientific Abstracts), DBLP and Computer Science Bibliographies for indexing.Expanded and enhanced versions of accepted papers in DATICS'09 can also be considered for inclusion in one of the IAENG journals, the IIUM Engineering Journal, the IBSU Scientific Journal or the IJDATICS Journal.IMPORTANT DEADLINESDeadline for full paper submission: 1 December 2008Notification of acceptance: 1 January 2009Deadline for authors' registration: 15 January 2009Deadline for final manuscript submission: 10 February 2009BECOMING A SPONSOR OF DATICS'09For information, please contact ss.daticsgmail.com.TECHNICAL COMMITTEEIf you are interested in joining the DATICS International Program Committee and Reviewers, please submit a brief CV by email to ss.daticsgmail.com.ENQUIRIESPlease direct all enquiries to ss.daticsgmail.com.
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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