ISSCC 2011 - International Solid State Circuits Conference

Website www.isscc.org | Edit Freely

Category ISSCC 2011

Deadline: September 13, 2010 | Date: February 20, 2011

Venue/Country: San Francisco, U.S.A

Updated: 2010-06-04 19:32:22 (GMT+9)

Call For Papers - CFP

ANALOG ? Op-amps and instrumentation amps, baseband amplifiers, comparators, multipliers, voltage references, power-control circuits, regulators & DC-DC

converters; continuous-time & discrete-time filters; consumer electronics, non-linear analog circuits, switched-capacitor circuits; synthesizers, PLLs.

DATA CONVERTERS ? Nyquist-rate and oversampling A/D and D/A converters; sample-and-hold circuits; TDC’s.

HIGH-PERFORMANCE DIGITAL ? Microprocessors; graphics processors; network processors; high-speed digital circuits; intra-chip communication circuits; soft

error, variation, and fault-tolerant circuits; reconfigurable logic arrays; security circuits; high-speed CAMs and register files; clock generation and distribution circuits

and architectures; high-performance-logic microarchitectures and circuit techniques; implementation methodologies for high-performance digital VLSI.

IMAGERS, MEMS, MEDICAL & DISPLAY ? Image sensors and companion chips; image sensor SoC; smart sensors; MEMS for analog and RF; MEMS for

sensor-and-instrumentation applications, integrated sensors and transducers; sensor-interface circuits; neural interfaces; biosensors; microarrays and lab-on-a-chip;

sensors for medical applications; circuitry and MEMS technologies that enable biomedical and environmental applications; display drivers, controllers, and companion

chips; thin-film-transistor interface circuits; organic LED and liquid-crystal-display interface circuits; flat-panel and projection displays; circuits for print-heads.

LOW-POWER DIGITAL ? Cell-phone ICs; wireless-communication digital ICs (eg LTE, WSN); innovative multimedia ICs (eg 3D TV, quad HD, advanced video

coding); digital ICs for conventional- and renewable-energy applications, digital ICs for portable medical devices and personal e-health devices; low-power

architectures/ICs for novel signal-processing applications; intelligent power-management methods for digital VLSI; power-performance optimization techniques,

adaptive voltage-and-frequency scaling, adaptive body-bias circuits, energy-adaptive circuit techniques; on-chip monitoring/sensing circuits for low-power

applications; low-power logic.

MEMORY ? Static, dynamic, non-volatile, and read-only memory; memory-core structures and related circuits and architectures; memory- circuit-design

techniques, I/O interfaces, and array organizations; magnetic- and ferroelectric-memory designs and architectures; data storage and multibit-cell-based memory

designs; embedded memory architectures, cache-memory systems, multiport memory, and high- density CAMs; emerging memory technologies (eg nano-crystal,

phase-change, resistance change, FinFET, 3D); high-speed low-power and low-voltage memory designs; yield-enhancement redundancy, ECC techniques, and

statistical designs; memory testing and built-in self-test; memory-system architectures; 3D integration of memory systems and interfaces; memory controllers and

solid-state-disk controllers.

RF ? RF/mm-wave/IF/baseband circuits and sub-systems, both narrowband and wideband, including receiver and transmitter front-ends, modulators/

demodulators, power amplifiers/detectors, RF switches, active antennas/MIMO/phased arrays, frequency generators; circuits for communications, networking,

sensing, RF imaging, SiP integration and emerging RF applications. Also, circuits that achieve improved operating frequency, tunability, selectivity, dynamic range,

power consumption, power efficiency, configurability, silicon scaling, environmental robustness, mixed-signal and digital-assist functionality.

TECHNOLOGY DIRECTIONS ? Advanced circuit technologies and techniques; ultra-low-voltage and sub-threshold logic design; molecular-, organic-, and

nano-electronics; flexible substrates and printable electronics; 3D-integration and novel packaging technologies; compound-semiconductor, superconductive, and

micro-photonic technologies and circuits; energy sources and energy harvesting; emerging applications such as biomedical and ambient-intelligence; emerging

wireless applications and circuits; advanced signal-processing and microprocessor architectures; design for manufacturability; analog and optical processors,

non-transistor-based analog and digital circuits and their system architectures; advanced memory technologies; spintronics; quantum storage; emerging sensor-network

concepts such as body-area and body-sensor networks.

WIRELESS ? Receivers, transmitters, transceivers, and SoCs, for connectivity, cellular, broadcast, and radar applications including multi-standard and multi-band

solutions. Examples include (but are not limited to) WLAN, WiMax, cellular base stations and handsets, GPS, DVB/DMB, UWB, ISM, and mm-wave-band systems.

Also, highly-integrated solutions for emerging wireless applications targeting sensing, imaging, etc. are encouraged.

WIRELINE ? Receivers/transmitters/transceivers for wireline systems including (but not limited to) LAN, WAN, FDDI, Ethernet, token ring, fiber channel, SONET,

SDH, PON, ATM, ISDN, xDSL, cable-modem; optical/electrical data links and backplane transceivers, power-line/phone-line home networks, subscriber-line circuits

and modems; wireline transceiver building blocks like AGC, oscillators, line-drivers and hybrids.