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    MEIE 2018 - 2018 International Conference on Mechanical, Electric and Industrial Engineering (MEIE 2018)

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    Category Mechanical Engineering; Electric Engineering; Industrial Engineering;

    Deadline: May 10, 2018 | Date: May 26, 2018-May 28, 2018

    Venue/Country: Hangzhou, China, China

    Updated: 2017-12-27 16:00:13 (GMT+9)

    Call For Papers - CFP

    About conference

    The International Conference on Mechanical, Electric and Industrial Engineering (MEIE2018) will be held in Hangzhou, China during May 26-28, 2018.

    MEIE 2018 aims to provide a forum for scholars´╝îresearchers and participants all over the world to exchange their ideas and experiences. The conference is dedicated to cover all theoretical and experimental aspects of mechanical, electric and industrial engineering.

    Publication and Index

    Journal of Physics: Conference Series (IOP Publishing: JPCS)

    Online ISSN: 1742-6596

    Print ISSN: 1742-6588

    Index: EI Compendex, CPCI, Scopus, etc.

    Call for papers

    The papers may include but are not limited to:


    Biomechanics, Structural Analysis, Design and Drafting, Acoustic Engineering, Mechanical and Electrical Integration, Robotics, Computational Fluid Dynamics, Thermodynamics, Applied Mechanics, CAD/CAM/CIM, Dynamics and Vibration, Fluid Mechanics and Machinery, Fuels and Combustion, General mechanics, Machinery and Machine Design, Mechanical Power Engineering

    Industrial Engineering:

    Manufacturing System Engineering, Industrial Simulation, Industrial, Manufacturing Design, Process Engineering, Systems Engineering, Engineering Design, Quality Engineering, Ergonomics


    Analog Electronic Technology, Digital Electronic Technology, Microcomputer Principle and Application, Signals and Systems, Automatic Control Principle, Power Electronic Technology, Automatic Control System, Electrical Control Technology, Microcomputer Control Technology, Power System Analysis, Electrical Machinery, Insulation Technology, High Voltage Technology, HVDC Transmission Technology, Electromagnetic and Photonics, Microelectronics, Electronic Circuits

    Contact us


    Tel: +86-13018056523

    QQ: 2060402500

    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.