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ISMCEP 2017 - The 2017 2nd International Symposium on Materials Chemistry And Environmental Protection

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Website http://ismcep.org/index.html | Edit Freely

Category Symposium;Materials Chemistry;Environmental Protection

Deadline: December 26, 2017 | Date: December 29, 2017-December 31, 2017

Venue/Country: Guangzhou, China

Updated: 2017-11-10 15:38:31 (GMT+9)

Call For Papers - CFP

You are invited to participate in the 2017 2nd International Symposium on Materials Chemistry And Environmental Protection (ISMCEP 2017) that will be held in Guangzhou, China on December 29-31, 2017.

ISMCEP 2017 is to bring together innovative academics and industrial experts in the field of materials chemistry and environmental protection to a common forum. The primary goal of the conference is to promote research and developmental activities in materials chemistry and environmental protection and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in materials chemistry and environmental protection and related areas. 

=CFP=

2017 2nd International Symposium on Materials Chemistry And Environmental Protection (ISMCEP 2017) accepts original and unpublished papers. The papers may include but are not limited to:

(I) Chemical Engineering and Technology

(II) Material Science and Engineering

(III) Environmental protection

=Publication=

ISMCEP2017 proceeding will be published in DEStech Transactions on Engineering and Technology Research, ISSN: 2475-885X and submitted to CPCI, CNKI and Scopus.

=Contact us=

Conference Secretary: Dr.Zhu

E-mail: ISMCEP@163.com

Tel: +86-020-29036043/+86-13925093729

AEIC Website:http://www.keoaeic.org/

More information please click:http://ismcep.org/index.html 


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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