TELECOMMUNICATIONS 2018 - International Summit on Telecommunications, Cloud Computing and Wireless Technology
Website https://telecommunications.conferenceseries.com/ |
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Category Engineering;Telecommunication;Wireless Technology;Cloud computing
Deadline: June 15, 2018 | Date: August 22, 2018-August 23, 2018
Venue/Country: Singapore, Singapore
Updated: 2018-01-12 20:21:59 (GMT+9)
Call For Papers - CFP
Conference Series LLC welcomes and Invites all the participants from over the world to attend the ‘International Summit on Telecommunications, Cloud computing and Wireless technology’’ during August 22-23, 2018 at Holiday Inn Singapore Atrium, Singapore which includes prompt keynote presentations, Oral talks, Poster presentations and Exhibitions.International Summit on Telecommunications, Cloud computing and Wireless technology aims to gather the most elegant societies and industries along with the renowned and honorable persons form top engineering universities across the globe. Telecommunications 2018 on behalf of its organizing Committee welcomes all the engineering researchers, industrialists, young scientists as well as student and corporate delegates to participate and to have a great experience. The theme of the conference is ‘Emerging Innovations in Communication and Wireless technology for connecting the world’’. During Telecommunication conferences, the international symposiums, B2B meetings, international workshops will also be organized to discuss the specific topics in the field of Telecommunication, Cloud computing and Wireless technology. The conference also welcomes International exhibitions from corporate sectors to showcase the recent advancements in tools and techniques. Conference Series organizes a 1000+ Global Events inclusive of 300+ Conferences, 500+ Upcoming and Previous Symposiums and Workshops in Middle East, Asia, Europe and USA with support from 1000 more scientific societies and publishes 700+ Open access journals which contains over 30000 eminent personalities, reputed scientists as editorial board members.Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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