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BIOMETRICS TSP 2018 - 2nd International Workshop on Recent Advances in Biometrics and its Applications on 2018 41th International Conference on Telecommunications and Signal Processing (TSP) | IEEE R8 | IEEE Xplore® | SCOPUS

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Category Biometrics; Authentication and identification; Finger; palm; face; eye; ear; iris; retina; gait; handwriting; voice; Biometric image processing; feature extraction; Signal processing; machine learning; techniques in biometrics; Fusion techniques; Soft biometrics; Multimodal biometrics; Online biometric systems; Embedded biometric systems; Related applications

Deadline: March 19, 2018 | Date: July 04, 2018-July 06, 2018

Venue/Country: Athens, Greece

Updated: 2018-03-12 19:27:56 (GMT+9)

Call For Papers - CFP

*** 2nd International Workshop on Recent Advances in Biometrics and its Applications ***

*** ***

2018 41st International Conference on Telecommunications and Signal Processing (TSP)

July 4-6, 2018, Athens, Greece


FINAL DEADLINE Extension for Full Paper Submission: March 19, 2018 @ 6PM CET

Technically co-sponsored by IEEE Region 8 (Europe, Middle East and Africa), IEEE Greece Section, IEEE Czechoslovakia Section, and IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter.

The TSP 2018 Proceedings, containing presented papers at the Conference, will be submitted for indexing to the IEEE Xplore® Digital Library registered under IEEE Conference Record #43564, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

Authors of the best rated and presented papers will be invited for publishing in special issues of international journals.


Biometric recognition has become a burgeoning research area due to the industrial and government needs for security and privacy concerns. It has also become center of focus for many authentication and identification applications in the civil and forensic fields. Within the framework of the 2018 41st International Conference on Telecommunications and Signal Processing (TSP) held during July 4-6, 2018 in Athens, Greece, we invite you to the 2nd International Workshop on Recent Advances in Biometrics and its Applications organized by LIASD Laboratory of the University of Paris 8 in France. The goal of this workshop is to present and discuss the recent fundamental and applied research works providing novel solutions to challenging problems in biometrics. It is an opportunity to bring researchers and experts together to discuss the current and future state of biometrics and possible areas of further cooperation. Topics of interest include, but are not limited to, the following:

- Biometrics based authentication and identification

- Finger, palm, face, eye, ear, iris, retina, gait, handwriting, voice, etc.

- Biometric image processing, feature extraction and matching

- Signal processing and machine learning techniques in biometrics

- Fusion techniques in biometrics

- Soft biometrics

- Multimodal biometrics

- Online biometric systems

- Embedded biometric systems

- Related applications

For more details please visit the Conference website at .


- Assoc. Prof. Larbi Boubchir — LIASD - University of Paris 8, France (Editor-in-Chief,

- Prof. Boubaker Daachi — LIASD - University of Paris 8, France (


In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 3 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Certificate of Appreciation Plaque and an IEEE Student or IEEE Graduate Student membership for 2019.


The TSP 2018 is IEEE technically co-sponsored Conference organized in cooperation with seventeen universities:

- Brno University of Technology, Department of Telecommunications, Brno, Czech Republic

- Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary

- Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic

- Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey

- Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey

- Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey

- National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan

- Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan

- Slovak University of Technology, Institute of Telecommunications, Bratislava, Slovak Republic

- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain

- Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria

- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de Saint-Denis (LIASD), France

- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia

- University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia

- University of Patras, Physics Department, Patras, Greece

- VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic

- West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland


FINAL DEADLINE Extension for Full Paper Submission: March 19, 2018 @ 6PM CET

Notification of Paper Acceptance: April 15, 2018

Final Paper Submission: April 30, 2018

Authors' Early Registration and Payment: May 10, 2018

Authors' Late Registration and Payment: May 20, 2018

Listeners' Registration: July 4, 2018

Conference: July 4-6, 2018




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TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the Conference. However, this paper will be distributed as part of the Conference proceedings issued on an USB drive.

Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.