ICPADM 2009 - 2009 IEEE 9th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)
Website http://www.icpadm2009.com/info_Show.asp?ArticleID=317 |
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Category ICPADM 2009
Deadline: April 30, 2009 | Date: July 19, 2009
Venue/Country: Harbin, China
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
The 9th International conference on Properties and Applications of Dielectric Materials (ICPADM2009) will be held in Harbin, China on July 19-23, 2003. The purpose of this conference is to provide a forum for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The organizing committee cordially incites you to participate in the conference. Main TopicsElectrical Insulation in Power Apparatus and Cables (Solid, Liquid and Gas insulation)Monitoring and Diagnosis of Degradation in Insulation SystemsAging and Life-TimeDielectric Phenomena and ApplicationsPartial Discharges, Treeing and Tracking PhenomenaElectrical Conduction and Breakdown (Solid, Liquid and Gas)Surface and Interfacial PhenomenaNanotechnology for DielectricsSpace ChargeEco-friendly Dielectrics and RecyclingTest and Measurement TechniquesNew and Functional Dielectric Materials (Ceramics, Biological Materials Soft and Nanodielectrics)Dielectric Materials for Electronics and Photonics (Organic EL, Electronic and Optical Decices, etc.) Language RequiredThe working language of the conference is English. All printed materials will be available in English.Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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