AMME 2019 - 3rd International Conference on Advances in Materials, Machinery, Electronics (AMME 2019)
View: 1298
Website http://www.icamme.org/ |
Edit Freely
Category 3rd International Conference on Advances in Materials, Machinery, Electronics (AMME 2019) ; AMME 2019;AIP Congerence Proceedings (ISSN: 0094-243X, E-ISSN: 1551-7616) ; CPCI (ISTP), Scopus (Elsevier), Inspec (IET) for indexing.
Deadline: January 19, 2019 | Date: January 20, 2019-January 21, 2019
Venue/Country: wuhan, China
Updated: 2018-08-30 14:50:43 (GMT+9)
Call For Papers - CFP
3rd International Conference on Advances in Materials, Machinery, Electronics (AMME 2019)第三届材料,机械,电子进展国际会议 (AMME 2019)会议官网: http://www.icamme.org/ 国际会议期刊系列征文(Ei Compendex/ISI Proceedings科学技术会议录索引)http://www.ietr.vip/faq/viewtopic.php?f=2&t=73rd International Conference on Advances in Materials, Machinery, Electronics (AMME 2019). AMME 2019 will be held on January 19-20, 2019 in Wuhan, China.The aims of the conference is to provide an interactive platform for the academicians, R & D organizations, industries, innovators, entrepreneurs, government agencies and policy-makers etc., from both China and abroad to exchange ideas on recent researches and advances in the domain of materials, machinery, electronics with its prospective application in the various interdisciplinary domains of engineering. This two day conference is being organized in technical association with Huazhong University of Science and Technology and will include invited keynote talks and oral paper presentations from both academia and industry to ignite our young minds, to initiate them in the field of meaningful research and thereby enrich their existing knowledge.All full paper submissions to the AMME 2019 must be written in English, and will be sent to at least two reviewers and evaluated based on originality, technical or research content, correctness, relevance to conference, contributions, and readability. The full paper submissions will be chosen based on technical merit, interest, applicability, and how well they fit a coherent and balanced technical program.Accepted papers which meet the conference requirements would be published in AIP Congerence Proceedings (ISSN: 0094-243X, E-ISSN: 1551-7616) (Not finalized) and submitted to the CPCI (ISTP), Scopus (Elsevier), Inspec (IET) for indexing.MaterialsMachineryElectronicsMaterial propertiesMaterial processingMaterial moldingMicro / Nano MaterialsMaterials Physics and ChemistryBuilding MaterialsNew Energy MaterialsLaser Processing TechnologySurface Engineering/CoatingsCompositesMetal alloy MaterialsOptical/Electronic/Magnetic MaterialsEnvironmental Friendly MaterialsSmart and Intelligent MaterialsOther Relevant TopicsMechanical-electro-liquid SystemPowder Metallurgy/Casting/Sintering/Thermal Engineering/WeldingHigh-speed/precision machiningAdvanced Manufacturing TechnologyCAD/CAM Integration TechnologyComputational MechanicsPrecision Manufacturing & MeasurementSystem Dynamics and SimulationSystems Science and Systems EngineeringMechanical Dynamics and Its ApplicationsMechanical Transmission Theory and ApplicationsMechanical Reliability Theory and EngineeringTheory and Application of Friction and WearVibration, Noise Analysis and ControlDynamic Mechanical Analysis, Optimization and ControlStructural Strength and RobustnessConstruction Machinery and EquipmentOther Relevant TopicsSemiconductor DevicesOptical Networks & communicationDigital signal processingComputer ApplicationsMaterials for Electrical and Electronic DevicesPhotovoltaic System & ApplicationsPower Electronics ApplicationRadio Frequency ApplicationsRenewable Energy ApplicationsAutomation, Robotics & HumanoidSensor technology & Virtual InstrumentationSignal & Image Processing ApplicationsSoft computing / Nano computing/ Grid computingEmbedded Systems and RoboticsRemote sensing and satellite communicationOther Relevant Topics国际会议期刊系列征文(Ei Compendex/ISI Proceedings科学技术会议录索引)http://www.ietr.vip/faq/viewtopic.php?f=2&t=7联系信息:QQ:1422679111E-Mail: infoietr.vipWebsite:http://www.ietr.vip/web.htmlQQ群:336456792 427299873
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.