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    WIP 2011 - Work in Progress 9th IEEE International Conference on Pervasive Computing and Communications PerCom 2011

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    Website www.percom.org | Want to Edit it Edit Freely

    Category WIP 2011

    Deadline: October 31, 2010 | Date: March 21, 2011-March 25, 2011

    Venue/Country: Seattle, U.S.A

    Updated: 2010-07-25 17:04:45 (GMT+9)

    Call For Papers - CFP

    Work in Progress

    9th IEEE International Conference on

    Pervasive Computing and Communications

    PerCom 2011

    Seattle, USA, March 21 - March 25, 2011

    The work-in-progress (WiP) session, included in PerCom for the sixth year, gives its participants an opportunity to present and discuss early and emerging results and bring about novel research questions, approaches, and directions. The specific aim of the WiP session is to provide a forum for timely presentation, discussion and feedback for novel, controversial, and thought provoking ideas. All selected papers will be presented as posters in a special WiP conference session and included in PerCom workshop proceedings to be published by IEEE and included in the digital library.

    ontributions are solicited in all areas of pervasive computing research and applications. Papers are expected to report on early or ongoing research on any aspect of pervasive computing and communications. Novel approaches and results are especially sought for as is ongoing experimentation.

    Topics:

    Topics of interest include, but are not limited to:

    Innovative pervasive computing applications

    Software engineering aspects of pervasive computing

    Middleware services and agent technologies

    Smart grid sensing, control and communications

    Social and economics aspects of pervasive computing

    Wearable systems

    Ambient ecologies

    Multimodal sensing and context for pervasive applications

    Pervasive sensing, perception and semantic interpretation

    Pervasive opportunistic communications and applications

    Enabling technologies for pervasive systems (e.g., wireless BAN, PAN)

    Positioning and tracking technologies

    Virtual and immersive systems, cognitive pervasive architectures

    Adaptive, autonomic and context-aware computing

    Mobile/Wireless computing systems and services in pervasive computing

    Energy-efficient and green pervasive computing

    Communication architectures for pervasive computing

    Ad hoc networks for pervasive communications

    Sensors and RFID in pervasive systems

    Social and economic models for pervasive systems

    Submission Guidelines:

    Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format (two-column format with a 4-page limit including figures, tables, and references) in PDF format that include contact information of all the authors to the EDAS submission site.

    If you have any questions, please send email to the WIP chair.

    The submitted manuscripts will be reviewed by the WiP Program Committee. The authors of accepted papers will present their work during the main conference in a special WiP poster session and must register for the conference. The papers of the WiP session will be published in the proceedings of the Eighth Annual IEEE International Conference on Pervasive Computing and Communications.

    Important Dates:

    Paper submissions: October 31, 2010 (any time zone)

    Notification of acceptance: January 7, 2011

    Camera-ready copy due: January 28, 2011

    Conference date: March 21 - 25, 2011

    IEEE PerCom 2010 WiP Co-Chairs:

    WenZhan Song, Washington State University Vancouver, USA

    Daniela Nicklas, Carl von Ossietzky Universitat Oldenburg, Germany

    Technical Program Committee:

    Martin Bauer, NEC European Laboratories, Heidelberg, Germany

    Geoffrey Challen, University at Buffalo, State University of New York, USA

    Klaus David, Universitat Kassel, Germany

    Yongji Fu, Sharp Laboratories of America, USA

    Guangyu Pei, Boeing Phantom Works, USA

    Anand Ranganathan, IBM Research, USA

    Matthias Wieland, Universitat Stuttgart, Germany

    Dan Wang, Hong Kong Polytechnic University, Hong Kong

    Weiyi Zhang, North Dakota State University, USA


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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