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ICETIS 2019 - 2019 4th International Conference on Electronic Technology and Information Science

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Category Electronic Technology;Information Science

Deadline: January 04, 2019 | Date: February 22, 2019-February 24, 2019

Venue/Country: Shenzhen, China

Updated: 2018-11-09 17:07:38 (GMT+9)

Call For Papers - CFP

About the conference:

2019 4th International Conference on Electronic Technology and Information Science (ICETIS 2019) will be held on February 22-24, 2019 in Shenzhen,China. ICETIS 2019 is to bring together innovative academics and industrial experts in the field of electronic technology and information science to a common forum. The primary goal of the conference is to promote research and developmental activities in electronic technology and information science and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in electronic technology and information science and related areas.

We warmly invite you to participate in ICETIS 2019 and look forward to seeing you in Shenzhen!



Papers submitted to ICETIS 2019 will be reviewed by technical committees of the conference. All accepted full papers will be published by MATEC Web of Conferences(ISSN(Electronic Edition): 2261-236X) and will be submitted to EI Compendex, Scopus and CPCI for indexing.


Selected 10 papers will be recommended for publication in SCI journal.

1)ACM Transactions on the Web (ISSN: 1559-1131), IF=1.526

2)Cognitive Systems Research (ISSN: 1389-0417), IF=1.182

3)The Computer Journal (ISSN: 0010-4620), IF=0.792

*All submissions must not be less than 10 pages in length,and papers should be submitted to ICETIS@163.COM , and noted SCI.

Call For Papers

The topics of interest for submission include, but are not limited to:

I. Electronics Engineering

1. 3D Semiconductor Device Technology

2. Adaptive Signal Processing

3. Advanced Electromagnetics

4. Artificial Intelligence

5. Component Technology of MEMS

6. Compound Semiconductor Physics and Devices

7. Computer Engineering

8. Device Electronics for I.C

9. Electronics System-Level Based Design

10. Electronics & Nano Electronics

11. Electronics-Medical Electronics

12. Epitaxy and Light-emitting Diodes

13. Fiber Optics and Fiber Devices

14. Giant Area Microelectronics

15. Intelligent Transportation Systems

16. Integrated Optics

17. Medicine and Biology Applications

18. Micro/Nano Systems and Networks

19. Mixed Signal Circuits

20. Mobile Computing

21. Mobile Robotics

22. Multimedia Services and Technologies

23. Networks Design, Protocols and Management

24. Optical Electronic Devices & Photonics

25. Radio-Frequency Integrated Circuits

26. Signal & Image Processing

27. VLSI Testing and Design for Testability

II.Mechanical Engineering

28. Mechanical Dynamics and Vibration

29. Mechanical Strength

30. Mechanical Friction, Wear an.d Lubrication

31. Mechanical Design

32. Robot Technology and Applications

33. Vehicle Engineering

III. Computer Engineering

34. Algorithms

35. Artificial Intelligence

36. Automated Software Engineering

37. Bioinformatics and Scientific Computing

38. Computer-aided Design

39. Computer Animation

40. Computer Architecture

41. Computing Ethics

42. Computer Modeling

43. Computer Networks

44. Computer Security

45. Computer Simulation

46. Database and Data Mining

47. Data Compression

48. Data Encryption

49. Data Mining

50. Digital Signal and Image Processing

51. Digital System and Logic Design

52. Expert Systems

53. Image Processing

54. Information Systems

55. Internet and Web Applications

56. Mobile Computing

57. Network Security and Cryptography

58. Multimedia Applications

59. Multimedia Networking

60. Mobile Wireless Networks

61. Programming Languages

62. Wireless Communication

63. Wireless Sensor Network

IV.Other related topics

Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.