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ICICM 2019 - 2019 The 4th International Conference on Integrated Circuits and Microsystems (ICICM 2019)--Ei Compendex and Scopus

View: 358

Website http://www.icicm.net/ | Edit Freely

Category Integrated Circuits;Microsystems;Digital

Deadline: August 30, 2019 | Date: October 25, 2019-October 27, 2019

Venue/Country: Beijing, China

Updated: 2019-07-12 15:36:15 (GMT+9)

Call For Papers - CFP

★ICICM 2019--IEEE Xplore,Ei Compendex and Scopus★

2019 The 4th International Conference on Integrated Circuits and Microsystems (ICICM 2019)--Ei Compendex and Scopus

Time: October 25-27, 2019

Place: Beijing, China

http://www.icicm.net/

==Publication: Conference Proceeding

==Indexed by: IEEE Xplore,Ei Compendex, and Scopus*

==Submission email:icicm@young.ac.cn (Or you still can submit to the submission system on website)

==Find the tempalte with the link:http://www.icicm.net/Template.doc

★ICICM Committees★

★Advisory Chairs

Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA

Prof. Meng-Fan (Marvin) CHANG, National Tsing Hua University (NTHU), Taiwan

★Conference Chairs

Prof. Zhigong Wang, Southeast University, China

Prof. Li Qiang, University of Electronic Science and Technology of China, China

★Conference Co-Chair

Prof. Gene Eu Jan, National Taipei University, Taiwan

★Program Chairs

Prof. Fei Yuan, Ryerson University, Canada

Prof. Zhi-Jian Xie, North Carolina A&T State University, USA

★Steering Committee Chair

Prof. Huang Le Tian, University of Electronic Science and Technology of China, China

★Technical Committee

Prof. Bo Yan, University of Electronic Science & Technology of China, China

Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India

Prof. Xiaoxiao Wang, BeiHang University, China

Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China

Prof. Jinzhao Wu, Guangxi University for Nationalities, China

Prof. Shiwei Feng, Beijing University of Technology, China

Assoc. Prof. Wei Ni, Hefei University of Technology, China

Assoc. Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications, China

Assis. Prof. Li Jiang, Shanghai Jiao Tong University, China

Prof. Jinyan Wang, Peking University, China

Prof. Zhi-Jian Xie, NC A&T State University, USA

Prof. S. Ushakumari, College of Engineering Trivandrum, India

Prof. Lu Tang, Southeast University, China

Prof. Haizhi Song, University of Electronic Science and Technology of China, China

Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China

Prof. Shiwei Feng, Beijing University of Technology,China

For more members, please visite conference website: http://www.icicm.net/committee.html

★★History

Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3

Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0

Papers of ICICM2018 can be checked in IEEE Xplore now!

Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5

★TOPICS

Digital, Analog, Mixed Signal IC and SOC design technology

Silicon integrated circuits and manufacturing

Low-power, RF devices & circuits

IC Computer-Aided –Design technology, DFM

Silicon/germanium devices and device physics

Interconnect, Low K, High K and other process technologies

Unconventional and nano-electronics

Organic semiconductor devices and technologies

Compound semiconductor devices and circuits

Displays, sensors and MEMS

Semiconductor materials and material characterization

Packaging and testing technology

Solar cell & other devices for new energy sources

Modeling and simulation

Equipment technology

Reliability

Displays, sensors and MEMS

Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

★Support

1, Technical Support from IEEE

2, Sponsored by University of Electronic Science and Technology of China and Southeast University, China

★Conference Contact

Ms Sissi Chan

Email: icicm@young.ac.cn

Tel: +86-28-87777577


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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