DSDE 2026 - 9th International Conference on Data Storage and Data Engineering (DSDE 2026)
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Website http://www.dsde.org/ |
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Category Data Storage and Data Engineering
Deadline: February 20, 2026 | Date: March 27, 2026-March 29, 2026
Venue/Country: Chengdu, China
Updated: 2025-12-30 17:30:12 (GMT+9)
Call For Papers - CFP
2026 The 9th International Conference on Data Storage and Data Engineering(DSDE 2026)June 12-14, 2026 | Chengdu, ChinaWe are delighted to invite you to join the 9th International Conference on Data Storage and Data Engineering (DSDE 2026), which will take place during June 12-14, 2026 in Chengdu, China. Co-organized by Southwestern University of Finance and Economics, China and Southwest University of Science and Technology, China, this conference serves as a platform for researchers, academics, industry professionals, and experts in the field of data storage and data engineering to come together and exchange knowledge, ideas, and insights.We look forward to welcoming you to DSDE 2026 in Chengdu, where you will join a community of passionate professionals and contribute to shaping the future of data storage and data engineering.PublicationAll papers will be strictly double blind reviewed by the program committee, and accepted papers of DSDE 2026 after proper registration and presentation will be published in in the International Conference Proceedings Series by ACM (ISBN: 979-8-4007-2106-9), which will be submitted for indexing by Ei Compendex, Scopus, etc.DSDE 2025 conference proceedings (ACM-ISBN: 979-8-4007-1039-1) has been indexed by Ei Compendex and Scopus.DSDE 2024 conference proceedings (ACM-ISBN: 979-8-4007-1693-5) has been indexed by Ei Compendex and Scopus.DSDE 2023 conference proceedings (IEEE CPS-ISBN: 979-8-3503-3314-5) has been indexed by Ei Compendex and Scopus.DSDE 2022 conference proceedings (ACM-ISBN: 978-1-4503-9572-4) has been indexed by Ei Compendex and Scopus.DSDE 2021 conference proceedings (ACM-ISBN: 978-1-4503-8930-3) has been indexed by Ei Compendex and Scopus.DSDE 2019 conference proceedings (ACM-ISBN: 978-1-4503-7216-9) has been indexed by Ei Compendex and Scopus.Organizing CommitteeHonorary ChairsGuisong Liu, Southwestern University of Finance and Economics, ChinaLin Chen, Southwest University of Science and Technology, ChinaConference ChairsXuemin Lin (FMAE, FIEEE), Shanghai Jiaotong University, ChinaGao Cong, Nanyang Technological University, SingaporeXin Yang, Southwestern University of Finance and Economics, ChinaYong Fan, Southwest University of Science and Technology, ChinaConference Co-chairsPeiquan Jin, University of Science and Technology of China, ChinaJianxin Li, Edith Cowan University, AustraliaTechnical Program Committee ChairsSim Kwan Yong, Swinburne University of Technology Sarawak Campus, MalaysiaJiafen Liu, Southwestern University of Finance and Economics, ChinaHyuk-Yoon Kwon, Seoul National University of Science & Technology, South KoreaYannis Manolopoulos, University of York, Europe Campus, GreeceZhao Zhang, Hefei University of Technology, ChinaMingbo Zhao, Donghua University, ChinaHui Zhang, Southwest University of Science and Technology, ChinaLiang Zhao, Shenyang Aerospace University, ChinaPublication ChairXujian Zhao, Southwest University of Science and Technology, ChinaPublicity ChairZhiwei Xu, Haihe Laboratory of Information Technology and Application Innovation, ChinaTrack ChairMary Jane Samonte, Mapua University, PhilippinesRegional ChairsHamidah Ibrahim, University Putra Malaysia, MalaysiaVasile Avram, Bucharest University of Economic Studies, RomaniaYixiang Fang, The Chinese University of Hong Kong, Shenzhen, ChinaChengcheng Yang, East China Normal University, ChinaLocal Organizing SecretaryYonghao Li, Southwestern University of Finance and Economics, ChinaLocal Organizing CommitteesChunming Yang, Southwest University of Science and Technology, ChinaYin Long, Southwest University of Science and Technology, ChinaKeynote/Invited SpeakersProf. Jiangtao Cui, Xidian University, ChinaProf. Zhize Wu, Hefei University, ChinaProf. Xuchuan Zhou, Southwest Minzu University, ChinaProf. Chinthaka Premachandra, Shibaura Institute of Technology, JapanProf. Mohan Lal Kolhe, University of Agder, NorwayProf. Su-Cheng Haw, Multimedia University, MalaysiaAssoc. Prof. He Li, Muroran Institute of Technology, JapanTopicsTopics of interest for submission include, but are not limited to:BIG DATA AND ANALYTICS: ▪ Big Data Applications and Case Studies ▪ Computational Models for Big Data ▪ Data Standards and Interoperability ▪ Social Data Analytics and Web Mining ▪ Big Data as a Service ▪ Big Data Infrastructure and Cloud/Grid/Stream ComputingDATA MANAGEMENT AND QUALITY: ▪ Architectural Concepts for Data Management ▪ Mobile Data Management and IoT Data ▪ Large Data Systems Modeling and Management ▪ Open Data and Transparency in Research Data ▪ Smart Cities and Urban Data Analytics ▪ Data and Information Quality ManagementDATA SCIENCE AND MACHINE LEARNING: ▪ Data Fusion and Integration ▪ Pattern Recognition and Predictive Modeling ▪ Support Vector Machines and Hybrid Methods ▪ Data Mining and Knowledge Discovery ▪ Deep Learning and Neural Network Applications ▪ Evolutionary Computing and OptimizationDATABASES AND DATA SECURITY: ▪ Database Architecture and Performance Optimization ▪ Large-Scale and Distributed Databases ▪ Mobile and NoSQL Databases ▪ Object-Oriented and Open Source Databases ▪ Query Processing and Optimization ▪ Data Integrity and ConsistencyFor more topics, please visit: http://dsde.org/CFP.html
Submission GuidelineEnglish is the official language. Paper should be prepared and presented in English. Full paper (no less than 8 full Pages) submission is required for Publication and Presentation. For presentation only, just send us the abstract.Submission: - By online submission system: http://confsys.iconf.org/submission/dsde2026
- Or Submit to dsde_contact
163.com as attachmentContact usConference secretary: Ms. Yolanda DongEmail: dsde_contact
163.comTel.: +86-18080013977Website: http://www.dsde.org/
Office Hour: Monday-Friday, 9:30-18:00 (GMT+8)
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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