ICEEE 2026 - 9th International Conference on Electrical and Electronics Engineering (ICEEE 2026)

Website https://iceee2026.org/index | Edit Freely

Category ICEEE 2026

Deadline: January 17, 2026 | Date: March 30, 2026-March 31, 2026

Venue/Country: Australia

Updated: 2026-01-14 13:16:13 (GMT+9)

Call For Papers - CFP

March 30 ~ 31, 2026, Virtual Conference

https://iceee2026.org/index

SCOPE

9th International Conference on Electrical and Electronics Engineering (ICEEE 2026) serves as a premier global forum dedicated to advancing research, innovation, and industrial applications across the full spectrum of Electrical and Electronics Engineering. The conference aims to bring together leading researchers, academicians, industry professionals, and practitioners to exchange knowledge, discuss emerging trends, and explore cutting edge developments shaping the future of the field.

ICEEE 2026 provides a dynamic platform for presenting original research contributions, breakthrough technologies, and stateoftheart reviews. The conference welcomes high quality submissions that highlight novel ideas, experimental results, theoretical advancements, and real world industrial experiences. Contributions may include research papers, case studies, survey articles, and project demonstrations that showcase significant progress in Electrical and Electronics Engineering.

Authors are invited to submit manuscripts that illustrate innovative methodologies, practical implementations, and impactful findings across a wide range of topics. Submissions may address, but are not limited to, the areas listed below, reflecting both foundational disciplines and emerging frontiers within the field.

Topics of interest

Power, Energy & Control Systems

Smart Grids, Microgrids& Distributed Energy Systems

Renewable & Sustainable Energy Technologies

Power Electronics for Electric Vehicles & Transportation

Fast Charging Systems & Vehicle to Grid (V2G) Technologies

Energy Storage Systems & Battery Management

High Voltage Engineering & Protection Systems

Intelligent Control Systems & Automation

Power System Stability, Optimization & Resilience

Electronics, Circuits & Semiconductor Technologies

Analog, Mixed Signal & RF Circuit Design

High Performance Digital & Low Power Circuit Design

Nanoelectronics, 2D Materials & Emerging Semiconductor Devices

Neuromorphic, Spintronic & Quantum Devices

VLSI, SoC, NoC & Hardware Security

Electronic Packaging, Reliability & Thermal Management

Flexible, Printed & Organic Electronics

Electronic & Photonic Materials

Communication, Networking & Signal Processing

5G/6G Wireless Systems & Beyond

Terahertz Communications & Reconfigurable Intelligent Surfaces (RIS)

Optical Communication & Photonic Integrated Circuits

Satellite, UAV & Space Communications

IoT, Edge Computing & Cyber Physical Systems

AI Driven Signal Processing & Communication Optimization

Network Security, Privacy & Blockchain Enabled Systems

Computational Imaging & Compressive Sensing

Electromagnetics, Antennas & Wave Engineering

Advanced Antenna Design (MIMO, mmWave, THz)

Metamaterials & Meta surfaces

Electromagnetic Compatibility (EMC/EMI)

Computational Electromagnetics & Wave Propagation

Embedded Systems, Robotics & Intelligent Machines

Embedded AI, TinyML & Real Time Systems

Robotics, Mechatronics & Autonomous Systems

Autonomous Navigation, SLAM & Sensor Fusion

Drones, UAV Navigation & Human Robot Interaction

Avionics & Aerospace Electronics

Cyber Physical Systems & Digital Twins

Industrial Automation & Smart Manufacturing

Embedded Security & Safety Critical Systems

Biomedical Engineering & Healthcare Technologies

Biomedical Instrumentation & Wearable Health Devices

Medical Imaging, Diagnostics & Bio signal Processing

Neural Engineering, Brain Machine Interfaces & Prosthetics

Bioelectronics, BioMEMS & LabonChip Systems

AI in Healthcare & Computational Biology (EEE aligned)

Sensing, Imaging & Remote Technologies

Advanced Sensor Technologies, MEMS/NEMS & Smart Sensing

LiDAR, Radar, Multispectral & Hyperspectral Imaging

Earth Observation, Remote Sensing & Geospatial Technologies

Virtual Instrumentation & Precision Measurement Systems

Computing, AI & Emerging Technologies

Machine Learning, Deep Learning & Generative AI for Engineering

Trustworthy AI, Explainable AI & Safe ML

Quantum Computing & Quantum Information Systems

Cloud, Edge & Distributed Computing Architectures

High Performance Computing & GPU/FPGA Acceleration

Evolutionary Algorithms, Swarm Intelligence & Optimization

Interdisciplinary & Frontier Technologies

Smart Cities, Intelligent Transportation & Infrastructure

Internet of BioNano Things (IoBNT)

Green Electronics & Sustainable Engineering

Space Electronics, Radiation Hardened Systems & Deep Space Instrumentation

AR/VR/MR Systems & Human Centered Computing

Important Dates

2nd batch: Submissions after Dec 29, 2025

Submission Deadline :January 17, 2026

Authors Notification : February 14, 2026

Registration & Camera-Ready Paper Due : February 21, 2026

Contact Us

Here’s where you can reach us : iceeeiceee2026.org (or) iceeeconf29gmail.com