ICMSE-26 2026 - 22nd ATHENS International Conference on Materials Science & Engineering (ICMSE-26)

Website https://eamae.erpub.org/conference/203 | Edit Freely

Category Materials Science & Engineering

Deadline: May 15, 2026 | Date: June 03, 2026-June 05, 2026

Venue/Country: Athens, Greece

Updated: 2026-01-05 18:49:29 (GMT+9)

Call For Papers - CFP

Topics of Interest for Submission include, but are Not Limited to:

1. Fundamentals of Materials Science

This area covers the "why" behind material behavior at the atomic level.

Atomic Structure and Bonding:

Quantum mechanics of atoms.

Primary bonds (Ionic, Covalent, Metallic).

Secondary bonds (Van der Waals, Hydrogen bonding).

Crystallography and Crystal Structures:

Unit cells and Bravais lattices.

Miller indices (planes and directions).

Crystalline vs. Amorphous materials.

Polymorphism and Allotropy.

Imperfections in Solids:

Point defects (Vacancies, Interstitials, Schottky/Frenkel defects).

Line defects (Dislocations: Edge, Screw, and Mixed).

Interfacial defects (Grain boundaries, Twin boundaries).

Bulk or volume defects.

2. Thermodynamics and Kinetics

These topics govern how materials change over time and under different environmental conditions.

Thermodynamics of Materials:

Laws of thermodynamics applied to solids.

Phase equilibria and Gibbs Phase Rule.

Free energy-composition diagrams.

Phase Diagrams:

Unary and Binary systems.

Eutectic, Eutectoid, Peritectic, and Peritectoid reactions.

The Iron-Carbon system ($Fe-Fe_3C$).

Kinetics and Diffusion:

Fick’s First and Second Laws of Diffusion.

Mechanisms of diffusion (Vacancy vs. Interstitial).

Nucleation and growth kinetics.

TTT (Time-Temperature-Transformation) diagrams.

3. Classes of Materials

Materials are generally categorized based on their chemical makeup and physical properties.

Metals and Alloys:

Ferrous alloys (Steels and Cast irons).

Non-ferrous alloys (Aluminum, Titanium, Magnesium, Copper).

Superalloys for high-temperature applications.

Ceramics and Glasses:

Structure of ionic crystals.

Traditional vs. Advanced ceramics.

Glass transition temperature and silicate structures.

Polymers:

Molecular weight and Degree of polymerization.

Thermoplastics vs. Thermosets.

Crystallinity in polymers.

Elastomers.

Composites:

Particle-reinforced vs. Fiber-reinforced.

Matrix types (MMC, CMC, PMC).

Rule of Mixtures.

4. Material Properties

This describes how a material responds to external stimuli.

Mechanical Properties:

Stress-strain behavior (Elastic and Plastic deformation).

Hardness, Toughness, and Ductility.

Fracture mechanics (Brittle vs. Ductile).

Fatigue and Creep.

Electrical Properties:

Conductivity and Resistivity.

Energy band structures.

Semiconductors (Intrinsic vs. Extrinsic).

Dielectrics and Piezoelectricity.

Thermal Properties:

Heat capacity and Thermal expansion.

Thermal conductivity.

Thermal shock resistance.

Magnetic and Optical Properties:

Diamagnetism, Paramagnetism, Ferromagnetism.

Refraction, Reflection, and Absorption.

Photoluminescence and Lasers.

5. Processing and Manufacturing

How we turn raw materials into useful shapes and components.

Metal Processing: Casting, Forging, Rolling, Extrusion, and Powder Metallurgy.

Polymer Processing: Injection molding, Blow molding, and 3D printing (Additive Manufacturing).

Ceramic Processing: Pressing, Slip casting, and Sintering.

Heat Treatment: Annealing, Quenching, Tempering, and Precipitation hardening.

6. Advanced and Functional Materials

Modern frontiers in MSE.

Nanomaterials: Carbon nanotubes, Graphene, and Quantum dots.

Biomaterials: Biocompatibility, Implants, and Tissue engineering.

Electronic/Optoelectronic Materials: Thin films and Photovoltaics.

Smart Materials: Shape memory alloys and Electroactive polymers.

Energy Materials: Battery electrodes, Fuel cells, and Supercapacitors.

7. Characterization Techniques

The tools used to "see" and measure material attributes.

Microscopy: Optical, SEM (Scanning Electron), and TEM (Transmission Electron).

Diffraction: X-ray Diffraction (XRD).

Spectroscopy: XPS, EDX, and FTIR.

Thermal Analysis: DSC (Differential Scanning Calorimetry) and TGA (Thermogravimetric Analysis).