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MSSD 2019 - 2019 International Conference on Material Science and Semiconductor Devices (MSSD2019)

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Website https://www.keoaeic.org/MSSD2019 | Edit Freely

Category Conference on Material Science;Semiconductor Devices;MSSD2019

Deadline: November 08, 2019 | Date: November 15, 2019-November 17, 2019

Venue/Country: shenzhen, China

Updated: 2019-07-30 17:10:26 (GMT+9)

Call For Papers - CFP

important information:

Website URL: https://www.keoaeic.org/MSSD2019

Start Date / End Date: November 15-17, 2019

Location: Shenzhen, China.

Submission Deadline: September 20, 2019

1.About the conference:

2019 International Conference on Material Science and Semiconductor Devices (MSSD2019) will be held on November 15-17, 2019 in Shenzhen, China. The aim is to provide an international platform for experts, engineers, researchers in material science and semiconductor devices to share research results and advanced technology. The conference also discusses the trend of academic development and helps to bridge the R&D results with industry. Another goal is to promote the establishing of business or research relations among global partners for future collaboration.We sincerely invite you to participate in MSSD 2019 and hope this event could meet and exceed your anticipation.

2.Publication

- Submit to the Conference

All accepted papers of MSSD 2019 will be published in the IOP Conference Series: Materials Science and Engineering(MSE) (ISSN:1757-8981), which will be submitted to EI Compendex (CPX), SCOPUS, CPCI for indexing.

*All submissions must not be less than 4 pages in length and papers should be submitted to ICMSSD@yeah.net.

- Submit to the SCI journal

*All submissions must not be less than 10 pages in length and papers should be submitted to service@keoaeic.org and noted "SCI-ICMSSD".

Journal 1 (IF≈2.2): Study on the structure of chemical species;

Journal 2 (IF≈0.9): Energy-related technologies, science and equipments, thermals.

Journal 3(IF≈1): Bionic and Nano-biomaterials

Journal 4(IF≈1.6): New technology and application to promote the development of Engineering Composite Materials.

3.Important Dates

Submission Deadline:September 20, 2019

Notification Date: 1-2 weeks after submission

Registration Deadline:November 13, 2019

Conference Date:November 15-17, 2019

4.Submission Guides

- EI submission

Please submit the full paper(word+pdf) and Paper Submission Form to ICMSSD@yeah.net. You can download the EI template on the official website.

- SCI submission

Please submit the full paper(word+pdf) and Paper Submission Form to service@keoaeic.org. You can download the SCI template on the official website.

5.Call For Papers

Material Science

(1) Fundamentals of Materials Science

(2) Material science and engineering

(3) Applications of Materials Science and Technology

More Related Topics

Semiconductor Devices

(1) Semiconductor Materials and Applications / Semiconductor Processing;

(2) Emerging Semiconductor Technologies;

(3) Novel Semiconductor Devices and Applications;

More Related Topics

Other related topics

6.Registration

Items

Registration fee (By US Dollar)

Regular Registration (4-6 pages)

450 USD/per paper

Additional Paper (4-6 pages)

430 USD/per paper

Extra Pages (Begin at Page 7)

50 USD/per extra page

Attendees without Papers

230 USD/per person

Attendees without Papers (Groups)

200 USD/per person (≥ 3 persons)

Purchase Extra Journal

75 USD/book

7.Schedule

Schedule

November15

13:00-17:00

Registration

November 16

09:00-12:00

Speeches of Keynote Speakers

12:00-14:00

Lunch

14:00-17:30

Oral Presentations

18:00-19:30

Banquet

November17

09:00-18:00

Academic Investigation

*A more detailed programme will be determined one month before the conference. Actual arrangements may be a little different from the table above because of the number of participants.

8.Contact Us

Conference Secretary: Ms. Xie

E-mail: ICMSSD@yeah.net

Tel: +86-13922157864 (cellphone)

WeChat: 13922157864

QQ: 1966347161

Website URL: https://www.keoaeic.org/MSSD2019

微信图片_20190730144949.jpg


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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