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    ICEDA 2026 - 6th International Conference on Electron Devices and Applications (ICEDA 2026)

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    Website https://www.iceda.org/ | Want to Edit it Edit Freely

    Category Electron Devices and Applications

    Deadline: November 05, 2026 | Date: December 11, 2026-December 13, 2026

    Venue/Country: Shenzhen, China

    Updated: 2026-02-09 17:37:42 (GMT+9)

    Call For Papers - CFP

    Full Name: 2026 The 6th International Conference on Electron Devices and Applications (ICEDA 2026)

    Abbreviation: ICEDA 2026

    Shenzhen, China | December 11-13, 2026

    Website: https://www.iceda.org/

    Publication

    All papers will be strictly double blind reviewed by the program committee and reviewers, and accepted papers after proper registration and presentation will be published in the International Conference Proceedings.

    Topics (Topics of interest for submission include, but are not limited to:)

    Track 1: Semiconductor Devices & Materials

    ▪ Advanced semiconductor materials (SiC, GaN, 2D materials)

    ▪ High-performance transistors (FinFET, GAA, TFET)

    ▪ Power semiconductor devices and modules

    ▪ MEMS/NEMS devices and sensors

    Track 2: Integrated Circuits & VLSI Design

    ▪ Analog/mixed-signal IC design

    ▪ RF and millimeter-wave integrated circuits

    ▪ Low-power and energy-efficient ICs

    ▪ 3D/heterogeneous integration technologies

    Track 3: Optoelectronics & Photonic Devices

    ▪ Photodetectors and image sensors

    ▪ LEDs, lasers, and display technologies

    ▪ Silicon photonics and plasmonics

    ▪ Optical communication devices

    Track 4: Power Electronics & Energy Devices

    ▪ Power converters and inverters

    ▪ Energy harvesting devices and systems

    ▪ Battery management systems (BMS)

    ▪ Electric vehicle power electronics

    Track 5: Emerging Technologies & Applications

    ▪ Quantum computing devices

    ▪ Bioelectronics and implantable devices

    ▪ Wearable and IoT sensor technologies

    ▪ Printed and large-area electronics

    Track 6: Device Modeling, Fabrication & Reliability

    ▪ Circuits, Devices and Systems

    ▪ Compact modeling of electron devices

    ▪ Process simulation and TCAD tools

    ▪ Advanced lithography and nanofabrication

    For more topics, please visit: https://www.iceda.org/cfp.html.

    Submission Instructions

    - English is the official language. Paper should be written and presented only in English.

    - If you want to make a presentation and publish your paper, submit a full paper (5-6 pages, two columns); just want to make a presentation, abstract (200-400 words) is enough.

    - If the length of the full paper exceeds 6 pages, extra page will be charged at 60 USD/400 RMB/Page.

    - Submission:

    1) By online submission system: https://confsys.iconf.org/submission/iceda2026

    2) By Email: iceda_contactat163.com

    3) Template: Please format your paper according to the template (https://www.iceda.org/download/template.docx) before submission.

    Contact us

    Conference secretary: Miss Adela Zhong

    Email: iceda_contactat163.com

    Tel: +86-19180927671

    Website: https://www.iceda.org/

    Office Hours: 9:30--18:00, Monday to Friday (GMT+8 Time Zone)


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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