ECIE 2022 - 2022 2nd International Conference on Electronics, Circuits and Information Engineering (ECIE 2022)

Website http://www.confecie.org/ | Edit Freely

Category EI；Scopus

Deadline: January 03, 2022 | Date: January 07, 2022-January 09, 2022

Venue/Country: Xiamen, China

Updated: 2021-12-16 12:11:33 (GMT+9)

Call For Papers - CFP

Website：http://www.confecie.org/

Conference Date：7th - 9th, January 2022

Venue: Xiamen, China

Submission Deadline: 3rd January, 2022

Index：EI, Scopus

2022 2nd International Conference on Electronics, Circuits and Information Engineering (ECIE 2022) will be held from 7th to 9th, January 2022 in Xiamen, China. ECIE2022 is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Electronics, Circuits, and Information Engineering. Conference topics mainly include but are not limited to Software engineering, Power and energy circuits, Optoelectronics, Single-chip microcomputer technology, etc. ECIE 2022 welcomes all high-quality research papers and presentations from related research fields.

1.Guest structure

Conference Chair

Prof. Gheorghe-Daniel Andreescu, Politehnica University Timisoara, Romania

Prof. Abderrahim Maizate, HASSAN II UNVERSITY, Morocco

Committee members

Organizing Committee

Dr. Mohd Azrik bin Roslan, Universiti Malaysia Perlis, Malaysia

A/Prof. Samila binti Mat Zali, Universiti Malaysia Perlis, Malaysia

Dr. Latifah binti Mohamed, Universiti Malaysia Perlis, Malaysia

Dr. Mohamad Nur Khairul Hafizi Bin Rohani, Universiti Malaysia Perlis, Malaysia

Dr. Mohd Rafi Bin Adzman, Universiti Malaysia Perlis, Malaysia

Dr. Syahrul Ashikin Azmi, Universiti Malaysia Perlis, Malaysia

A/Prof. Akhtar Nawaz Khan, UET Peshawar, Pakistan

A/Prof. Akshaya Kumar Pati, KiiT University, India

Dr. Amparo FUSTER-SABATER, Institute of Physical and Information Technologies (CSIC), Spain

Technique Programme Committee

Prof. Ghaleb HOBLOS, ÉCOLE D'INGÉNIEURS-ES GÉNÉRALISTES, France

A/Prof. Linquan Bai, University of North Carolina at Charlotte, USA

Prof. Kazi Md. Rokibul Alam, Khulna University of Engineering & Technology, Bangladesh

Prof. Ashraf A.M. Khalaf, Minia University, Egypt

A/Prof. T. R. Lenka, National Institute of Technology Silchar, India

A/Prof. Dhafer Almakhles, Prince Sultan University, Saudi Arabia

Dr. Mahajan Sagar Bhaskar, Prince Sultan University, Saudi Arabia

A/Prof. Sushmita Sarkar, R V College of Engineering, India

Dr. Robert Bestak, Czech Technical University in Prague, Czech Republic

Prof. Weigang Hou, Chongqing University of Posts and Telecommunications, China

Prof. Shuming Yang, Xi'an Jiaotong University, China

Keynote speaker

Prof. Ghani Albaali

Princess Sumaya University for Technology, Jordan

Prof. Debashis De

MAKAUT, WB, India

Prof. Weigang Hou

Chongqing University of Posts and Telecommunications, China

Prof. Kai Yang

Huazhong University of Science and Technology (HUST), China

Prof. Jie Sun

Fuzhou University, China

Prof. Haizhong Zhang

Fuzhou University, China

2. Call for papers

The conference covers all aspects of technologies, applications, and services. The topics of interest are not limited to:

VLSI Design and Fabrication

Semiconductor Devices and Circuits

Parallel and distributed computing

Measurement and Control Technology and Instrument

Test and Reliability

Communication theories and systems

Sensing and sensor networks

Single-chip microcomputer technology

Geographic information system

Low power consumption and acquisition technology

Electromagnetic Compatibility

Electric vehicle technology

Electrotechnics

Electric machine and electric appliances

Power electronics and its application

Power and energy circuits

Power System and Automation

Power system reliability and safety

Power system communication

Circuit simulation and modeling

Circuits and Systems

Power quality and electromagnetic compatibility

Computational Intelligence in Electrical Engineering

Electronic design automation

Multimedia system and signal processing

Bionic information processing method and technology

Distributed generation, fuel cell and renewable energy system

High voltage and insulation technology

Optoelectronics

Process control

Mechatronics and robotics

Image-based modeling

Integrated Circuit and System Design

Application of computer and artificial intelligence in the power industry

Inspection and imaging system

Cryptography

Analog circuit and signal processing

Analog electronics

Nanoelectronic circuit

Embedded system

Blockchain

Artificial neural networks

Human-computer interaction

Software engineering

Equipment simulation and modeling

RF equipment and circuits

Bioinformatics

Real-time control

Data Mining

Digital electronics

Digital circuits and signal processing

Digital communications

Communication and wireless systems

Communication system security

Network communication theory and technology

Microelectronics

Text mining

Internet of Things

Advanced power semiconductors

Signal processing

Information and communications engineering

Remote sensing information acquisition and processing

Medical information detection methods and techniques

Predictive control

Source and channel encoding

Intelligent control system

Intelligent information processing

Natural language processing

3. Program

7th January---13:00-18:00---Registration

8th January---09:00-12:00---Speeches of Keynote Speakers

12:00-14:00---Lunch

14:00-17:30---Oral Presentations

18:00-19:30---Banquet

9th January---09:00-18:00---Academic Investigation

4. Participation Types:

Package A: Only Attendance

Package B: Abstract Submission + Oral Presentation

Package C: Abstract Submission + Poster Presentation

Package D: Full Paper Publication + Oral/Poster Presentation + Attendance

Note: If you need paper publication and presentation both, please submit full paper.

If you need to make presentation without publication, please submit abstract only.

Submission Methods:

If you choose Package D, please submit the full paper (word + pdf) to SUBMISSION SYSTEM

If you choose Package A, B or C, please register via REGISTRATION SYSTEM.

5. Registration Fee

Item---Registration fee (By RMB)---Registration fee (By US Dollar)

Package D: Full Paper Publication + Oral/Poster Presentation + Attendance---3200RMB/per paper (4-6 pages)---500 USD/per paper (4-6 pages)

Package D ≥ 3---2900RMB/per paper (4-6 pages)---450 USD/per paper (4-6 pages)

Extra Pages (Begin at Page 7)---300RMB/per extra page---50 USD/per extra page

Package A: Only Attendance---1200RMB/per person---200 USD/per person

Package A≥ 3---1000RMB/per person（≥ 3 people ）---180 USD/per person（≥ 3 people）

Package B: Abstract Submission + Oral Presentation---1500RMB/per person---250 USD/per person

Package C: Abstract Submission + Poster Presentation---1500RMB/per person---250 USD/per person

6.Publication

1. After a careful reviewing process, all accepted papers of ECIE 2022 will be published in Journal of Physics: Conference Series (ISSN: 1742-6588) and will be submitted to EI, Scopus for indexing.

2. The submitted papers must not be under consideration elsewhere.

3. Please submit the full paper, if presentation and publication are both needed.

4. Please send the full paper(word+pdf) to the 【SUBMISSION SYSTEM】

7.CONTACT US

Conference Secretary: Leah Li

E-mail: contactecie163.com

LinkedIn: https://www.linkedin.com/in/yang-leah-li-b9b6271b9/

Tel: +86-17737319063 (WeChat)

QQ: 978640953