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    MOC 2009 - 2009 15th Microoptics Conference (MOC 2009)

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    Website http://www.comemoc.com/ | Want to Edit it Edit Freely

    Category MOC 2009

    Deadline: June 20, 2009 | Date: October 25, 2009

    Venue/Country: Tokyo, Japan

    Updated: 2010-06-04 19:32:22 (GMT+9)

    Call For Papers - CFP

    First Call for Papers

    M C ¡¯09

    15th MICROOPTICS CONFERENCE

    http://www.comemoc.com/moc09/

    Sponsored by

    The Japan Society of Applied Physics

    Organized by

    Microoptics Group, Optical Society of Japan, JSAP MC

    Technical co-sponsorship by

    • IEEE/Lasers and Electro-Optics Society

    • Optical Society of America

    • Electronics Society, IEICE

    • The Chemical Society of Japan

    • The Society of Polymer Science, Japan

    • The Laser Society of Japan

    • Optoelectronic Industry and Technology Development Association

    • Japan Optoelectro-Mechanics Association

    • 130th Committee on Optoelectronics, JSPS

    (* Some sponsors are under negotiation.)

    Oct. 25 (Sun.)-Oct. 28 (Wed.), 2009

    Miraikan

    (National Museum of Emerging Science and Innovation)

    Odaiba, Tokyo, Japan

    Paper Deadline: June 8 (Mon.), 2009

    OBJECTIVE

    The 15th MICROOPTICS CONFERENCE (MOC '09) will be held at Miraikan (National Museum of Emerging Science and Innovation), Odaiba, Tokyo, Japan on October 25 - October 28, 2009. This conference is sponsored by the Japan Society of Applied Physics (JSAP) and organized by Microoptics Group, the Optical Society of Japan (OSJ), JSAP and in cooperation with several academic societies and associations.

    The MOC '09 is intended to provide a central forum for an update and review of scientific and technical information covering a wide range of microoptics field from fundamental researches to systems and applications.

    CATEGORY

    The category of the conference covers the following subjects of microoptics;

    1. Theory, Modeling and Design

    Aberrations, Dispersion, Beam optics, Guided-wave optics, Gradient-index optics, Diffractive optics, Photonic band, Slow light, Near-field optics, Nonlinear optics, Thermooptics, Plasmonics, Simulation and System design, etc.

    2. Materials and Fabrication

    Semiconductors, Crystals, Dielectric materials, Polymers, Liquid crystals, Nonlinear materials, Composite materials, Nano-materials, Metals, Spin-materials, etc.

    Diffusion and Ion exchange, Lithography and Etching, Thin film deposition, Micro- and Nano-fabrication, Nano-imprint, Laser fabrication, etc.

    3. Measurements

    Spectroscopy, Interferometry, Reflectometry, Femto-second measurement, 3D measurement, Quantum measurement, etc.

    4. Passive Devices

    Fibers, Waveguides, Multi/Demultiplexers, Add-drop multiplexers, Branching and mixing components, Photonic crystals, Filters, Microlenses, Diffractive optical elements, Isolators, Polarizers, etc.

    5. Dynamic and Functional Devices

    MEMS, Switches, Modulators, Tunable devices, Wavelength converters, Nonlinear optical devices, Deflectors, Optical buffers, etc.

    6. Active Devices

    Lasers, LEDs, VCSELs, Array lasers, Amplifiers, Terahertz devices, Sensors, etc.

    7. Integration and Packaging

    Monolithic and Hybrid integration, Mounting and packaging, Micro-assembly, Si photonics, 3D integration, etc.

    8. Conception for Applications

    High power, High speed, High efficiency, High field, High Density, High sensitivity, etc.

    APPLICATION FIELD

    The 15th MICROOPTICS CONFERENCE covers microoptics technologies in the following major topical fields;

    A. Optical Communications

    Photonic networks, Optical cross connects, LAN, VSR, SAN, FTTH, etc.

    B. Optical Interconnects

    Chip/Board/System, Data transfer, etc.

    C. Optical Storages

    Optical heads, Disks, Near-field recording, Holographic recording, Multi-layer recording, Super resolution, etc.

    D. Optoelectronic Equipment

    Printers, Image sensors, Digital cameras, Advanced microscopes, etc.

    E. Optical Sensing and Processing

    Optics for image recognition, Physical measurements, Sensors and sensing systems, Security systems, Optical computing, Bio- and Medical sensing, etc.

    F. Displays and Lighting

    LCD, PDP, FED, EL, Micromirror, Laser/LED displays, 3D displays, Solid state lighting, Illuminations, etc.

    G. New Applications

    Environmental and Energy optics, Bio- and Medical optics, Nano-photonics, Quantum systems, Next generation and Intelligent microoptics, Agricultural and Fishery optics, etc.

    SUBMISSION OF PAPERS

    Original papers that have not been previously presented and that describe new technical contributions to the areas covered by the technical descriptions in the aforementioned category will be accepted for presentation.

    A detailed instruction will be available from the following Web site.

    http://www.comemoc.com/moc09/

    Papers should be submitted electronically no later than June 8 (Mon.), 2009. Authors will be requested to submit 2-page paper written in English, including text, figures, tables, and references within a frame of 17 cm x 24 cm. The paper template will be available through the Web site.

    POSTER SESSION

    In addition to regular oral presentation sessions, poster presentation session will be planned to stimulate detailed explanation and discussion. The author(s) of papers will be informed of the size of bulletin board for displaying summary, figures, tables, etc., when selected as poster papers.

    POST DEADLINE PAPERS

    A limited number of post deadline papers will be accepted for presentation at post deadline sessions. Latest significant results obtained after the regular deadline are most welcome.

    PAPER AWARDS

    Some excellent contributed papers will be awarded at the award ceremony. .

    IMPORTANT PROGRAMS

    Tutorial workshop will be held on Oct. 25 (Sun.).

    A special session is planned on Oct. 26 (Mon.).

    OFFICIAL LANGUAGE

    The official language of MOC '09 is English.

    LOCATION OF CONFERENCE SITE

    The MOC¡¯09 will take place at Miraikan (National Museum of Emerging Science and Innovation), Odaiba, Tokyo, Japan. Odaiba is located in the Tokyo bay area and it takes 80 min. from the Narita international airport.

    Miraikan 2-41, Aomi, Koto-ku, Tokyo, 135-0064 Japan

    http://www.miraikan.jst.go.jp/index_e.html

    ACCESS MAP

    - Yurikamome Line

    5-minute walk from "Fune-no-kagakukan station" 4-minute walk from "Telecom Center station"

    - Rinkai Line:

    15-minute walk from "Tokyo Teleport station"

    - Tokyo Metropolitan (Toei) Bus

    1-minute walk from ¡°Nippon Kagaku Miraikan Mae¡±

    FURTHER INFORMATION

    The final call for papers will be issued in March 2009. The latest information on the conference will be also presented on the Web site.

    http://www.comemoc.com/moc09/

    MOC ¡¯09 COMMITTEE MEMBERS

    ORGANIZING COMMITTEE

    PROGRAM COMMITTEE

    Conference Co-chairs

    Co-chairs

    Y. Koike (Keio Univ.)

    T. Miyamoto (Tokyo Inst. Tech.)

    N. Mori (Konica Minolta Opto, Inc.)

    H. Shoji (Eudyna Devices Inc.)

    Members

    Domestic Members*

    E. Akutsu (Fuji Xerox Co., Ltd.)

    H. Fuji (Sharp Corp.)

    N. Arai (Konica Minolta Opto, Inc.)

    K. Goto (Tokai Univ.)

    Y. Fujii (Nihon Univ.)

    G. Hatakoshi (Toshiba Corp.)

    T. Fukunaga (FUJIFILM Corp.)

    Y. Handa (Canon Inc.)

    H. Furuta (Fukuoka Univ.)

    K. Iga (Tokyo Inst. Tech.)

    M. Haruna (Osaka Univ.)

    T. Ishigure (Keio Univ.)

    N. Hori (TOPCON Corp.)

    R. Katayama (NEC Corp.)

    H. Hosokawa (OMRON Corp.)

    S. Kawai (Polytechnic Univ.)

    K. Hotate (Univ. Tokyo)

    S. Kittaka (Nippon Sheet Glass Co., Ltd.)

    A. Ibaraki (SANYO Electric Co., Ltd.)

    Y. Kokubun (Yokohama National Univ.)

    I. Ishibai (Fu-Tech. Co., Ltd.)

    W. Kubo (HOYA Corp.)

    K. Ishida (Chitose Inst. Sci. Tech.)

    K. Kuroda (Univ. Tokyo)

    H. Kanamori (Sumitomo Electric Ind., Ltd.)

    T. Mizumoto (Tokyo Inst. Tech.)

    M. Kawachi (NTT Electronics Corp.)

    H. Nakajima (Waseda Univ.)

    K. Kodate (Japan Women¡¯s Univ.)

    S. Nakatsuka (Hitachi Ltd.)

    S. Komatsu (Waseda Univ.)

    K. Ogawa (Japan Women¡¯s Univ.)

    S. Kubota (Univ. Tokyo)

    Y. Ogura (OMRON LASERFRONT INC.)

    K. Maru (Gunma Univ.)

    S. Ozawa (The Furukawa Electric Co., Ltd.)

    T. Nagaoka (Olympus Corp.)

    T. Sasagawa (Mitsubishi Electric Corp.)

    N. Nishida (Univ. Tokushima)

    T. Shibuya (Tokai Univ.)

    H. Nishihara (Univ. of the Air)

    O. Sugihara (Tohoku Univ.)

    K. Nishizawa (Polytechnic Univ.)

    T. Suhara (Osaka Univ.)

    Y. Okino (Kansai Univ.)

    K. Takahashi (Sumitomo Electric Ind., Ltd.)

    Y. Ono (Ritsumeikan Univ.)

    Y. Terada (Fujikura Ltd.)

    H. Sasaki (Oki Electric Industry Co., Ltd.)

    Y. Tsuchiya (SANYO Electric Co., Ltd.)

    Y. Sasaki (Nippon Sheet Glass Co., Ltd.)

    Y. Uenishi (NTT Corp.)

    K. Tada (Kanazawa Inst. Tech.)

    Y. Uozu (Mitsubishi Rayon Co., Ltd.)

    Y. Tamagawa (Mitsubishi Electric Corp.)

    T. Watanabe (NTT Corp.)

    J. Tokumitsu (Canon Inc.)

    S. Yamashita (Univ. Tokyo)

    S. Tsuji (Hitachi Ltd.)

    K. Yamamoto (Matsushita Elect. Ind. Co., Ltd.)

    H. Tsukamoto (Nikon Corp.)

    B. Yao (Hitachi Cable Ltd.)

    K. Ueyanagi (JST)

    K. Yokomori (Ricoh Co., Ltd.)

    S. Ura (Kyoto Inst. Tech.)

    A. Watabe (NTT-AT Corp.)

    *Domestic Members are also Organizing Committee Members.

    T. Watanabe (Fujikura Ltd.)

    M. Watanabe (AIST)

    Overseas Members

    I. Yamaguchi (Gunma Univ.)

    T. Yatagai (Utsunomiya Univ.)

    E. Acosta (Univ. Santiago de Compostela)

    S. Yoshida (Sharp Corp.)

    J. E. Batubara (Univ. Pelita Harapan)

    J. E. Bowers (UCSB)

    INTERNATIONAL ADVISORY COMMITTEE

    A. Braeuer (Fraunhofer IOF)

    P. S. Chung (City Univ. Hong Kong)

    S. Fleming (Univ. Sydney)

    A. K. Ghatak (Indian Inst. Tech., New Delhi)

    Y.-J. Kim (Yonsei Univ.)

    C. Gomez-Reino (Univ. Santiago de Compostela)

    N.-C. Park (Yonsei Univ.)

    M. Kawazu (Nanosystem Solutions. Co. Ltd.)

    H. K. Shin (Optics Co., Ltd.)

    G. D. Khoe (Eindhoven Univ. Tech.)

    M. Skorobogatiy (Ecole Polytechnique de Montreal)

    B. Y. Kim (KAIST)

    C. G. Someda (Univ. Padova)

    P. Lagasse (Univ. Gent)

    M. Taghizadeh (OSA, Heriot Watt Univ.)

    Y.-P. Park (Yonsei Univ.)

    D. N. Payne (Univ. Southampton)

    G. C. Righini (DMD-CNR)

    W. J. Stewart (FREng, FinstP)

    Y. Suematsu (National Inst. Info.)

    C. S. Tsai (UC Irvine)

    T. Uchida (Tokai Univ.)

    W. B. Veldkamp (MIT Lincoln Lab.)

    (Some members are under negotiation.)

    Miraikan

    The National Museum of Emerging Science and Innovation (Miraikan) is a new type of science museum that links people directly with the new wisdom of the 21st century. At the heart of Miraikan¡¯s activities is the cutting-edge science and technology. This is the ¡°state-of-the-art knowledge and innovation¡± which Miraikan aims to share with the whole society as part of enriched human culture.

    Odaiba

    Odaiba is a large artificial island in Tokyo Bay, Japan, across the Rainbow Bridge from central Tokyo. It was initially built for defensive purposes in the 1800s, dramatically expanded during the late 20th century as a seaport district, and has developed since the 1990s as a major commercial, residential and leisure area.

    Daiba formally refers to one district of the island development in Minato Ward. The "Odaiba" name is commonly used to refer to the entire Tokyo Waterfront Secondary City Center (Tokyo Rinkai Fukutoshin) which includes the Ariake and Aomi districts of K¨?t¨? Ward and the Higashi-Yashio district of Shinagawa Ward.

    SSEC/NASA


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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