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    PRIMEASIA 2022 - The Asia Pacific Conference on Postgraduate Research in Microelectronics & Electronics (PrimeAsia 2022)

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    Website http://www.apccas2022.org/primeasia.html | Want to Edit it Edit Freely

    Category Microelectronics & Electronics

    Deadline: July 06, 2022 | Date: October 27, 2022-October 30, 2022

    Venue/Country: Shenzhen, China

    Updated: 2022-02-24 17:52:59 (GMT+9)

    Call For Papers - CFP

    ★Full name: The Asia Pacific Conference on Postgraduate Research in Microelectronics & Electronics (PrimeAsia 2022)--IEEE

    ★Abbreviation: PrimeAsia 2022

    ★Conference Date

    -Start Date: October 27, 2022

    -End Date: October 30, 2022

    ★Conference Location

    -Country: China

    -City: Shenzhen

    -Conference Venue: Hilton Shenzhen Shekou Hotel

    ★Website: http://www.apccas2022.org/primeasia.html

    ★Submission Link: http://www.easychair.org/conferences/?conf=primeasia2022

    ★About PrimeAsia 2022

    The Asia Pacific Conference on Postgraduate Research in Microelectronics & Electronics (PrimeAsia) is an initiative by the IEEE Circuits and Systems Society to provide opportunity for postgraduate students (Masters and Ph.D.) to present their research work and to interact with scientists and engineers in the research community and industry. This platform provides visibility to postgraduate students in the early stage of their career, benchmark postgraduate research in a friendly and cooperative environment and connect postgraduate students with academic/research institutions and the industry. Gold (Top 10%), Silver (10-20%) and Bronze (20-30%) Leaf Certificates will be awarded to the students based on the merit of technical contributions, paper and presentation quality.

    ★PrimeAsia 2022 Organization

    * Sponsored by

    Institute of Electrical and Electronics Engineers (IEEE)

    IEEE Circuits and Systems Society (CASS)

    ★Call for Papers

    The PrimeAsia is a major international forum established by the IEEE Circuits and Systems Society for researchers to exchange their latest findings in circuits and systems. It covers a wide range of topics including, but not limited to the following:

    - Analog and Mixed Signal Circuits and Systems

    - Digital Circuits and Systems

    - Communications Circuits and Systems

    - Sensory Circuits and Systems

    - Biomedical Circuits and Systems

    - Power and Energy Circuits and Systems

    - Artificial Intelligent Circuits and Systems

    - Internet of Things Circuits and Systems

    - Intelligent Security Circuits and Systems

    - Automotive Circuits and Systems

    - Digital Signal Processing

    - Signal Processing, Control and Communications

    - Nonlinearly Systems and Circuit Theory

    - Multimedia Systems and Applications

    - Imaging System and Technologies

    - Brain-Machine Interface Circuits and Systems

    - Nanoelectronics, Devices and System Integration

    - 5G and Beyond Technologies

    - Electronic Design Automation

    - Education in Circuits and Systems

    ★Organizing Committee

    * General Chair

    Xiaojin Zhao, Shenzhen University

    * Technical Program Committee Chair

    Yongfu Li, Shanghai Jiao Tong University

    * Local Arrangement Chair

    Wei Mao, Southern University of Science and Technology

    * Student Design Contest Co-chairs

    Chao Wang, Huazhong University of Science and Technology

    Jian Zhao, Shanghai Jiao Tong University

    ★Submission and Publication

    Papers submitted to PrimeAsia Conference will undergo a double-blind review process. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements.

    ★Special Event: Grand Challenge

    Participants shall express their interest to participate in this Grand Challenge by sending an email to the organizer Chao Wang (chao_wang_meathust.edu.cn).

    ★Contact Us

    Conference Secretary: Dawn Luo

    Phone Number: 13688349945

    Email Address: primeasia_2022at163.com


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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