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    ICMEA 2023 - 6th International Conference on Materials Engineering and Applications (ICMEA 2023)

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    Category Materials Engineering and Applications

    Deadline: August 30, 2022 | Date: January 13, 2023-January 15, 2023

    Venue/Country: Singapore, Singapore

    Updated: 2022-04-13 16:15:32 (GMT+9)

    Call For Papers - CFP

    The 6th International Conference on Materials Engineering and Applications (ICMEA 2023)

    Singapore & Online | January 13-15, 2023

    Publication and index

    Accepted papers with registration will be published into Materials Science Forum (ISSN: 0255-5476), which is indexed by EI Compendex and Scopus etc.

    Publication History

    ICMEA 2020: IOP Conference Series: Materials Science and Engineering Vol. 894 | Indexed by Scopus.

    ICMEA 2019: IOP Conference Series: Materials Science and Engineering Vol. 540 | Indexed by Ei Compendex, Scopus.

    ICMEA 2018: IOP Conference Series: Materials Science and Engineering Vol. 348 | Indexed by Ei Compendex, Scopus.

    More information, you can visit:


    1. Materials Science And Engineering, Materials Processing Technology

    Metallic Alloys, Tool Materials, Superplastic Materials, Ceramics and Glasses, Composites, Amorphous Materials, Nanomaterials,

    Biomaterials, Multifunctional Materials, Smart Materials, Engineering Polymers, Functional materials, Nuclear fuel materials, Biomaterals,

    sensors and surfaces, Thin Film Chalcogenide Photovoltaic Materials, Nuclear Materials IV, Magnetic Materials, Multi Functional Magnetic Materials,

    Superconducting Materials, Structured Materials, Spintronics Materials and Devices, Hard/Soft Magnetic Materials, Crosscutting materials

    2.Materials Properties, Measuring Methods And Applications

    Ductility, Crack Resistance, Fatigue, Creep-resistance, Fracture Mechanics, Mechanical Properties, Electrical Properties, and Magnetic Properties,

    Corrosion, Erosion, Wear Resistance, Non-Destructive Testing, Reliability Assessment, Toxicity, Working Properties of Materials and Products,

    Large Scale Applications, Electronics Applications.


    Prof. Jae-Jin Shim, Yeungnam University, South Korea

    Prof. Takashige Omatsu (Fellow of JSAP, OSA, SPIE), Chiba University, Japan

    Prof. Anja Pfennig, HTW-Berlin University of Applied Sciences, Germany

    For more information, please visit:

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    Ms. Violet Xie


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    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.