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    LCEEIS-26 2026 - 31st LISBON International Congress on Electrical, Electronics and Intelligent Systems (LCEEIS-26) Aug. 18-20, 2026 Lisbon (Portugal)

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    Website https://eaceee.erpub.org/conference/217 | Want to Edit it Edit Freely

    Category Electrical, Electronics and Intelligent Systems

    Deadline: August 01, 2026 | Date: August 18, 2026-August 20, 2026

    Venue/Country: Lisbon, Portugal

    Updated: 2026-03-07 16:14:34 (GMT+9)

    Call For Papers - CFP

    Call for papers/Topics

    Topics of Interest for Submission include, but are Not Limited to:

    1. Power Systems and Energy Technologies

    The "Independent" foundation of electrical engineering, focusing on the generation, transmission, and management of electricity.

    Smart Grid Infrastructure

    Microgrids and Distributed Energy Resources (DER)

    Vehicle-to-Grid (V2G) Integration

    Self-healing Grids and Fault Detection

    Renewable Energy Integration

    Advanced Photovoltaic Systems

    Wind Turbine Control and Optimization

    Hybrid Energy Systems (Solar-Wind-Hydro)

    Power Electronics

    Wide Bandgap Semiconductors (GaN and SiC)

    High-Efficiency Inverters and Converters

    Wireless Power Transfer (Inductive and Capacitive)

    Energy Storage

    Solid-State Battery Management Systems (BMS)

    Supercapacitors and Thermal Storage

    Grid-scale Battery Intelligence

    2. Electronics and Microelectronics

    The "Independent" physical hardware layer that powers all modern computing and communication.

    Semiconductor Engineering

    Heterogeneous Integration (Chiplets and Die-Stacking)

    Advanced Lithography and Nano-fabrication

    Flexible and Organic Electronics

    Integrated Circuits (IC) Design

    System-on-Chip (SoC) for Edge AI

    Mixed-Signal and Analog Circuit Design

    Radiation-Hardened Electronics for Space

    Optoelectronics and Photonics

    Silicon Photonics for Data Centers

    Laser Diode Technology

    Quantum Photonic Integrated Circuits

    Sensors and Actuators

    MEMS/NEMS (Micro/Nano-Electro-Mechanical Systems)

    Biosensors and Wearable Health Monitors

    Smart Actuators for Soft Robotics

    3. Intelligent Systems and Robotics

    The "Interrelated" intelligence layer that interprets data and executes autonomous actions.

    Artificial Intelligence and Machine Learning

    Deep Learning for Signal and Image Processing

    Reinforcement Learning for Industrial Control

    Neuromorphic Computing (Brain-inspired Hardware)

    Robotics and Autonomous Systems

    Embodied AI (Large Action Models)

    Collaborative Robots (Cobots) for Manufacturing

    Swarm Robotics and Multi-UAV Coordination

    Human-Machine Interaction (HMI)

    Brain-Computer Interfaces (BCI)

    Augmented Reality (AR) in Maintenance

    Gesture and Voice-Controlled Systems

    4. Communication and Networking

    The "Interrelated" connective tissue linking hardware to intelligent systems.

    Advanced Wireless Systems

    6G Research and Terahertz (THz) Communication

    Software-Defined Networking (SDN)

    Massive MIMO and Beamforming

    Internet of Things (IoT) and Industry 4.0

    Industrial IoT (IIoT) and Predictive Maintenance

    Edge Computing and Fog Networking

    Digital Twins of Electrical Infrastructure

    Quantum Information Systems

    Quantum Key Distribution (QKD) for Security

    Quantum Sensing and Metrology

    Entanglement-based Networking

    5. Interdisciplinary and Interrelated Domains

    Where all three fields merge to solve complex global challenges.

    Cyber-Physical Systems (CPS)

    Security for Critical Power Infrastructure

    Real-time Embedded Control Systems

    Hardware Security and Trusted Computing

    Sustainable and Green Technology

    Energy-Efficient AI (TinyML)

    Carbon-Neutral Electronics Manufacturing

    Electronic Waste Recycling and Circular Design

    Biomedical Engineering

    Neural Engineering and Neural Prosthetics

    Smart Medical Implants

    Telehealth Sensing Systems


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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