LCEEIS-26 2026 - 31st LISBON International Congress on Electrical, Electronics and Intelligent Systems (LCEEIS-26) Aug. 18-20, 2026 Lisbon (Portugal)
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Website https://eaceee.erpub.org/conference/217 |
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Category Electrical, Electronics and Intelligent Systems
Deadline: August 01, 2026 | Date: August 18, 2026-August 20, 2026
Venue/Country: Lisbon, Portugal
Updated: 2026-03-07 16:14:34 (GMT+9)
Call For Papers - CFP
Call for papers/TopicsTopics of Interest for Submission include, but are Not Limited to:1. Power Systems and Energy TechnologiesThe "Independent" foundation of electrical engineering, focusing on the generation, transmission, and management of electricity.Smart Grid InfrastructureMicrogrids and Distributed Energy Resources (DER)Vehicle-to-Grid (V2G) IntegrationSelf-healing Grids and Fault DetectionRenewable Energy IntegrationAdvanced Photovoltaic SystemsWind Turbine Control and OptimizationHybrid Energy Systems (Solar-Wind-Hydro)Power ElectronicsWide Bandgap Semiconductors (GaN and SiC)High-Efficiency Inverters and ConvertersWireless Power Transfer (Inductive and Capacitive)Energy StorageSolid-State Battery Management Systems (BMS)Supercapacitors and Thermal StorageGrid-scale Battery Intelligence2. Electronics and MicroelectronicsThe "Independent" physical hardware layer that powers all modern computing and communication.Semiconductor EngineeringHeterogeneous Integration (Chiplets and Die-Stacking)Advanced Lithography and Nano-fabricationFlexible and Organic ElectronicsIntegrated Circuits (IC) DesignSystem-on-Chip (SoC) for Edge AIMixed-Signal and Analog Circuit DesignRadiation-Hardened Electronics for SpaceOptoelectronics and PhotonicsSilicon Photonics for Data CentersLaser Diode TechnologyQuantum Photonic Integrated CircuitsSensors and ActuatorsMEMS/NEMS (Micro/Nano-Electro-Mechanical Systems)Biosensors and Wearable Health MonitorsSmart Actuators for Soft Robotics3. Intelligent Systems and RoboticsThe "Interrelated" intelligence layer that interprets data and executes autonomous actions.Artificial Intelligence and Machine LearningDeep Learning for Signal and Image ProcessingReinforcement Learning for Industrial ControlNeuromorphic Computing (Brain-inspired Hardware)Robotics and Autonomous SystemsEmbodied AI (Large Action Models)Collaborative Robots (Cobots) for ManufacturingSwarm Robotics and Multi-UAV CoordinationHuman-Machine Interaction (HMI)Brain-Computer Interfaces (BCI)Augmented Reality (AR) in MaintenanceGesture and Voice-Controlled Systems4. Communication and NetworkingThe "Interrelated" connective tissue linking hardware to intelligent systems.Advanced Wireless Systems6G Research and Terahertz (THz) CommunicationSoftware-Defined Networking (SDN)Massive MIMO and BeamformingInternet of Things (IoT) and Industry 4.0Industrial IoT (IIoT) and Predictive MaintenanceEdge Computing and Fog NetworkingDigital Twins of Electrical InfrastructureQuantum Information SystemsQuantum Key Distribution (QKD) for SecurityQuantum Sensing and MetrologyEntanglement-based Networking5. Interdisciplinary and Interrelated DomainsWhere all three fields merge to solve complex global challenges.Cyber-Physical Systems (CPS)Security for Critical Power InfrastructureReal-time Embedded Control SystemsHardware Security and Trusted ComputingSustainable and Green TechnologyEnergy-Efficient AI (TinyML)Carbon-Neutral Electronics ManufacturingElectronic Waste Recycling and Circular DesignBiomedical EngineeringNeural Engineering and Neural ProstheticsSmart Medical ImplantsTelehealth Sensing Systems
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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