SMARTGRIDCOMM 2012 - 2012 IEEE Third International Conference on Smart Grid Communications (SmartGridComm)
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Website www.ieee-smartgridcomm.org |
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Category SMARTGRIDCOMM 2012
Deadline: May 06, 2012 | Date: November 05, 2012-November 08, 2012
Venue/Country: Tainan, Taiwan
Updated: 2011-11-14 09:38:49 (GMT+9)
Call For Papers - CFP
Developing the Smart Grid has become an urgent global priority as its economic, environmental, and societal benefit will be enjoyed by generations to come. Information and communications technologies are at the core of the Smart Grid vision as they will empower today’s power grid with the capability of supporting two-way energy and information flow, isolating and restoring power outages more quickly, facilitating the integration of renewable energy sources into the grid and empowering the consumer with tools for optimizing their energy consumption.The IEEE International Conference on Smart Grid Communications (SmartGridComm) is centered on all communications aspects that are relevant to the Smart Grid and aims at bringing together researchers from Academia, Industry, and National Labs to exchange novel ideas, explore enabling technologies, analyze theoretical issues, discuss innovative designs, address open problems, and share field trial experiences and lessons learnt.The IEEE SmartGridComm Conference will be constituted of twelve Symposia. Each symposium will address a particular aspect of Smart Grid Communications. Prospective authors are invited to submit original contributions (standard two-column IEEE format and up to 6 pages) on all aspects of Smart Grid Communications to one of the following Symposia:Cyber and Physical Security and PrivacyInterconnections and Communications of Electric Vehicles and Smart GridsVirtual Power Plants, Distributed Generation, Microgrids, Renewables and StorageSmart Grid and Area Networks (HAN, IAN, BAN, FAN and NAN)Networking for Smart Grid (IETF, 6LoWPAN, ROLL, IPv4/IPv6, etc.)Wide-Area Monitoring and ControlArchitectures and Models for the Smart GridSmart/Virtual Metering, Demand Response, Dynamic PricingStandardization, Interoperability and CoexistenceThe whole picture: Sense, Communicate, Compute, ControlField trials, Deployments, and Lessons LearntRegulatory Issues and Their Impact on Communications AspectsCOMMITTEESORGANIZING COMMITTEE General Co-ChairsGeorge Arnold, NIST, USStefano Galli, Panasonic, USTPC Co-Chairs Fred Baker, Cisco, USHamid Gharavi, NIST, USSimon Haykin, McMaster University, CanadaConference Manager Gayle Weisman, IEEE ComSoc, USFinance ChairBruce Worthman, IEEE ComSoc, USMarketingHeather Ann Sweeney, IEEE ComSoc, USGraphic DesignMax Loskutnikov, IEEE ComSoc, USPublication and Web ChairHaobo Wang, Broadcom, USPublicity ChairAlex Gelman, NETovations Group, USSociety Relations ChairMerrily Hartmann, AT&T (Retired), USStudent Travel Grant ChairShri Goyal, College of Technology & Management, USSYMPOSIUM CHAIRSCyber/Physical Security and PrivacyWilliam T. Polk, NIST/IETF, USRuss Housley, Vigil Security, USDave McGrew, Cisco, USInterconnections and Communications of Electric Vehicles and Smart GridsRichard Scholer, Ford, USOnur Altintas, Toyota, JapanLe Yi Wang, Wayne State University, USVirtual Power Plants, Distributed Generation, Microgrids, Renewable and StorageMischa Schwartz, Columbia University, USReza Iravani, Manitoba University, CanadaFrede Blaabjerg, Aalborg University, DenmarkMohammad Shahidehpour, Illinois Institute of Technology, USSmart Grid and Area Networks (HAN, IAN, BAN, FAN and NAN)Himanshu Khurana, University of Illinois, Urbana-Champaign, USIdris A Rai, Makerere University, UgandaNada Golmie, NIST, USNetworking for Smart GridJean-Philippe Vasseur, Cisco, FranceDavid E. Culler, University of California, Berkeley, USAnjan Bose, Washington State University, USWide-Area Monitoring and ControlMladen Kezunovic, Texas A&M University, USJim S Thorp, Virginia Tech, USGerald Fitzpatrick, NIST, USArchitectures and Models for the Smart GridPeter W. Sauer, University of Illinois, Urbana-Champaign, USAnna Scaglione, University of California, Davis, USFelix F. Wu, Honk Kong University, ChinaSmart/Virtual Metering, Demand Response, Dynamic PricingTina Tsou, Huawei Technologies, ChinaYoshizumi Serizawa, Central Research Institute of Electric Power Industry, JapanArchan Misra, Telcordia Technologies, USStandardization, Interoperability and CoexistenceDavid Su, NIST, USWayne Longcore, Consumers Energy, USLutz Lampe, University of British Columbia, CanadaDick De Blasio, National Renewable Energy Laboratory, USThe Whole Picture: Sense, Communicate, Compute, ControlMark McGranaghan, EPRI, USGiuseppe Caire, University of Southern California, USPravin Varaiya, University of California, Berkeley, USNick Jenkins, Cardiff University, UKMardavij Roozbehani, MIT, USField Trials, Deployments, Lessons LearnedGary Stuebing, Duke Energy, USCharlie Arteaga, IBM, USSkip Ashton, Ember Corporation, USRalf Lehnert, Technical University of Dresden, GermanyRonnie Belmans, KU Louvain, BelgiumRegulatory Issues and Their Impact on Communications AspectsYi Qian, University of Nebraska, USJohn Boot, GE Energy, USJeffrey Z. Tao, Mitsubishi Labs, USTECHNICAL PROGRAM COMMITTEEJose Abad, Gigle Networks, SpainKaywan Afkhamie, Atheros, USBora Akyol, Pacific Northwest National Laboratory, USMohammod Ali, USC, USLuis Almeida, Univerdida de do Porto, PortugalMassoud Amin, University of Minnesota, USJeffrey Andrews, University of Texas, Austin, USFarooq Anjum, On-Ramp Wireless, USHiroshi Asano, CRIEPI, JapanSami Ayyorgun, Telcordia Technologies, USAgustin Badenes, DS2, SpainDavid Bakken, Washington State University, USTom Basso, NREL, USInigo,Berganza, Iberdrola SA, SpainRakesh Bobba, University of Illinois, Urbana-Champaign, USMichael Bourton, Grid2Home, USRaouf Boutaba, University of Waterloo, CanadaScott Bradner, Harvard University, USJohn Buford, Avaya Labs Research, USGerd Bumiller, iAd GmbH, GermanyEric Burger, Georgetown University, USFrancisco Cañete, Universidad de Malaga, SpainConstantine Caramanis, University of Texas, Austin, USMichael Caramanis, Boston University, USDave Cavalcanti, Philips Research, USLiuchen Chang, University of New Brunswick, CanadaDavid Chassin, Pacific Northwest National Laboratory, USMichael Chertkov, Los Alamos National Laboratory, USMarco Chiani, University of Bologna, ItalyHoward Choe, Raytheon, USKaushik Chowdhury, Northeastern University, USPeter Corcoran, National University of Ireland, Galway, IrelandRobert Cragie, Gridmerge, UKSubir Das, Telcordia Technologies, USChris Dent, Durham University, UKMichael Devetsikiotis, North Carolina State University, USIan Dobson, University of Wisconsin-Madison, USMischa Dohler, CTTC, SpainKlaus Dostert, University of Karlsruhe, GermanyVenizelos Efthymiou, Electricity Authority of Cyprus, CyprusJanaka Ekanayake, Cardiff University, UKNicola Elia, Iowa State University, USMostafa El-Said, Grand Valley State University, USTomaso Erseghe, University of Padova, ItalyMehdi Ferdowsi, Missouri University of Science and Technology, USCecilia Galarza, University of Buenos Aires, ArgentinaBrian Gaucher, IBM, USGeorgios B. Giannakis, University of Minnesota, USAngelantonio Gnazzo, Telecom Italia, ItalyManimaran Govindarasu, Iowa State University, USFabrizio Granelli, University of Trento, ItalyGordon Gregg, Aclara, USEdmund Handschin, University of Technology, Dortmund, GermanyGareth Harrison, University of Edinburgh, UKPavithra Harsha, MIT, USMikio Hasegawa, Tokyo University of Science, JapanToru Hattori, CRIEPI, JapanCarl Hauser, Washington State University, USHaibo He, University of Rhode Island, USRobert Heath, University of Texas, Austin, USDavid, Holmberg, NIST, USChoong Seon Hong, Kyung Hee University, KoreaJames Hong, POSTECH, KoreaHalid Hrasnica, Eurescom, GermanyMarija Ilic, Carnegie Mellon University, USSalvador Iranzo, DS2, SpainNihar Jindal, University of Minnesota, USJayant Kalagnanam, IBM Research, USMasaaki Katayama, Nagoya University, JapanKiseon Kim, GIST - Gwangju, KoreaJoon Bae Kim, Lantiq, USTero Kivinen, AuthenTec, FinlandStanley Klein, IEEE-USA, USMark Klerer, Qualcomm, USYoung-Chai Ko, Korea University, KoreaRajeev Koodli, Cisco Systems, USTetsu Koyama, Xingtera Inc., JapanJim LeClare, Maxim Integrated Products, USJae-Jo, Lee, Korea Electrotechnology Research Institute, KoreaClaudio Lima, Sonoma Innovation, USEugene Litvinov, ISO New England, USAngel Lozano, Universitat Pompeu Fabra, SpainFulcieri Maltini, FM Consultants Associates, FranceJay Manotas, Panasonic Automotive Systems, USMoacyr Martucci, Escola Politécnica da Universidade de São Paulo, BrazilGeorge Michailidis, University of Michigan, USBill Miller, Mac-CT USA, USJim Mollenkopf, CURRENT Group, USRaquel Morera, Telcordia Technologies, Inc., USStefan Mozar, University of Western Sydney, AustraliaPeter Mueller, IBM Zurich Research Laboratory, SwitzerlandRomano Napolitano, ISPLC and Regulatory Issues, ItalyBruce Nordman, Lawrence Berkeley National Laboratory, USFabienne Nouvel, INSA, FranceDragan Obradovic, Siemens, GermanyMasato Oguchi, Ochanomizu University, JapanVladimir Oksman, Lantiq Inc., USBarry O'Mahony, Intel Corporation, USJacob Østergaard, Technical University of Denmark, DenmarkTetsuo Otani, Central Research Institute of Electric Power Industry, JapanTenti Paolo, University of Padova, ItalyIoannis Papapanagiotou, North Carolina State University, USGhery Pettit, Intel Corporation, USAna Poida, Institute for Studies and Power Engineering, RomaniaKameshwar Poolla, University of California, Berkeley, USRobert Qiu, Tennessee Tech University, USJuergen Quittek, NEC Europe Ltd, GermanyKaveh Razazian, Maxim Integrated Products, USJim Reilly, Reilly Associates, USMoises Ribeiro, Federal University of Juiz de Fora, BrazilDavid Rieken, Aclara Power-Line Systems Inc., USVincent Roca, INRIA Rhone-Alpes, FranceCraig Rodine, Electric Power Research Institute, USSumit Roy, University of Washington, USZafer Sahinoglu, Mitsubishi Electric Research Laboratories, USHiroshi Shigeno, Keio University, JapanMik, St. Johns, Nth Permutation Security, USGrzegorz Swirszcz, IBM T.J. Watson Research, USZhibin Tan, Wayne State University, USSekhar Tatikonda, Yale University, USDon Tench, IESO, CanadaDaniel Thanos, General Electric, USKevin Tomsovic, University of Tennessee, USAndrea Tonello, University of Udine, ItalyLang Tong, Cornell University, USAlbert Treytl, Austrian Academy of Sciences, AustriaDaniela Tuninetti, University of Illinois, Chicago, USSerdar Uckun, PARC, USHan Vinck, University of Duisburg-Essen, GermanyJeffrey Voas, NIST, USJianfeng Wang, Philips Research, USVincent Wong, University of British Columbia, CanadaAndrew Wright, N-Dimension Solutions, USPeili Xu, Huawei Technologies, ChinaAkihisa Yokoyama, Toyota InfoTechnology Center, JapanAbraham Young, Huawei Technologies, ChinaMichele Zorzi, University of Padova, ItalyKeywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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