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    ICPMC 2023 - [EI+Scopus Index]2023 International Conference on Physics, Materials and Computer (ICPMC2023)

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    Website http://www.icpmc2023.org | Want to Edit it Edit Freely

    Category Physics, Materials and Computer

    Deadline: November 19, 2023 | Date: December 22, 2023-December 23, 2023

    Venue/Country: Sanya, China, China

    Updated: 2023-11-06 11:01:01 (GMT+9)

    Call For Papers - CFP

    Welcome to ICPMC2023

    2023 International Conference on Physics, Materials and Computer (ICPMC2023) will be held in Sanya, China during December 22-23, 2023. This conference will provide a remarkable opportunity for the academic and industrial communities to address new challenges and share solutions, and discuss future research directions. Contributions are expected from academia, industry, and management agencies.

    ICPMC2023 welcomes author submission of papers concerning any branch of the Physics, Materials, Computer and their applications in education, and other subjects. The subjects covered by ICPMC2023 include Advances in Instrumentation and Techniques Applications of Microscopy in the Physics, Materials, Computer and their applications. The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to ICPMC2023.

    Publication

    After double-blind reviewing, accepted and registered papers will be published in ICPMC2023 Proceedings (Open Access), which will be submitted to Ei Compendex, Inspec, Scopus, Conference Proceedings Citation Index–Science (CPCI-S) (Thomson Reuters, Web of Science), Google Scholar, and CNKI Scholar for indexing. Excellent papers will be published on EI and SCI journals.

    Call for Papers

    ICPMC2023 solicits original high-quality contributions in all areas of Physics, Materials and Computers. The topic of the paper submitted to this conference is included but not limited to:

    Physics

    Physics

    Classical Continuum Physics

    Theoretical, Mathematical

    Computational Physics

    Particle and Nuclear Physics

    Physical Chemistry

    Atomic, Molecular, Optical & Plasma Physics

    Applied & Technical Physics

    Quantum Physics

    Biophysics & Biological Physics

    Nanoscale physics

    Nanoscience and Nanotechnology

    Nanoscience and Nanobiotechnology

    Astrophysics and Astroparticles

    Condensed Matter Physics

    Geophysics

    Medical Physics

    Methodological advances

    Non-equilibrium systems

    Statistical Physics & Dynamical Systems

    Extraterrestrial Physics, Space Sciences

    Environmental Engineering and Physics

    Physical & Information Science

    Mathematical Physics

    Fluid Dynamics

    Astrostatistics

    Statistical Mechanics

    Materials Science

    Materials

    Composite materials

    Micro/Nano materials

    Iron & Steel materials

    Ceramics materials

    Metal Alloy Material

    Polymer materials

    Optical / Electrical / Magnetic Materials

    Materials Physics and Chemistry

    Building Materials

    Energy Materials

    Environmental-Friendly Materials

    Biological Material

    Chemical Materials

    Thin Films materials

    Seismic materials

    Smart Materials and Intelligent Systems

    Hydrogen and Fuel Cells

    New Functional Materials

    Surface Engineering / Coatings Technology

    Process Modeling, Analysis and Simulation

    Material Processing

    Material Cutting

    Welding, Mechanical Connections, Fracture

    Computer Aided Design of Materials

    Materials Testing and Evaluation

    Microwave Processing of Materials

    Computer Engineering

    Computers

    Algorithms

    Artificial Intelligence

    Automated Software Engineering

    Bio-informatics

    Bioinformatics and Scientific Computing

    Biomedical Engineering

    Circuits and Systems

    Compilers and Interpreters

    Computational Intelligence

    Computer Animation

    Computer Architecture & VLSI

    Computer Architecture

    Embedded Systems

    Computer Based Education

    Computer Games

    Computer Graphics

    Virtual Reality

    Computer Graphics

    Multimedia

    Computer Modeling

    Computer Security

    Computer Simulation

    Computer Vision

    Computer-aided Design/Manufacturing

    Computing Ethics

    Computing Practices & Applications

    Paper Submission

    Authors are encouraged to submit full papers describing original, unpublished research results, not currently under review, addressing forefront research and development to ICPMC2023. All paper submissions to 2023 International Conference on Physics, Materials and Computer (ICPMC2023) should be written in English according to the template. Each paper will be peer reviewed by 2-3 experts and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. It takes 4-10 working days for the result coming out.

    ◇ Please Download the Paper Format: Paper Template

    ◇ Please Download the Submission Form: Submission Form

    ◇ Please send your Paper(s) and Submission Form to ICPMC2023 via email: icpmc2023at163.com or icpmc2023atsina.com, the email subject should be named "Submission+Name+Tel". Regular papers are allowed to 5 pages. Extra pages(exceed 5 pages) will incur additional charges.

    ◇ If you'd like to attend the conference without presentation and publication, you are suggested to register as the listener. Please contact with the conference secretary directly by email (icpmc2023at163.com) or phone (Tel: +86-15927561725).


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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